OPEN COMPUTE PROJECT CARD AUXILIARY MODE COOLING

    公开(公告)号:US20210173457A1

    公开(公告)日:2021-06-10

    申请号:US16707913

    申请日:2019-12-09

    Abstract: An electronic device operating in standby mode is provided. The electronic device includes a power supply unit, a cooling device coupled to the power supply unit, at least one electronic component cooled by the cooling device, and a controller coupled to the cooling device. The controller is operable to periodically monitor power data and the temperature of the at least one electronic component in standby mode. The controller is also operable to regulate power supplied to the cooling device based on the monitored power data and the temperature of the at least one electronic component.

    AUTOMATED FAN ADJUSTMENT SYSTEM
    22.
    发明申请

    公开(公告)号:US20210172448A1

    公开(公告)日:2021-06-10

    申请号:US16706428

    申请日:2019-12-06

    Abstract: A computing device has a fan housing that includes a dual rotor fan with a first rotor and a second rotor. The computing device also includes a controller communicatively coupled to the dual rotor fan. The controller is operable to detect a failure associated with the first rotor. In response to detecting the failure, the controller is operable to drive the second rotor at a higher speed than a fan-speed at which the second rotor was being driven before the failure.

    EXTENDED HEAT SINK DESIGN IN SERVER
    23.
    发明申请

    公开(公告)号:US20190297748A1

    公开(公告)日:2019-09-26

    申请号:US15926068

    申请日:2018-03-20

    Abstract: A method and structure for improving efficiency of cooling and temperature uniformity among a plurality of heat generating electronic devices arranged in rows within a housing, such as a GPU server, utilizing a single source of cooling air. The electronic devices are arranged in a plurality of rows, but the heat sinks for the last row are elevated above the heat sinks of the first row so as to occupy different positions within the cooling air stream. In some embodiments the heat sinks of the electronic devices are extended forward so as to reside near the heat sinks of the electronic devices in the first row, but in a different flow path of cooling air. In other embodiments, a thermo siphon refrigeration system is provided for the electronic devices in the last row, and may be provided for the electronic devices in the first row as well.

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