公开(公告)号：US20150026973A1

公开(公告)日：2015-01-29

申请号：US14334688

申请日：2014-07-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuto OGAWA ,  Takashi WATANABE ,  Junya SHIMAKAWA

IPC: H05K3/30

CPC classification number: H05K3/0052 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.

Abstract translation: 一种电子部件的制造方法，其特征在于，具有基板型端子和与所述基板型端子连接的装置的电子部件的制造方法，使得所述基板型端子包括基板主体，所述基板主体包括第一和第二延伸的长方形或大致矩形的第一主面 方向彼此垂直或基本垂直。 该装置设置在第一主表面上。 该方法包括使用第一支撑构件支撑待成为其中多个基板型端子以矩阵状排列的组件的基板，将由第一支撑构件支撑的基板切割成多个基板型端子， 以及将所述装置安装在通过切割获得的所述多个基板型端子中的每一个的所述基板主体的所述第一主表面上。

公开(公告)号：US20150096792A1

公开(公告)日：2015-04-09

申请号：US14568446

申请日：2014-12-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuto OGAWA ,  Isao KATO

IPC: H01G2/06 ,  H05K1/18 ,  H01G4/12 ,  H05K3/30 ,  H01G4/30

CPC classification number: H01G2/065 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611 ,  Y10T29/4913

Abstract: An electronic component unit includes a substrate including principal surfaces opposing each other and side surfaces between the principal surfaces, and components mounted on the principal surface of the substrate. The side surfaces include first side surfaces formed before the components are mounted and second side surfaces formed after the components are mounted. As viewed from a line normal to the principal surface of the substrate, distances between the first side surfaces and the components are different from distances between the second side surfaces and the components.

Abstract translation: 电子部件单元包括基板，该基板包括彼此相对的主表面和主表面之间的侧表面以及安装在基板的主表面上的部件。 侧表面包括在安装部件之前形成的第一侧表面和在部件安装之后形成的第二侧表面。 从垂直于基板的主表面的直线观察，第一侧表面和部件之间的距离与第二侧表面和部件之间的距离不同。

公开(公告)号：US20150026972A1

公开(公告)日：2015-01-29

申请号：US14332652

申请日：2014-07-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuto OGAWA ,  Takashi WATANABE ,  Junya SHIMAKAWA ,  Mitsuhide KATO

IPC: H05K3/30

CPC classification number: H05K3/0052 ,  H01G2/065 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.

Abstract translation: 一种电子部件的制造方法，其特征在于，具有基板型端子和与所述基板型端子连接的装置，所述基板型端子包括基板主体，所述基板主体具有彼此相对的第一和第二主要表面;以及电极，被配置为在所述第一 主要表面，其中所述装置设置在所述第一主表面上，包括在所述基板的所述第一和第二主表面中的一个的基板中形成凹槽，使得所述基板被划分为所述基板型端子，所述凹槽各自具有 深度小于基板的厚度，从与基板主体的主表面相反的另一主表面切割基板，使得凹槽在其厚度方向上穿过基板，并将该装置安装在每个第一主表面上 。