公开(公告)号：US20240260196A1

公开(公告)日：2024-08-01

申请号：US18565412

申请日：2022-06-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Scott Andrew PARISH ,  Takayuki TANGE

IPC: H05K1/18 ,  H01F27/24 ,  H05K3/30 ,  H05K3/40

CPC classification number: H05K1/182 ,  H01F27/24 ,  H05K3/30 ,  H05K3/4038

Abstract: A device includes an insulating substrate including a cavity and a magnetic core in the cavity. The insulating substrate includes a first opening and a second opening that connect the cavity to an exterior of the insulated substrate. The first opening and the second opening are provided on a same side of the magnetic core.

公开(公告)号：US20240055177A1

公开(公告)日：2024-02-15

申请号：US18232681

申请日：2023-08-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takayuki TANGE ,  Lee FRANCIS ,  Scott Andrew PARISH ,  Rohit SIDAPARA

IPC: H01F27/30 ,  H01F27/29 ,  H01F27/02

CPC classification number: H01F27/306 ,  H01F27/292 ,  H01F27/022 ,  H01L28/10

Abstract: A magnetic component includes a substrate or a lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above of the substrate or the lead frame; a block coil including a resin body that is located on or above the substrate or the lead frame and that extends over the magnetic core, a first terminal that is on or embedded in the resin body and that is connected to the primary conductive pattern, and a second terminal on or embedded in the resin body and that is connected to the secondary conductive pattern; and an insulating material covering the substrate or the lead frame, the magnetic core, and the block coil.

公开(公告)号：US20220278041A1

公开(公告)日：2022-09-01

申请号：US17640991

申请日：2020-10-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takayuki TANGE ,  Yoshimitsu USHIMI

IPC: H01L23/522 ,  H01L27/12 ,  H01L27/13 ,  H01L49/02

Abstract: A transformer includes a silicon substrate, a plurality of metal layers and a plurality of insulating layers laminated on the silicon substrate, a bottom winding of a metal contacting a first metal layer and a second metal layer of the plurality of metal layers, a first insulating layer on the bottom winding, a core on the first insulating layer, a second insulating layer on the core, a top winding of the metal that extends around the core and a portion of the second insulating layer, and a third insulating layer on the top winding. At least one of the top winding and the bottom winding is thicker than each of the plurality of metal layers.

公开(公告)号：US20210012950A1

公开(公告)日：2021-01-14

申请号：US16924240

申请日：2020-07-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Lee FRANCIS ,  William JARVIS ,  Takayuki TANGE

IPC: H01F27/28 ,  H01F27/24 ,  H01F27/02 ,  H01F41/02 ,  H01F41/04 ,  H01F41/064 ,  H01F41/12

Abstract: A magnetic-component module includes a substrate; a core on a first surface of the substrate; a spacer on the core; a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate; and an overmold material encapsulating the core, the spacer, and the wire bonds.

公开(公告)号：US20190037700A1

公开(公告)日：2019-01-31

申请号：US16143509

申请日：2018-09-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takayuki TANGE ,  Yasuhiro HIGASHIDE ,  Takeshi WAKE ,  Munetake MIYASHITA

IPC: H05K1/18 ,  H02M3/158 ,  H05K1/11

Abstract: A power supply module includes first and second outer surfaces that are adjacent to and perpendicular or substantially perpendicular to each other. The power supply module includes a substrate that includes a first surface and a side surface, electronic components mounted at least on the first surface, a first resin material provided on the first surface, and terminal electrodes exposed at least at the first outer surface. The first resin member seals the electronic components mounted on the first surface. In the substrate, the first surface is perpendicular or substantially perpendicular to the first outer surface, which extends at least across the side surface of the substrate and the first resin member. The area of the first outer surface is smaller than the area of the second outer surface.