公开(公告)号：US10121820B1

公开(公告)日：2018-11-06

申请号：US15655494

申请日：2017-07-20

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng Chen ,  Yuan-Wen Cheng ,  Chia-Yang Chang ,  Yi Qin ,  Wen-Jian Xia

IPC: A61B1/00 ,  H01L27/146 ,  A61B1/04

Abstract: A method of processing an image sensor system, comprising steps of placing a first cover member on top of an image sensor; coating the image sensor and the first cover member with a dark coating agent; removing the first cover member from the image sensor; placing a second cover member on top of the image sensor; affixing the image sensor on to a permanent mount to form an electrical coupling between the image sensor and the permanent mount; removing the second cover member from the image sensor; wherein the first cover member completely covers a top portion of the image sensor; and wherein the second cover member includes an internal rib configured to form a contact seal with the image sensor.

公开(公告)号：US20180076246A1

公开(公告)日：2018-03-15

申请号：US15261324

申请日：2016-09-09

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng Chen ,  Jau-Jan Deng ,  Chia-Yang Chang ,  Wei-Feng Lin

IPC: H01L27/146 ,  H04N5/359 ,  H04N5/247 ,  H04N5/374 ,  G02B3/00

CPC classification number: H01L27/14623 ,  G02B3/0056 ,  G02B3/0068 ,  G02B3/0075 ,  H01L27/14625 ,  H01L27/14643 ,  H01L27/14685 ,  H01L27/14689 ,  H04N13/239 ,  H04N13/243

Abstract: A cover-glass-free array camera with individually light-shielded cameras includes an image sensor array having a plurality of photosensitive pixel arrays formed in a silicon substrate, and a lens array bonded to the silicon substrate, wherein the lens array includes (a) a plurality of imaging objectives respectively registered to the photosensitive pixel arrays to form respective individual cameras therewith, and (b) a first opaque material between each of the imaging objectives to prevent crosstalk between individual cameras.

公开(公告)号：US20170294477A1

公开(公告)日：2017-10-12

申请号：US15091753

申请日：2016-04-06

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng Chen ,  Chia-Yang Chang ,  Yi Qin

IPC: H01L27/146

CPC classification number: H01L27/14685 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14643 ,  H01L27/14687

Abstract: A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.