摘要:
A non-volatile memory (NVM) cell structure comprises an NMOS control transistor having source, drain and bulk region electrodes that are commonly-connected to receive a control voltage and a gate electrode that is connected to a data storage node; a PMOS erase transistor having source, drain and bulk region electrodes that are commonly-connected to receive an erase voltage and a gate electrode that is connected to the data storage node; and an NMOS data transistor having source, drain and bulk region electrodes and a gate electrode connected to the data storage node.
摘要:
A 4-transistor non-volatile memory (NVM) cell includes a static random access memory (SRAM) cell structure. The NVM cell utilizes a reverse Fowler-Nordheim tunneling programming technique that, in combination with the SRAM cell structure, allows an entire array to be programmed at one cycle. Equalize transistors are utilized to obtain more uniform voltage on the floating gates after an erase operation. Utilization of decoupling pas gates during a read operation results in more charge difference on floating gates of programmed and erased cells.
摘要:
In a ROM structure, power consumption is reduced by providing for pre-discharging of only the bit line corresponding to the memory location that is being read. Column select lines are coupled to logic to switch in a pre-discharging circuit prior to reading, and to disconnect, from the pre-discharging circuit during reading, only the bit line corresponding to the memory location being read.
摘要:
A ROM system which provides for reduced size and power consumption. This ROM systems allows for inverting the programming and sensing of information in bit cells of the ROM to reduce the number of transistors in bit cells of the ROM. Further bit cells of the ROM provide that a first type of information is stored in the bit cell when a transistor is disposed between a bit line and a word line, and a second type of information is stored in the cell when no transistor is disposed between the bit line and the word line. In the bit cell a contact between a bit line and a region where a transistor drain can be formed in a substrate is provided in those instances when a transistor is formed between the bit line and a word line. In those instances when a bit cell provides no transistors between the word line and the bit line, no contact is provided between the bit line and the region where a transistor drain can be formed.
摘要:
The supply voltage of a memory system is adjusted in response to changes in the frequency of the clock signal. The memory system measures a time from when data becomes valid on the output of a memory to the next clock edge to determine a timing value. When the clock frequency changes from a first frequency to a second frequency, the timing value changes from a first value to a second value. The magnitude of the supply voltage is changed to return the timing value to the first value.
摘要:
An integrated fuse element is capable of being programmed to high resistance in low voltage process technology. The fuse includes a stack of an undoped polysilicon layer and a silicide layer. A voltage applied across the stack is increases until a first agglomeration event occurs, whereby a discontinuity is formed in the silicide layer. The current is further increased to cause a second agglomeration event whereby the size of the discontinuity is increased. Each agglomeration event increases the resistance of the fuse. An extended-drain MOS transistor, capable of sustaining high voltage, is connected in series with the fuse for programming the fuse. The transistor includes: a well region in a substrate, the well region forming the drain of the transistor; an insulating trench in the well; and a polysilicon gate extending over a portion of the substrate, a portion of the well and a portion of the trench, wherein upon reverse-biasing the junction between the well and the substrate a depletion region is formed which encompasses at least the entire portion of the surface region of the well over which the polysilicon extends.
摘要:
The silicon real estate consumed by a conventional Schottky diode is reduced in the present invention by forming the Schottky diode through a field oxide isolation region. Etching through the field oxide isolation region requires extra etch time which is provided by conventional etch steps that typically specify a 50-100% overetch during contact formation.
摘要:
A sense amplifier places a low positive voltage, such as 0.1 to 0.3 volts, on a bit line instead of ground when a memory cell is read by utilizing a current source circuit to output a reference current that biases a Schottky diode. The current source circuit is implemented with a Schottky diode that utilizes the reverse-biased leakage current of the diode to form the reference current. The current source circuit can also be implemented with a current mirror circuit.
摘要:
A reference current generator outputs a reference current which is insensitive to temperature variations by utilizing two gated diodes to output currents. The currents output by the gated diodes are divided to produce the reference current which, due to the cancellation of terms, is defined by the ratio of the gate areas of the gated diodes. In addition, by utilizing two oscillators, which run at different frequencies, to drive the gated diodes, the reference current may alternately be defined by the ratio of the two frequencies.
摘要:
A non-volatile memory (NVM) cell comprises an NMOS control transistor having commonly-connected source, drain and bulk region electrodes and a gate electrode connected to a storage node; a PMOS erase transistor having commonly-connected source, drain and bulk region electrodes and a gate electrode connected to the storage node; an NMOS data transistor having source, drain and bulk region electrodes and a gate electrode connected to the storage node, the bulk region electrode being connected to a common bulk node; the first NMOS pass gate transistor having a source electrode connected to the drain electrode of the NMOS data transistor, a drain electrode, a bulk region electrode connected to the common bulk node, and a gate electrode; and a second NMOS pass gate transistor having a drain electrode connected to the source electrode of the NMOS data transistor, a source electrode, a bulk region electrode connected to the common bulk node, and a gate electrode.