公开(公告)号：US20170062398A1

公开(公告)日：2017-03-02

申请号：US14843964

申请日：2015-09-02

Applicant: QUALCOMM Incorporated

Inventor： Karim ARABI ,  Ravindra Vaman SHENOY ,  Evgeni Petrovich GOUSEV ,  Mete ERTURK

IPC: H01L25/18 ,  H01L23/538 ,  H01L49/02 ,  H01L25/00 ,  H01L21/48

CPC classification number: H01L28/10 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/645 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/16267 ,  H01L2224/16268 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19042 ,  H01L2924/19103

Abstract: A voltage regulator having a coil inductor is integrated or embedded in a system-on-chip (SOC) device. The coil inductor is fabricated on an inductor wafer with through vias, and the inductor wafer is joined with an SOC wafer for integration with the SOC device.

Abstract translation: 具有线圈电感器的电压调节器集成或嵌入到片上系统（SOC）器件中。 线圈电感器制造在具有通孔的电感器晶片上，并且电感器晶片与SOC晶片连接以与SOC器件集成。

公开(公告)号：US20170086295A1

公开(公告)日：2017-03-23

申请号：US14859320

申请日：2015-09-20

Applicant: QUALCOMM Incorporated

Inventor： Mete ERTURK ,  Farsheed MAHMOUDI ,  James Thomas DOYLE ,  Ravindra Vaman SHENOY ,  Jitae KIM

IPC: H05K1/16 ,  H05K1/11 ,  H05K3/40 ,  H05K3/30

Abstract: An integrated circuit device, such as a system-on-a-chip (SOC) device that includes an integrated or embedded voltage regulator, comprises an integrated capacitor and an integrated inductor having a magnetic core that can be fabricated in the same process as the capacitive structure of the integrated capacitor.

公开(公告)号：US20160163443A1

公开(公告)日：2016-06-09

申请号：US14743623

申请日：2015-06-18

Applicant: QUALCOMM Incorporated

Inventor： Mete ERTURK ,  Ravindra Vaman SHENOY ,  Kwan-yu LAI ,  Jitae KIM ,  Donald William KIDWELL JR. ,  Jon Bradley LASITER ,  James Thomas DOYLE ,  Omar James BCHIR

IPC: H01F27/28 ,  H01F41/14 ,  H05K1/18 ,  H01F41/02 ,  H05K1/11 ,  H01F27/24 ,  H01F1/147

CPC classification number: H01F27/2804 ,  H01F1/14708 ,  H01F5/00 ,  H01F17/0033 ,  H01F27/24 ,  H01F41/02 ,  H01F41/046 ,  H01F41/14 ,  H01F2017/002 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K1/111 ,  H05K1/165 ,  H05K1/182 ,  H05K2201/10166 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.

Abstract translation: 电感器可以包括第一衬底，磁片和导体。 第一基板可以形成在第二基板内。 磁片可以连接到第一衬底的第一侧。 导体可以形成在第二基板内，第二基板上，或两者上。 导体可以具有输入和输出。 导体可以被配置为围绕第一基板而不与第一基板接触并且不与磁片接触。

公开(公告)号：US20210384292A1

公开(公告)日：2021-12-09

申请号：US17408273

申请日：2021-08-20

Applicant: QUALCOMM Incorporated

Inventor： Karim ARABI ,  Ravindra Vaman SHENOY ,  Evgeni Petrovich GOUSEV ,  Mete ERTURK

IPC: H01L49/02 ,  H01L23/64 ,  H01L23/498

Abstract: A voltage regulator having a coil inductor is integrated or embedded in a system-on-chip (SOC) device. The coil inductor is fabricated on an inductor wafer with through vias, and the inductor wafer is joined with an SOC wafer for integration with the SOC device.

公开(公告)号：US20150311271A1

公开(公告)日：2015-10-29

申请号：US14451462

申请日：2014-08-05

Applicant: QUALCOMM Incorporated

Inventor： Mete ERTURK ,  Ravindra Vaman SHENOY ,  Kwan-yu LAI ,  Donald William KIDWELL, JR. ,  Jitae KIM ,  Jon Bradley LASITER

IPC: H01L49/02 ,  H01F27/24

CPC classification number: H01L28/10 ,  H01F17/0013 ,  H01F27/24 ,  H01F2017/004 ,  H01L23/5227 ,  H01L23/525 ,  H01L23/645 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/12105 ,  H01L2924/18162 ,  H01L2924/19042

Abstract: One or more high-inductance, high-quality factor (Q) three-dimensional inductors, for example, solenoid or toroid inductors with small form factors, are provided in an integrated circuit package, such as an integrated fanout package.

Abstract translation: 一个或多个高感度，高品质因子（Q）三维电感器，例如具有小形状因数的螺线管或环形电感器，被提供在集成电路封装中，例如集成扇出封装。