公开(公告)号：US5760402A

公开(公告)日：1998-06-02

申请号：US660807

申请日：1996-06-07

申请人： Paul Hug ,  Horace N. Kemp ,  Chinh Quang Le

发明人： Paul Hug ,  Horace N. Kemp ,  Chinh Quang Le

IPC分类号： A61B6/03 ,  G01T1/164 ,  G01T1/166

CPC分类号： G01T1/1648 ,  A61B6/037

摘要： A dual-head gamma camera imaging system comprises a master ring gear and a slave ring rotatable about a longitudinal axis. The master ring gear is rotatably supported by a gantry. The slave ring is rotatably supported by the master ring gear and concentric with the master ring gear, such that the master ring gear and the slave ring can be rotated independently about s longitudinal axis. A first detector is supported by a first cantilever support member mounted to the master ring gear. A second detector head is supported by a second cantilever support member mounted to the slave ring. The angular displacement between the detector heads can be varied by providing relative rotation between the master ring gear and the slave ring. The rotation can be accomplished by using the weight of one of the detector heads to hold that detector head stationary while rotating the other detector head using a motor. The imaging system also includes a mechanism for rotating a detector head about an axis perpendicular to its imaging surface to increase the field of view along the longitudinal axis. The detector is mounted to an inner support ring which is rotatably coupled to and concentric with an outer support ring. The outer support ring is mounted to at least one ring gear.

摘要翻译： 双头伽马相机成像系统包括主环形齿轮和可围绕纵向轴线旋转的从动环。 主齿圈由机架可旋转地支撑。 从环由主环齿轮可旋转地支撑并与主环齿圈同心，使得主环齿轮和从环可以围绕纵轴独立地旋转。 第一检测器由安装到主环形齿轮的第一悬臂支撑构件支撑。 第二检测器头由安装到从环的第二悬臂支撑构件支撑。 检测器头之间的角位移可以通过提供主环齿轮和从环之间的相对旋转来改变。 旋转可以通过使用其中一个检测器头的重量来实现，以使用电动机旋转另一个检测器头来保持该检测器头静止。 成像系统还包括用于围绕垂直于其成像表面的轴旋转检测器头的机构，以增加沿着纵轴的视场。 检测器安装到内部支撑环，该内部支撑环可旋转地联接到外部支撑环并与其同心。 外支撑环安装在至少一个环形齿轮上。

公开(公告)号：US4855980A

公开(公告)日：1989-08-08

申请号：US133008

申请日：1987-12-15

申请人： Paul Hug ,  Bill Umeda ,  Paul A. Yesnosky ,  Bart Raudebaugh ,  Gary Ricco ,  Gary E. McCabe

发明人： Paul Hug ,  Bill Umeda ,  Paul A. Yesnosky ,  Bart Raudebaugh ,  Gary Ricco ,  Gary E. McCabe

IPC分类号： G11B17/28 ,  G11B17/22

CPC分类号： G11B17/221

摘要： A technique for storing and retrieving information containing discs utilizing a movable disc storage magazine is disclosed herein. The disc storage magazine, which is designed to store a plurality of information containing discs in individual compartments, is movable along a predetermined path which passes through a specific disc storage station such that each of the individual compartments is positionable within that station. At the same time, a disc drive for storing information on and retrieving information from the discs is located at a disc drive station spaced from the disc storage station. Means are provided for moving the disc storage magazine in a way which places a desired magazine compartment at the disc storage station and means are provided for transferring an information containing disc between that compartment and the disc drive station.

公开(公告)号：US4561584A

公开(公告)日：1985-12-31

申请号：US542828

申请日：1983-10-17

申请人： Paul Hug

发明人： Paul Hug

IPC分类号： B23K1/012 ,  H05K13/04 ,  B23K1/00 ,  B23K3/02

CPC分类号： B23K1/012 ,  H05K13/0486

摘要： An apparatus for removing lap soldered circuit packages from the module to which they are soldered is presented. The module is placed over the apparatus with the circuit package on the underneath side. A nozzle of the apparatus is raised so as to be centered below the circuit package, and a heated gas is directed over the lap soldered leads for a predetermined time. When the solder melts, gravity causes the circuit package to fall away from the module. The falling package is caught and held by the nozzle. The nozzle is then lowered away from the module, and as it is lowered, push rods protrude upwardly through the nozzle to support the circuit package and lift it out of the nozzle, thereby positioning the nozzle for easy and safe handling.

摘要翻译： 提出了一种用于从其被焊接到的模块中去除搭接焊接电路封装的装置。 该模块放置在设备上，电路封装在下侧。 设备的喷嘴被升高以便在电路封装之下居中，并且加热的气体被引导到膝盖焊接引线上一段预定的时间。 当焊料熔化时，重力会导致电路组件脱离模块。 下降的包装被喷嘴抓住并保持。 然后将喷嘴从模块放下，并且当其降低时，推杆向上突出通过喷嘴以支撑电路封装并将其从喷嘴中提出，从而定位喷嘴以便于和安全的处理。

公开(公告)号：US4479298A

公开(公告)日：1984-10-30

申请号：US517481

申请日：1983-07-26

申请人： Paul Hug

发明人： Paul Hug

IPC分类号： H05K3/30 ,  H05K13/00 ,  H05K13/04 ,  H01L21/60

CPC分类号： H05K13/0439 ,  H05K13/0015 ,  H05K3/303 ,  H05K2201/10689 ,  H05K2203/0195 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/49133 ,  Y10T29/53261

摘要： An apparatus for aligning the leads of an integrated circuit (IC) package with respect to the pads of the printed circuit board to which they will be bonded is presented. An alignment fixture, comprising a coarse alignment pedestal mounted on a fine alignment block, receives the IC package on the alignment fixture and aligns the leads with respect to a reference coordinate system of the alignment fixture. A vacuum chuck is lowered to contact the aligned package, and is then raised to lift the aligned package off the fine alignment block while holding it in the aligned position. An X-Y table positions the printed circuit board under the aligned package. The vacuum chuck lowers the aligned package until the leads contact the pads, and holds it while the leads are bonded to the pads.

摘要翻译： 提出了一种用于使集成电路（IC）封装的引线相对于它们将被结合到其上的印刷电路板的焊盘进行对准的装置。 对准夹具包括安装在精细对准块上的粗略对准基座，将对准夹具上的IC封装相对于对准夹具的基准坐标系对准引线。 真空吸盘被降低以接触对准的包装，然后升高以将对准的包装从精细对准块提起，同时将其保持在对准位置。 X-Y表将印刷电路板放置在对齐的包装下。 真空吸盘降低对准的包装直到引线接触焊盘，并且当引线接合到焊盘时保持它。