公开(公告)号：US20200314305A1

公开(公告)日：2020-10-01

申请号：US16521222

申请日：2019-07-24

Applicant: QUALCOMM Incorporated

Inventor： Russell GRUHLKE ,  Jon LASITER ,  Ravindra Vaman SHENOY ,  Ravishankar SIVALINGAM ,  Kebin LI ,  Khurshid Syed ALAM

IPC: H04N5/225 ,  H04N5/232

Abstract: Various aspects of the present disclosure generally relate to a sensor module. In some aspects, a sensor module may include a collar configured to be attached to a camera module for a user device. The collar may include a first opening that is configured to align with an aperture of a camera of the camera module, and a second opening. The sensor module may include a sensor embedded in the collar. The sensor may be aligned with the second opening of the collar. Numerous other aspects are provided.

公开(公告)号：US20180342788A1

公开(公告)日：2018-11-29

申请号：US15708084

申请日：2017-09-18

Applicant: QUALCOMM Incorporated

Inventor： Jon Bradley LASITER ,  Ravindra Vaman SHENOY ,  Donald William KIDWELL, JR. ,  Mohammad Ali TASSOUDJI ,  Mario Francisco VELEZ

IPC: H01Q1/22 ,  H01Q1/46 ,  H01L27/146 ,  H05K3/30 ,  H01Q21/00 ,  H01L21/02

Abstract: The disclosure relates to a glass-based antenna array package. In an aspect, such a glass-based antenna array package includes a single glass substrate layer, one or more antennas attached to a first side of the glass substrate layer, at least one semiconductor device attached to a second side of the glass substrate layer, and a first photoimageable dielectric layer adhered to the second side of the glass substrate layer and encapsulating the at least one semiconductor device. A method of manufacturing the same is also disclosed.

公开(公告)号：US20150311271A1

公开(公告)日：2015-10-29

申请号：US14451462

申请日：2014-08-05

Applicant: QUALCOMM Incorporated

Inventor： Mete ERTURK ,  Ravindra Vaman SHENOY ,  Kwan-yu LAI ,  Donald William KIDWELL, JR. ,  Jitae KIM ,  Jon Bradley LASITER

IPC: H01L49/02 ,  H01F27/24

CPC classification number: H01L28/10 ,  H01F17/0013 ,  H01F27/24 ,  H01F2017/004 ,  H01L23/5227 ,  H01L23/525 ,  H01L23/645 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/12105 ,  H01L2924/18162 ,  H01L2924/19042

Abstract: One or more high-inductance, high-quality factor (Q) three-dimensional inductors, for example, solenoid or toroid inductors with small form factors, are provided in an integrated circuit package, such as an integrated fanout package.

Abstract translation: 一个或多个高感度，高品质因子（Q）三维电感器，例如具有小形状因数的螺线管或环形电感器，被提供在集成电路封装中，例如集成扇出封装。