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    Leadframe, Optoelectronic Component having a Leadframe, and Method for Producing an Optoelectronic Component
    1.
    发明申请
    Leadframe, Optoelectronic Component having a Leadframe, and Method for Producing an Optoelectronic Component 审中-公开

    公开(公告)号：US20190259928A1

    公开(公告)日：2019-08-22

    申请号：US16344922

    申请日：2017-10-26

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tamas Lamfalusi ,  Markus Richter

    IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  H01L33/64

    Abstract: An optoelectronic component having a leadframe and a method for producing an optoelectronic component are disclosed. In an embodiment, an optoelectronic component includes a radiation-emitting semiconductor chip having a mounting surface and side surfaces, a leadframe comprising a first element having a first main extension plane, a second element having a second main extension plane, and a third element having a third main extension plane, wherein the main extension planes are arranged parallel to one another, and wherein the elements are arranged one above the other in a stacking direction; and a reflective casting compound forming a planar surface facing the mounting surface of the semiconductor chip, wherein the semiconductor chip is mounted with the mounting surface on a support surface of the third element, which is smaller than the mounting surface of the semiconductor chip, such that the semiconductor chip projects laterally beyond the support surface of the third element.

    Production of radiation-emitting semiconductor components
    2.
    发明授权
    Production of radiation-emitting semiconductor components 有权

    公开(公告)号：US11107956B2

    公开(公告)日：2021-08-31

    申请号：US16345287

    申请日：2017-11-02

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Ivar Tangring ,  Markus Richter

    IPC: H01L33/60 ,  H01L33/50 ,  H01L33/00 ,  H01L33/62 ,  H01L33/46

    Abstract: A method of producing radiation-emitting semiconductor components includes arranging radiation-emitting semiconductor chips on a conversion layer; thickening the conversion layer next to and between the semiconductor chips by applying a filling compound containing phosphor, wherein the thickened conversion layer adjoins a front side and side faces of the semiconductor chips; forming a reflective layer on the conversion layer and on the semiconductor chips in a region of a rear side of the semiconductor chips, wherein a rear-side surface of the contacts of the semiconductor chips remains uncovered; and severing the reflective layer and the conversion layer to form singulated semiconductor components including a single semiconductor chip, a part of the conversion layer arranged on the front side and on the side faces of the semiconductor chip, and a part of the reflective layer arranged in the region of the rear side on the semiconductor chip and on the conversion layer.

    METHOD OF PRODUCING OPTOELECTRONIC COMPONENTS AND OPTOELECTRONIC COMPONENT
    5.
    发明申请
    METHOD OF PRODUCING OPTOELECTRONIC COMPONENTS AND OPTOELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20190172979A1

    公开(公告)日：2019-06-06

    申请号：US16205412

    申请日：2018-11-30

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Markus Richter ,  Christian Gatzhammer

    IPC: H01L33/48 ,  H01L31/0203 ,  H01L31/18

    Abstract: A method of producing an optoelectronic component includes providing a carrier, generating a plurality of recesses in the carrier, applying a plurality of drops of a cover material to the carrier, introducing an optoelectronic semiconductor chip including a semiconductor body and contact elements on an underside of the semiconductor body into at least some of the drops, and curing the drops of the cover material into cover bodies, wherein at least some of the drops are completely surrounded by recesses in the carrier, and the recesses in the carrier are a stop edge for the cover material during introduction of the optoelectronic semiconductor chip.

    Method of producing a conversion element
    8.
    发明授权
    Method of producing a conversion element 有权

    公开(公告)号：US09773956B2

    公开(公告)日：2017-09-26

    申请号：US14896950

    申请日：2014-06-06

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Markus Richter ,  Markus Burger

    IPC: B05D1/32 ,  H01L33/50 ,  B05D3/02

    CPC classification number: H01L33/505 ,  B05D1/32 ,  B05D1/322 ,  B05D3/02 ,  H01L33/50 ,  H01L2933/0041

    Abstract: A method of producing a conversion element includes providing a substrate having a surface; forming a first mask structure above the surface, wherein the first mask structure has first webs and first openings arranged between the first webs and the first openings form cavities in which the surface of the substrate is accessible; arranging a second mask structure above the first mask structure, wherein the second mask structure has second webs and second openings arranged between the second webs, the first webs are at least partly covered by the second webs, and the cavities remain at least partly accessible through the second openings; spraying a material into the cavities through the second openings; removing the second mask structure; and removing the first mask structure.

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