公开(公告)号：US20160133802A1

公开(公告)日：2016-05-12

申请号：US14896950

申请日：2014-06-06

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Markus Richter ,  Markus Burger

IPC: H01L33/50

CPC classification number: H01L33/505 ,  B05D1/32 ,  B05D1/322 ,  B05D3/02 ,  H01L33/50 ,  H01L2933/0041

Abstract: A method of producing a conversion element includes providing a substrate having a surface; forming a first mask structure above the surface, wherein the first mask structure has first webs and first openings arranged between the first webs and the first openings form cavities in which the surface of the substrate is accessible; arranging a second mask structure above the first mask structure, wherein the second mask structure has second webs and second openings arranged between the second webs, the first webs are at least partly covered by the second webs, and the cavities remain at least partly accessible through the second openings; spraying a material into the cavities through the second openings; removing the second mask structure; and removing the first mask structure.

Abstract translation: 制造转换元件的方法包括提供具有表面的基板; 在所述表面上形成第一掩模结构，其中所述第一掩模结构具有第一腹板，并且布置在所述第一腹板和所述第一开口之间的第一开口形成空腔，所述基底的表面可接近; 在所述第一掩模结构之上布置第二掩模结构，其中所述第二掩模结构具有布置在所述第二网之间的第二腹板和第二开口，所述第一腹板至少部分地被所述第二腹板覆盖，并且所述腔保持至少部分地通过 第二个开口; 通过第二开口将材料喷射到空腔中; 去除第二掩模结构; 并移除第一掩模结构。

公开(公告)号：US20160056346A1

公开(公告)日：2016-02-25

申请号：US14888528

申请日：2014-04-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Richter

IPC: H01L33/50

CPC classification number: H01L33/50 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2924/00014

Abstract: A method of producing an optoelectronic component includes providing a substrate with an optoelectronic semiconductor chip arranged on a surface of the substrate; providing a mask having a lower layer and an upper layer, wherein the lower layer has a lower opening and the upper layer has an upper opening, which openings jointly form a continuous mask opening, and the lower opening has a larger area than the upper opening; arranging the mask above the surface of the substrate such that the lower layer faces the surface of the substrate and the mask opening is arranged above the optoelectronic semiconductor chip; spraying a layer onto the optoelectronic semiconductor chip through the mask opening; and removing the mask.

Abstract translation: 一种制造光电子部件的方法包括：提供衬底，该光电子半导体芯片布置在衬底的表面上; 提供具有下层和上层的掩模，其中所述下层具有下开口，并且所述上层具有上开口，所述开口共同形成连续掩模开口，并且所述下开口具有比所述上开口更大的面积 ; 将所述掩模布置在所述基板的表面上方，使得所述下层面向所述基板的表面，并且所述掩模开口布置在所述光电半导体芯片的上方; 通过掩模开口将光层喷射到光电子半导体芯片上; 并取下面罩。

公开(公告)号：US20150333235A1

公开(公告)日：2015-11-19

申请号：US14651306

申请日：2013-12-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Alexander Baumgartner ,  Markus Richter ,  Hans-Christoph Gallmeier ,  Tony Albrecht

IPC: H01L33/50 ,  H01L33/58

CPC classification number: H01L33/507 ,  H01L33/505 ,  H01L33/508 ,  H01L33/58

Abstract: The invention relates to an optoelectronic semiconductor element that emits mixed-color radiation when in operation. The optoelectronic semiconductor component comprises an optoelectronic semiconductor chip, a conversion element that has a curvature, and a spacer element that is arranged between the optoelectronic semiconductor chip and conversion element. The spacer has a curved surface that faces the conversion element, with the conversion element being in direct contact with the curved surface.

Abstract translation: 本发明涉及一种在操作时发出混合色辐射的光电子半导体元件。 光电子半导体部件包括光电半导体芯片，具有曲率的转换元件和布置在光电子半导体芯片和转换元件之间的间隔元件。 间隔物具有面向转换元件的曲面，转换元件与弯曲表面直接接触。