摘要:
A non-volatile memory (NVM) cell splits its basic function, i.e. program, erase, read and control, among a four PMOS transistor structure, allowing independent optimization of each function. The cell structure also includes an embedded static random access memory (SRAM) cell that utilizes a latch structure to preprogram data to be written to the cell. The programming method for the cell utilizes a reverse Fowler-Nordheim tunneling mechanism with a very small programming current, allowing an entire NVM array to be programmed at one cycle.
摘要:
The supply voltage of a memory system is adjusted in response to changes in the frequency of the clock signal. The memory system measures a time from when data becomes valid on the output of a memory to the next clock edge to determine a timing value. When the clock frequency changes from a first frequency to a second frequency, the timing value changes from a first value to a second value. The magnitude of the supply voltage is changed to return the timing value to the first value.
摘要:
A method of selectively programming nonvolatile memory cells in which multiple programming voltages are used to obtain the desired voltage on the storage nodes of the cells selected for programming, while the storage nodes of unselected cells remain undisturbed.
摘要:
An integrated fuse element is capable of being programmed to high resistance in low voltage process technology. The fuse includes a stack of an undoped polysilicon layer and a silicide layer. A voltage applied across the stack is increases until a first agglomeration event occurs, whereby a discontinuity is formed in the silicide layer. The current is further increased to cause a second agglomeration event whereby the size of the discontinuity is increased. Each agglomeration event increases the resistance of the fuse. An extended-drain MOS transistor, capable of sustaining high voltage, is connected in series with the fuse for programming the fuse. The transistor includes: a well region in a substrate, the well region forming the drain of the transistor; an insulating trench in the well; and a polysilicon gate extending over a portion of the substrate, a portion of the well and a portion of the trench, wherein upon reverse-biasing the junction between the well and the substrate a depletion region is formed which encompasses at least the entire portion of the surface region of the well over which the polysilicon extends.
摘要:
The silicon real estate consumed by a conventional Schottky diode is reduced in the present invention by forming the Schottky diode through a field oxide isolation region. Etching through the field oxide isolation region requires extra etch time which is provided by conventional etch steps that typically specify a 50-100% overetch during contact formation.
摘要:
A sense amplifier places a low positive voltage, such as 0.1 to 0.3 volts, on a bit line instead of ground when a memory cell is read by utilizing a current source circuit to output a reference current that biases a Schottky diode. The current source circuit is implemented with a Schottky diode that utilizes the reverse-biased leakage current of the diode to form the reference current. The current source circuit can also be implemented with a current mirror circuit.
摘要:
A reference current generator outputs a reference current which is insensitive to temperature variations by utilizing two gated diodes to output currents. The currents output by the gated diodes are divided to produce the reference current which, due to the cancellation of terms, is defined by the ratio of the gate areas of the gated diodes. In addition, by utilizing two oscillators, which run at different frequencies, to drive the gated diodes, the reference current may alternately be defined by the ratio of the two frequencies.
摘要:
A non-volatile memory cell includes NMOS programming, read, erase, and control transistors having gate electrodes connected to a storage node. The erase and control transistors have interconnected source, drain, and bulk electrodes. The cell is programmed by setting source, drain, bulk, and gate electrodes of all transistors to a positive voltage. An inhibiting voltage is applied to source, drain, and bulk electrodes of the read transistor, while setting source and drain electrodes of the programming transistor to the positive voltage and the bulk electrode of the programming transistor to the positive voltage or the inhibiting voltage. Source, drain, and bulk electrodes of the control transistor are then ramped to a negative control voltage while ramping source, drain, and bulk electrodes of the erase transistor to a negative erase voltage and then back to the positive voltage. Source, drain. bulk, and gate electrodes of the programming, erase, and control transistors are then returned to the positive voltage, while setting the source, drain, and bulk electrodes of the read transistor to the inhibiting voltage.
摘要:
A non-volatile memory (NVM) cell comprises an NMOS control transistor having commonly-connected source, drain and bulk region electrodes and a gate electrode connected to a storage node; a PMOS erase transistor having commonly-connected source, drain and bulk region electrodes and a gate electrode connected to the storage node; an NMOS data transistor having source, drain and bulk region electrodes and a gate electrode connected to the storage node, the bulk region electrode being connected to a common bulk node; the first NMOS pass gate transistor having a source electrode connected to the drain electrode of the NMOS data transistor, a drain electrode, a bulk region electrode connected to the common bulk node, and a gate electrode; and a second NMOS pass gate transistor having a drain electrode connected to the source electrode of the NMOS data transistor, a source electrode, a bulk region electrode connected to the common bulk node, and a gate electrode.
摘要:
A non-volatile memory (NVM) cell structure comprises a PMOS program transistor having source, drain and bulk region electrodes and a gate electrode that is connected to a data storage node; an NMOS control transistor having source, drain and bulk region electrodes that are commonly-connected to receive a control voltage and a gate electrode that is connected to the data storage node; a PMOS erase transistor having source, drain and bulk region electrodes that are commonly-connected to receive an erase voltage and a gate electrode that is connected to the data storage node; and an NMOS read transistor having source, drain and bulk region electrodes and a gate electrode connected to the data storage node.