-
21.发明申请Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method 有权修整抛光垫的方法和装置，轮廓测量方法，基底抛光装置和基底抛光方法公开(公告)号：US20090137190A1
公开(公告)日：2009-05-28
申请号：US12292685
申请日：2008-11-24
申请人： Tetsuji Togawa , Keisuke Namiki , Satoru Yamaki
发明人： Tetsuji Togawa , Keisuke Namiki , Satoru Yamaki
CPC分类号： B24B53/017 , B24B37/013 , B24B49/10 , B24B49/16
摘要： The present invention provides a dressing method of dressing a polishing pad used in a polishing apparatus for polishing a substrate. This method includes repetitively moving the dresser on an upper surface of the polishing pad in a radial direction of the polishing pad so as to perform a dressing process on the polishing pad, during the dressing process, measuring a height of an upper surface of the polishing pad at a predetermined point in one of plural zones on the polishing surface, and repeating the repetitive moving of the dresser and the measuring of the height of the upper surface of the polishing pad so as to measure the height of the upper surface of the polishing pad in all of the plural zones.
摘要翻译： 本发明提供了一种修整抛光装置中用于抛光基板的抛光垫的修整方法。 该方法包括在抛光垫的径向上重复地将修整器沿抛光垫的径向重复地移动到抛光垫的上表面上，以便在修整过程中对抛光垫进行修整处理，测量抛光上表面的高度 在抛光表面上的多个区域中的一个区域中的预定点处的垫，并且重复修整器的重复移动和测量抛光垫的上表面的高度，以便测量抛光上表面的高度 在所有多个区域中的垫。
-
公开(公告)号：US20080299880A1
公开(公告)日：2008-12-04
申请号：US12136424
申请日：2008-06-10
IPC分类号： B24B41/06
摘要： A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
摘要翻译： 基板保持装置具有基板保持体，基板保持面朝向研磨面，并且将基板保持在基板保持侧，并且保持环固定地固定到基板保持体。 保持环被布置成围绕由基板保持器主体保持的基板的外周，使得当基板的抛光实现时，保持环与基板的径向外侧的抛光表面接合。 衬底保持器主体设置有具有内表面和外表面的膜。 内表面与衬底保持器主体的表面配合以限定施加流体压力的流体压力室。 外表面与由基板保持体保持的基板接合。
-
公开(公告)号：US20080066862A1
公开(公告)日：2008-03-20
申请号：US11979019
申请日：2007-10-30
IPC分类号： C23F1/00
摘要： A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
摘要翻译： 基板保持装置具有基板保持体，基板保持面朝向研磨面，并且将基板保持在基板保持侧，并且保持环固定地固定到基板保持体。 保持环被布置成围绕由基板保持器主体保持的基板的外周，使得当基板的抛光实现时，保持环与基板的径向外侧的抛光表面接合。 衬底保持器主体设置有具有内表面和外表面的膜。 内表面与衬底保持器主体的表面配合以限定施加流体压力的流体压力室。 外表面与由基板保持体保持的基板接合。
-
公开(公告)号：US20060234609A1
公开(公告)日：2006-10-19
申请号：US11452218
申请日：2006-06-14
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
-
公开(公告)号：US06890402B2
公开(公告)日：2005-05-10
申请号：US09917732
申请日：2001-07-31
IPC分类号： H01L21/304 , B24B37/30 , B24B37/32 , B24B37/04 , B24B41/06
摘要： A substrate holding apparatus comprises a substrate holder body having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
摘要翻译： 基板保持装置包括：基板保持体，其具有面向抛光表面的基板保持侧，并且将基板保持在基板保持侧;以及保持环，其固定地固定到基板保持体。 保持环被布置成围绕由基板保持器主体保持的基板的外周，使得当进行基板的抛光时，保持环与基板的径向外侧的抛光表面接合。 衬底保持器主体设置有具有内表面和外表面的膜。 内表面与衬底保持器主体的表面配合以限定施加流体压力的流体压力室。 外表面与由基板保持体保持的基板接合。
-
-
-
-
搜索结果
25 条记录 (耗时 0.037 秒)