公开(公告)号：US20080278913A1

公开(公告)日：2008-11-13

申请号：US12178033

申请日：2008-07-23

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： F28C3/08 ,  F28F7/00 ,  H01L23/4735 ,  H01L2224/73253 ,  Y10S165/908

摘要： A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.

摘要翻译： 使用冷却装置提供冷却的电子模块和制造方法，用于从设置在基板上的一个或多个电子装置移除热量。 冷却装置包括供给歧管结构，其具有用于将冷却剂喷射到待冷却的表面上的多个入口孔和回流歧管结构。 由导热材料制成的回流歧管结构具有使用导热的冷却剂密封密封在其周围的待冷却表面的基面。 返回歧管结构提供至少一个返回通道，用于在撞击待冷却表面之后排出冷却剂，其中通过至少一个通道的冷却剂排出冷却回流歧管结构，从而有助于进一步冷却待冷却表面 其中基面被密封到待冷却的表面。

公开(公告)号：US07405936B1

公开(公告)日：2008-07-29

申请号：US12055455

申请日：2008-03-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/20736 ,  F28F1/20 ,  F28F1/22 ,  H05K7/20009 ,  H05K7/20554 ,  H05K7/20772

摘要： A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.

摘要翻译： 为多组件电子系统提供混合冷却系统和制造方法。 该冷却系统包括用于建立穿过要被冷却的至少一个主要和至少一个次要发热部件的空气流的空气移动装置; 以及液体冷却子系统，其包括物理耦合到所述至少一个主发热部件的至少一个冷板和与所述至少一个冷板流体连通的导热冷却剂供给管。 导热辅助结构联接到冷却剂承载管并且包括从其表面延伸的多个导热翅片。 多个导热翅片至少部分地设置在待冷却的至少一个二次发热组件上，并且为跨越电子系统的多个部件建立的空气流的至少一部分提供补充冷却。

公开(公告)号：US20080084668A1

公开(公告)日：2008-04-10

申请号：US11539905

申请日：2006-10-10

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Randall G. Kemink ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Randall G. Kemink ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/20509 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K7/20009 ,  H05K7/20772 ,  H01L2224/0401

摘要： A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.

摘要翻译： 提供导电热传输冷却系统和方法来冷却电子系统的一次和二次发热部件。 冷却系统包括液体冷却子系统，其包括物理耦合到电子系统的至少一个主要发热部件的至少一个液体冷却冷却板，以及耦合到流体连通的流体传导冷却剂管 至少一个液冷冷板。 导热辅助结构耦合到冷却剂承载管和电子系统的至少一个二次发热部件。 当使用时，导热辅助结构提供从至少一个二次发热部件到耦合到其上的至少一个导热冷却剂输送管的导热传输，并且因此通过对流通过其中的液体冷却剂。

公开(公告)号：US20080084664A1

公开(公告)日：2008-04-10

申请号：US11539910

申请日：2006-10-10

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20009 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20772

摘要： A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes. When in use, the multiple liquid-cooled cold plates engage respective electronic components of the electronics system, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the cold plates for removal of heat generated by the respective electronic components.

公开(公告)号：US07274566B2

公开(公告)日：2007-09-25

申请号：US11008732

申请日：2004-12-09

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F04B17/00

CPC分类号： H05K7/2079

摘要： A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.

摘要翻译： 提供冷却剂流动驱动装置，用于便于从耦合到发热电子部件的冷却结构移除热量。 冷却剂流动驱动装置包括与在主冷却剂流动回路内流动的主要冷却剂流体连通的涡轮机，以及与次级冷却剂流动路径内的二级冷却剂流体连通的泵。 次级流体流动路径与主冷却剂流动路径分离。 流动驱动装置还包括在涡轮机和泵之间的磁耦合，其中涡轮机通过磁耦合驱动泵以将二级冷却剂泵送通过次级冷却剂流动路径。

公开(公告)号：US07106590B2

公开(公告)日：2006-09-12

申请号：US10726347

申请日：2003-12-03

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Randy J. Zoodsma

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Randy J. Zoodsma

IPC分类号： H05K7/20 ,  F28D15/00

CPC分类号： H05K7/2079

摘要： A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof via the control valve through the heat exchanger. The second cooling loop provides cooled system coolant to the associated electronics rack, and expels heat in the heat exchanger from the electronics rack to the chilled facility coolant in the first cooling loop. The control valve allows regulation of the facility coolant flow through the heat exchanger, thereby allowing independent control of temperature of the system coolant in the second cooling loop. Various CCU and associated component redundancies of the cooling system are also provided.

摘要翻译： 提供采用多个冷却剂调节单元（CCU）的冷却系统。 耦合到要冷却的多个电子机架的不同相关电子机架的每个CCU包括热交换器，具有控制阀的第一冷却回路和第二冷却回路。 第一冷却回路从源接收冷却设备冷却剂，并且经由控制阀将其至少一部分通过热交换器。 第二冷却回路将冷却的系统冷却剂提供给相关联的电子机架，并将热交换器中的热量从电子机架排出到第一冷却回路中的冷却设备冷却剂。 控制阀允许调节通过热交换器的设备冷却剂流，从而允许独立地控制第二冷却回路中的系统冷却剂的温度。 还提供了冷却系统的各种CCU和相关部件冗余。

公开(公告)号：US07086247B2

公开(公告)日：2006-08-08

申请号：US10930079

申请日：2004-08-31

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F25D23/12

CPC分类号： H01L23/4275 ,  F28D20/021 ,  H01L2924/0002 ,  H05K7/20654 ,  Y02E60/145 ,  H01L2924/00

摘要： A cooling approach is provided for cooling an electronics subsystem, such as an electronics rack. The cooling approach includes a coolant conditioning unit and a thermal capacitor unit. The coolant conditioning unit has a heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop receives facility coolant from a facility coolant source and passes at least a portion thereof to the heat exchanger. The second cooling loop provides system coolant to the electronics subsystem, and expels heat in the heat exchanger from the electronics subsystem to the facility coolant in the first cooling loop. The thermal capacitor unit is in fluid communication with the second cooling loop to maintain temperature of the system coolant within a defined range for a period of time upon shutdown or failure of the facility coolant in the first cooling loop, thereby allowing continued operation of the electronics subsystem.

摘要翻译： 提供冷却方法来冷却诸如电子机架的电子子系统。 冷却方式包括冷却剂调节单元和热电容器单元。 冷却剂调节单元具有热交换器，第一冷却回路和第二冷却回路。 第一冷却回路从设备冷却剂源接收设备冷却剂，并将其至少一部分通到热交换器。 第二冷却回路将系统冷却剂提供给电子子系统，并将热交换器中的热量从电子系统排出到第一冷却回路中的设备冷却剂。 热电容器单元与第二冷却回路流体连通，以在第一冷却回路中的设备冷却剂关闭或故障时将系统冷却剂的温度维持在限定范围内一段时间，从而允许电子装置的继续运行 子系统。

公开(公告)号：US07012807B2

公开(公告)日：2006-03-14

申请号：US10675628

申请日：2003-09-30

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20772 ,  G06F1/20 ,  G06F2200/201

摘要： A thermal dissipation assembly and method, and a cooled multi-drawer electronics rack are provided having a first cooling loop and a second cooling loop. The first cooling loop is disposed substantially within an electronics drawer and positioned to extract heat from an electronics module within the drawer. The first cooling loop further includes a first planar heat transfer surface. The second cooling loop is disposed substantially external to the electronics drawer and includes a second planar heat transfer surface. A biasing mechanism mechanically forces the first planar heat transfer surface and the second heat transfer surface coplanar when the electronics drawer is in a docked position in the electronics rack to facilitate the transfer of heat from the first cooling loop to the second cooling loop.

摘要翻译： 提供散热组件和方法以及冷却的多抽屉电子机架，其具有第一冷却回路和第二冷却回路。 第一冷却回路基本上设置在电子抽屉内并且定位成从抽屉内的电子模块提取热量。 第一冷却回路还包括第一平面传热表面。 第二冷却回路基本上设置在电子抽屉的外部，并且包括第二平面传热表面。 当电子抽屉处于电子机架中的对接位置时，偏置机构将第一平面传热表面和第二传热表面机械地迫使第一传热表面共面，以便于将热量从第一冷却回路传递到第二冷却回路。

公开(公告)号：US06591898B1

公开(公告)日：2003-07-15

申请号：US10176217

申请日：2002-06-20

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

IPC分类号： F28F700

CPC分类号： H01L23/473 ,  F28F1/32 ,  F28F3/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated heat sink system is provided for internal cooling of a closed electronics container. The heat sink system includes a cold plate and a fin assembly thermally coupled to and extending from the cold plate. The cold plate has a surface for thermally coupling to one or more components within the container, such as a processor module. The heat sink system further includes at least one coolant carrier channel thermally coupled to and passing through the fins of the fin assembly. When the heat sink system is operational within the closed container, the cold plate thermally couples to and removes heat from the one or more components, the plurality of fins remove heat from air circulating within the closed container, and coolant within the coolant carrying channel(s) removes heat from the plurality of fins and from the cold plate thermally coupled thereto.

摘要翻译： 提供集成的散热器系统用于封闭的电子容器的内部冷却。 散热器系统包括热耦合到冷板并从冷板延伸的散热片组件。 冷板具有用于热耦合到容器内的一个或多个部件的表面，例如处理器模块。 散热器系统还包括至少一个与翅片组件的翅片热耦合并穿过翅片组件的翅片的冷却剂载体通道。 当散热器系统在密封容器内操作时，冷板热耦合到一个或多个部件热耦合并移除热量，多个散热片从密封容器内循环的空气和冷却剂携带通道内的冷却剂 s）从多个翅片和与其热耦合的冷板去除热量。

公开(公告)号：US06431260B1

公开(公告)日：2002-08-13

申请号：US09742919

申请日：2000-12-21

申请人： Dereje Agonafer ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

发明人： Dereje Agonafer ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

IPC分类号： F28F700

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

摘要： Cavity plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a cavity plate having one or more blind holes formed therein and one or more jet nozzles each configured to reside within a respective blind hole of the cavity plate. A lower surface of the blind hole and/or jet nozzle is curved to facilitate the flow of fluid from the blind hole after impinging upon the lower surface of the blind hole. Various jet nozzle configurations are also provided which employ pedestals or radially extending fins. Further, the radially extending fins may interdigitate with inwardly extending fins on the inner sidewall of a respective blind hole in the cavity plate. Methods of fabricating the cavity plate and jet nozzle assemblies are also presented.

摘要翻译： 提供腔板和喷嘴组件用于冷却电子模块。 组件包括一个具有形成在其中的一个或多个盲孔的空腔板，以及一个或多个喷嘴，各自被配置为位于空腔板的相应盲孔内。 盲孔和/或喷嘴的下表面是弯曲的，以便于在撞击到盲孔的下表面之后使流体从盲孔流出。 还提供了各种喷嘴构造，其采用基座或径向延伸的翅片。 此外，径向延伸的翅片可以与空腔板中的相应盲孔的内侧壁上的向内延伸的翅片相互交叉。 还提出了制造腔板和喷嘴组件的方法。