公开(公告)号：US20200321160A1

公开(公告)日：2020-10-08

申请号：US16910356

申请日：2020-06-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Bum Soo KIM ,  Jang Yeol LEE ,  Jong Ho LEE

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/30

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively. The external electrode includes electrode layers electrically connected to the internal electrodes, and plating layers disposed on the electrode layers. At least one point, at which slopes of tangent lines of one of the electrode layers and the plating layers are opposite to each other, is disposed in a region within a range of ±0.2 BW around a point (0.5 BW) that is a halfway point of an overall width BW of the electrode layers disposed on the first surface or the second surface of the ceramic body.

公开(公告)号：US20200135403A1

公开(公告)日：2020-04-30

申请号：US16219912

申请日：2018-12-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jang Yeol LEE ,  Joon Hwan KWAG ,  Jong Ho LEE ,  Myung Jun PARK

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/005

Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a plating layer disposed on the electrode layer, and a secondary phase material disposed at a boundary between the plating layer and the electrode layer. The secondary phase material contains sulfur (S).

公开(公告)号：US20180174756A1

公开(公告)日：2018-06-21

申请号：US15675102

申请日：2017-08-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yu Ra SHIN ,  Myeong Gi KIM ,  Eung Soo KIM ,  Hak Kwan KIM ,  Jang Yeol LEE ,  Seong Min CHIN

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/008 ,  C08K3/04 ,  C04B35/468

CPC classification number: H01G4/30 ,  C04B35/4682 ,  C04B35/63424 ,  C04B2235/3236 ,  C04B2235/422 ,  C04B2235/425 ,  C04B2235/48 ,  C04B2235/528 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/721 ,  C08K3/042 ,  H01G4/008 ,  H01G4/1218 ,  C08L33/10

Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.

公开(公告)号：US20180144863A1

公开(公告)日：2018-05-24

申请号：US15448523

申请日：2017-03-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Myeong Gi KIM ,  Yu Ra SHIN ,  Jang Yeol LEE ,  Seong Min CHIN ,  Hak Kwan KIM

IPC: H01G4/008 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248

CPC classification number: H01G4/008 ,  C01B32/182 ,  C01B32/23 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30

Abstract: A conductive powder for an internal electrode includes a metal particle; and a graphene layer or an oxidized graphene layer disposed on at least a portion of a surface of the metal particle.