利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

24 条记录 (耗时 0.019 秒)

    Electrically conductive paste and multilayer ceramic substrate
    1.
    发明授权
    Electrically conductive paste and multilayer ceramic substrate 有权
    导电胶和多层陶瓷基板

    公开(公告)号：US07569162B2

    公开(公告)日：2009-08-04

    申请号：US10576801

    申请日：2004-11-10

    申请人： Masato Nomiya ,  Jun Urakawa

    发明人： Masato Nomiya ,  Jun Urakawa

    IPC分类号： H01B1/02

    CPC分类号： H01B1/16 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K3/4061 ,  Y10T428/24917 ,  H01L2924/00

    摘要： An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range in which sintering is effected in a firing step can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a glass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers included in the multilayer ceramic substrate in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.

    摘要翻译： 提供了用于形成布线导体（例如设置在多层陶瓷基板上的通孔）的导电糊，其中可以相对最佳地控制在烧制步骤中进行烧结的温度范围。 导电糊包含金属粉末，玻璃料和有机载体。 在烧成工序中包含在多层陶瓷基板中的陶瓷层的烧结温度下不烧结的无机成分配置在金属粉末的粒子表面。 玻璃料的软化点比上述烧结温度低150℃〜300℃。

    ELECTRICALLY CONDUCTIVE PASTE AND MULTILAYER CERAMIC SUBSTRATE
    2.
    发明申请
    ELECTRICALLY CONDUCTIVE PASTE AND MULTILAYER CERAMIC SUBSTRATE 审中-公开
    电导电胶和多层陶瓷基板

    公开(公告)号：US20090272566A1

    公开(公告)日：2009-11-05

    申请号：US12501884

    申请日：2009-07-13

    申请人： Masato Nomiya ,  Jun Urakawa

    发明人： Masato Nomiya ,  Jun Urakawa

    IPC分类号： H05K1/09 ,  H01B1/22

    CPC分类号： H01B1/16 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K3/4061 ,  Y10T428/24917 ,  H01L2924/00

    摘要： An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range, in which sintering is effected in a firing step can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a glass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers (included in the multilayer ceramic substrate in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.

    摘要翻译： 提供了用于形成配线导体（例如设置在多层陶瓷基板上的通孔）的导电浆料，其中可以相对最佳地控制在烧制步骤中进行烧结的温度范围。 导电糊包含金属粉末，玻璃料和有机载体。 在能够烧结陶瓷层（烧成工序中包含在多层陶瓷基板中的烧结温度）下未烧结的无机成分配置在金属粉末的粒子表面上，玻璃料的软化点为150℃ 比上述烧结温度低300℃。

    Electrically conductive paste and multilayer ceramic substrate
    3.
    发明申请
    Electrically conductive paste and multilayer ceramic substrate 有权
    导电胶和多层陶瓷基板

    公开(公告)号：US20070080329A1

    公开(公告)日：2007-04-12

    申请号：US10576801

    申请日：2004-11-10

    申请人： Masato Nomiya ,  Jun Urakawa

    发明人： Masato Nomiya ,  Jun Urakawa

    IPC分类号： H01B1/12

    CPC分类号： H01B1/16 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K3/4061 ,  Y10T428/24917 ,  H01L2924/00

    摘要： An electrically conductive paste used for forming wiring conductors, such as via holes (15) disposed on a multilayer ceramic substrate (11), is provided, wherein the temperature range, in which sintering is effected in a firing step, can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a grass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers (12) included in the multilayer ceramic substrate (11) in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.

    摘要翻译： 提供了用于形成布线导体的导电糊，例如设置在多层陶瓷基片（11）上的通孔（15），其中在烧结步骤中进行烧结的温度范围可被相对最佳地控制 。 导电糊包含金属粉末，草料和有机载体。 在烧成工序中包含在多层陶瓷基板（11）中的陶瓷层（12）的烧结温度下不烧结的无机成分配置在金属粉末的粒子表面。 玻璃料的软化点比上述烧结温度低150℃〜300℃。

    ESD protection device and manufacturing method therefor
    4.
    发明授权
    ESD protection device and manufacturing method therefor 有权
    ESD保护装置及其制造方法

    公开(公告)号：US08421582B2

    公开(公告)日：2013-04-16

    申请号：US13407790

    申请日：2012-02-29

    申请人： Kumiko Hiehata ,  Takahiro Sumi ,  Jun Adachi ,  Jun Urakawa ,  Takayuki Tsukizawa

    发明人： Kumiko Hiehata ,  Takahiro Sumi ,  Jun Adachi ,  Jun Urakawa ,  Takayuki Tsukizawa

    IPC分类号： H01C7/10

    CPC分类号： H01T4/12 ,  H01C7/108 ,  H01C7/12 ,  H01L23/60 ,  H01L27/0288 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01T1/20 ,  H01T21/00 ,  H01L2924/00

    摘要： An ESD protection device includes opposed electrodes in a ceramic base material and a discharge auxiliary electrode in contact with each of the opposed electrodes which is arranged so as to provide a bridge from the opposed electrode on one side to the opposed electrode on the other side, the discharge auxiliary electrode includes metallic particles, semiconductor particles, and a vitreous material, and bonding is provided through the vitreous material between the metallic particles, between the semiconductor particles, and between the metallic particles and the semiconductor particles. The metallic particles have an average particle diameter X of about 1.0 μm or more, and the relationship between the thickness Y of the discharge auxiliary electrode and the average particle diameter X of the metallic particles satisfies about 0.5≦Y/X≦ about 3.

    摘要翻译： ESD保护装置包括陶瓷基材中的相对电极和与每个相对电极接触的放电辅助电极，其布置成提供从一侧的相对电极到另一侧的相对电极的桥， 放电辅助电极包括金属颗粒，半导体颗粒和玻璃质材料，并且通过金属颗粒之间，半导体颗粒之间以及金属颗粒和半导体颗粒之间的玻璃质材料提供接合。 金属颗粒的平均粒径X为约1.0μm以上，放电辅助电极的厚度Y与金属粒子的平均粒径X之间的关系为约0.5＆lt; 1lE; Y / X＆ 约3。

    ESD protection device
    6.
    发明授权
    ESD protection device 有权
    ESD保护装置

    公开(公告)号：US07633735B2

    公开(公告)日：2009-12-15

    申请号：US12274391

    申请日：2008-11-20

    申请人： Jun Urakawa

    发明人： Jun Urakawa

    IPC分类号： H02H9/00

    CPC分类号： H01T4/12

    摘要： An ESD protection device includes a ceramic multilayer board, a cavity disposed in the ceramic multilayer board, at least one pair of discharge electrodes having ends, edges of the ends being opposed to each other at a predetermined distance in the cavity, and external electrodes disposed on outer surfaces the ceramic multilayer board and connected to the discharge electrodes. The ceramic multilayer board includes a composite portion, which is disposed in the vicinity of the surface on which the discharge electrodes are disposed and is at least disposed adjacent to the opposed ends of the discharge electrodes and to a space between the opposed ends. The composite portion includes a metal material and a ceramic material.

    摘要翻译： ESD保护装置包括陶瓷多层板，设置在陶瓷多层板中的空腔，至少一对放电电极具有端部，端部的边缘在空腔中以预定距离彼此相对，并且设置的外部电极 在陶瓷多层板的外表面上并连接到放电电极。 陶瓷多层基板包括复合部，该复合部配置在配置有放电电极的表面附近，并且至少配置成与放电电极的相对端相邻并且位于相对端之间的空间。 复合部分包括金属材料和陶瓷材料。