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公开(公告)号：US20240195041A1
公开(公告)日：2024-06-13
申请号：US18423718
申请日：2024-01-26
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock , Gregory Valenti , Eric Jackson
Abstract: Power-combining devices and more particularly spatial power-combining and related structural arrangements are disclosed. Such structural arrangements involve mechanical connections between center waveguide sections and input and/or output coaxial waveguide sections that provide scalable structures for different operating frequency bands, improved mechanical connections, and/or improved assembly. Exemplary structural arrangements include structures that extend through center waveguide sections and into input and/or output coaxial waveguide sections, integrated mechanical structures within the center waveguide section, compression fit arrangements, dielectric inserts arranged within channels of coaxial waveguide sections, and/or various combinations thereof.
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Patent Agency Ranking
公开(公告)号：US11955687B2
公开(公告)日：2024-04-09
申请号：US17571980
申请日：2022-01-10
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock , Gregory Valenti , Eric Jackson
Abstract: Power-combining devices, and more particularly spatial power-combining and related structural arrangements are disclosed. Such structural arrangements involve mechanical connections between center waveguide sections and input and/or output coaxial waveguide sections that provide scalable structures for different operating frequency bands, improved mechanical connections, and/or improved assembly. Exemplary structural arrangements include structures that extend through center waveguide sections and into input and/or output coaxial waveguide sections, integrated mechanical structures within the center waveguide section, compression fit arrangements, dielectric inserts arranged within channels of coaxial waveguide sections, and/or various combinations thereof.
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公开(公告)号：US20240055319A1
公开(公告)日：2024-02-15
申请号：US18218670
申请日：2023-07-06
Applicant: Qorvo US, Inc.
Inventor： Matthew Irvine , Dylan Murdock
IPC: H01L23/373 , H01L23/00 , H01L23/367
CPC classification number: H01L23/3731 , H01L24/32 , H01L23/3675 , H01L24/73 , H01L2224/48155 , H01L2224/28 , H01L2924/141
Abstract: A circuit package with improved thermal management is disclosed. In one aspect, a ceramic insert is provided within a package having heat-producing circuitry thereon. The ceramic insert replaces traditional laminate inserts and provides a better thermal path to remove heat from leads and/or traces within the package. More particularly, the ceramic insert more readily transfers and/or dissipates heat that might otherwise accumulate at an output port where a solder junction may be made to couple the output port to external elements.
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公开(公告)号：US20230223673A1
公开(公告)日：2023-07-13
申请号：US17571980
申请日：2022-01-10
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock , Gregory Valenti , Eric Jackson
Abstract: Power-combining devices, and more particularly spatial power-combining and related structural arrangements are disclosed. Such structural arrangements involve mechanical connections between center waveguide sections and input and/or output coaxial waveguide sections that provide scalable structures for different operating frequency bands, improved mechanical connections, and/or improved assembly. Exemplary structural arrangements include structures that extend through center waveguide sections and into input and/or output coaxial waveguide sections, integrated mechanical structures within the center waveguide section, compression fit arrangements, dielectric inserts arranged within channels of coaxial waveguide sections, and/or various combinations thereof.
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公开(公告)号：US11255608B2
公开(公告)日：2022-02-22
申请号：US16288735
申请日：2019-02-28
Applicant: Qorvo US, Inc.
Inventor： Gregory Valenti , Dylan Murdock , Eric Jackson
Abstract: Heat exchanger assemblies for electronic devices are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways. A cover structure may be attached to the heat transfer body in a manner to enclose the open passageways, thereby forming a heat exchanger assembly that includes enclosed fluid conduits. In this regard, the enclosed fluid conduits may form complex and intricate patterns within the heat exchanger assembly that are tailored to the heat requirements of a particular application. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. The enclosed fluid conduits may be tailored based on locations of amplifiers within the center waveguide section to provide improved thermal operation of the spatial power-combining device.
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公开(公告)号：US20200041210A1
公开(公告)日：2020-02-06
申请号：US16288761
申请日：2019-02-28
Applicant: Qorvo US, Inc.
Inventor： Gregory Valenti , Dylan Murdock
Abstract: Heat exchanger assemblies for electronic devices and related methods are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways, and a cover structure attached to the heat transfer body that encloses the open passageways, thereby forming enclosed fluid conduits. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. Related methods include forming open passageways by selectively removing material from a face of a heat transfer body. Multiple heat transfer bodies may be formed simultaneously by forming multiple groups or patterns of open passageways across a larger area of a heat transfer body material, and subsequently singulating the heat transfer body material into multiple heat transfer bodies. Cover structures as previously described may be formed on the heat transfer bodies before or after singulation.
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