公开(公告)号：US12261104B2

公开(公告)日：2025-03-25

申请号：US17670635

申请日：2022-02-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeonjeong Hwang ,  Dongkyu Kim ,  Minjung Kim ,  Yeonho Jang

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: A semiconductor package including a redistribution substrate extending in a first direction and a second direction perpendicular to the first direction, a semiconductor chip mounted on a top surface of the redistribution substrate, and an outer terminal on a bottom surface of the redistribution substrate. The redistribution substrate may include an under-bump pattern, a redistribution insulating layer covering a top surface and a side surface of the under-bump pattern, a protection pattern interposed between the top surface of the under-bump pattern and the redistribution insulating layer, and interposed between the side surface of the under-bump pattern and the redistribution insulating layer, and a redistribution pattern on the under-bump pattern. The outer terminal may be disposed on a bottom surface of the under-bump pattern.

公开(公告)号：US11955499B2

公开(公告)日：2024-04-09

申请号：US17363931

申请日：2021-06-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minjung Kim ,  Dongkyu Kim ,  Kyounglim Suk ,  Jaegwon Jang ,  Hyeonjeong Hwang

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14634 ,  H01L24/16 ,  H01L27/14621 ,  H01L27/14625 ,  H01L2224/16227

Abstract: An image sensor package includes a glass substrate configured to focus incident light, a first redistribution layer and a second redistribution layer both disposed under the glass substrate while being horizontally spaced apart from each other by a first distance, an image sensor disposed such that an upper surface thereof is vertically spaced apart from both a lower surface of the first redistribution layer and a lower surface of the second redistribution layer by a second distance, and a first connector that connects both the first redistribution layer and the second redistribution layer to the image sensor. The thickness of the glass substrate is 0.6 to 0.8 mm. The first distance is smaller than the horizontal length of the image sensor by 50 μm to 1 mm. The second distance is equal to or less than 0.1 mm.

公开(公告)号：US20240038642A1

公开(公告)日：2024-02-01

申请号：US18121429

申请日：2023-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkyu Kim ,  Joonsung KIM ,  Hyeonseok LEE ,  Hyeonjeong HWANG

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L24/32 ,  H01L2224/73204 ,  H01L24/73

Abstract: A semiconductor package includes a first redistribution substrate, a semiconductor chip provided on a top surface of the first redistribution substrate, a conductive structure provided on the top surface of the first redistribution substrate and spaced apart from the semiconductor chip, a molding layer provided on the first redistribution substrate and covering a side surface of the semiconductor chip and a side surface of the conductive structure, and a second redistribution substrate on the molding layer and the conductive structure. The conductive structure includes a first conductive structure provided on the first redistribution substrate, and a second conductive structure provided on a top surface of the first conductive structure. The second redistribution substrate includes an insulating layer. At least a portion of a top surface of the second conductive structure directly contacts the insulating layer of the second redistribution substrate.

公开(公告)号：US20220375829A1

公开(公告)日：2022-11-24

申请号：US17533606

申请日：2021-11-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeonjeong Hwang ,  Minjung Kim ,  Dongkyu Kim ,  Taewon Yoo

IPC: H01L23/49 ,  H01L23/498 ,  H01L23/31

Abstract: Disclosed is a semiconductor package comprising a first redistribution substrate; a solder ball on a bottom surface of the first redistribution substrate; a second redistribution substrate; a semiconductor chip between a top surface of the first redistribution substrate and a bottom surface of the second redistribution substrate; a conductive structure electrically connecting the first redistribution substrate and the second redistribution substrate, the conductive structure laterally spaced apart from the semiconductor chip and including a first conductive structure and a second conductive structure in direct contact with a top surface of the first conductive structure; and a conductive seed pattern between the first redistribution substrate and the first conductive structure. A material of first conductive structure and a material of the second conductive structure may be different from a material of the solder ball.