公开(公告)号：US08432653B2

公开(公告)日：2013-04-30

申请号：US13153589

申请日：2011-06-06

申请人： Jun Adachi ,  Jun Urakawa ,  Takahiro Sumi ,  Takahiro Kitadume

发明人： Jun Adachi ,  Jun Urakawa ,  Takahiro Sumi ,  Takahiro Kitadume

IPC分类号： H01L29/00 ,  H02H9/00 ,  H02H7/20 ,  H02H1/00

CPC分类号： H01T4/12 ,  H01T1/20

摘要： An ESD protection device includes a ceramic multilayer substrate, at least one pair of discharge electrodes provided in the ceramic multilayer substrate and facing each other with a space formed therebetween, external electrodes provided on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode obtained by dispersing a metal material and a semiconductor material and being arranged in a region that connects the pair of discharge electrodes to each other.

摘要翻译： ESD保护装置包括陶瓷多层基板，至少一对放电电极，其设置在陶瓷多层基板中，并且彼此面对并形成有空间，外部电极设置在陶瓷多层基板的表面上，并与放电电极 。 ESD保护器件包括通过分散金属材料和半导体材料并且被布置在将一对放电电极彼此连接的区域中而获得的支撑电极。

公开(公告)号：US08238069B2

公开(公告)日：2012-08-07

申请号：US12846878

申请日：2010-07-30

申请人： Jun Adachi ,  Jun Urakawa ,  Takahiro Sumi ,  Takahiro Kitazume

发明人： Jun Adachi ,  Jun Urakawa ,  Takahiro Sumi ,  Takahiro Kitazume

IPC分类号： H02H1/00

CPC分类号： H01T1/20 ,  H01T4/10 ,  H01T4/12

摘要： An ESD protection device has a structure that allows ESD characteristics to be easily adjusted and stabilized. The ESD protection device includes a ceramic multilayer substrate, at least a pair of discharge electrodes located in the ceramic multilayer substrate and facing each other with a space disposed therebetween, and external electrodes located on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode disposed in a region that connects the pair of discharge electrodes. The supporting electrode is made of a conductive material coated with an inorganic material having no conductivity.

摘要翻译： ESD保护器件具有允许ESD特性容易调节和稳定的结构。 ESD保护装置包括：陶瓷多层基板，位于陶瓷多层基板中的至少一对放电电极，并且彼此面对，并且位于陶瓷多层基板的表面上并与该放电 电极。 ESD保护装置包括设置在连接该对放电电极的区域中的支撑电极。 支撑电极由涂覆有无导电性的无机材料的导电材料制成。

公开(公告)号：US07790271B2

公开(公告)日：2010-09-07

申请号：US12211119

申请日：2008-09-16

申请人： Jun Urakawa

发明人： Jun Urakawa

IPC分类号： B32B3/00

CPC分类号： H01B3/12 ,  B32B18/00 ,  C04B35/18 ,  C04B35/195 ,  C04B35/481 ,  C04B35/488 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3241 ,  C04B2235/3244 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/6025 ,  C04B2235/652 ,  C04B2235/765 ,  C04B2235/80 ,  C04B2235/96 ,  C04B2237/341 ,  C04B2237/348 ,  C04B2237/582 ,  C04B2237/704 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T428/24612 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/249988 ,  Y10T428/24999

摘要： A dielectric ceramic composition includes about 10% to about 40% by weight of BaO, about 20% to about 65% by weight of SiO2, about 6% to about 40% by weight of Al2O3, about 1% to about 15% by weight of B2O3, about 0.3% to about 3% by weight of Cr2O3, and about 1% to about 40% by weight of ZrO2. A multilayer ceramic substrate has a laminated structure including an inner layer portion and outer layer portions that have a smaller thermal expansion coefficient than that of the inner layer portion. The use of the dielectric ceramic composition for the outer layer portions enables the ceramic to be resistant to erosion caused by a plating liquid used for plating external conductive films, thus maintaining good adhesiveness between the external conductive films and the outer layer portions.

摘要翻译： 介电陶瓷组合物包括约10重量％至约40重量％的BaO，约20重量％至约65重量％的SiO 2，约6重量％至约40重量％的Al 2 O 3，约1重量％至约15重量％ 的B 2 O 3，约0.3％至约3％的Cr 2 O 3，和约1％至约40％的ZrO 2。 多层陶瓷基板具有包括具有比内层部分的热膨胀系数小的内层部分和外层部分的层压结构。 通过使用电介质陶瓷组合物作为外层部分，陶瓷能够抵抗由用于镀覆外部导电膜的电镀液引起的侵蚀，从而保持外部导电膜与外层部分之间良好的粘接性。

公开(公告)号：US20070080329A1

公开(公告)日：2007-04-12

申请号：US10576801

申请日：2004-11-10

申请人： Masato Nomiya ,  Jun Urakawa

发明人： Masato Nomiya ,  Jun Urakawa

IPC分类号： H01B1/12

CPC分类号： H01B1/16 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K3/4061 ,  Y10T428/24917 ,  H01L2924/00

摘要： An electrically conductive paste used for forming wiring conductors, such as via holes (15) disposed on a multilayer ceramic substrate (11), is provided, wherein the temperature range, in which sintering is effected in a firing step, can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a grass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers (12) included in the multilayer ceramic substrate (11) in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.

摘要翻译： 提供了用于形成布线导体的导电糊，例如设置在多层陶瓷基片（11）上的通孔（15），其中在烧结步骤中进行烧结的温度范围可被相对最佳地控制 。 导电糊包含金属粉末，草料和有机载体。 在烧成工序中包含在多层陶瓷基板（11）中的陶瓷层（12）的烧结温度下不烧结的无机成分配置在金属粉末的粒子表面。 玻璃料的软化点比上述烧结温度低150℃〜300℃。