Semiconductor package
    2.
    发明授权

    公开(公告)号:US12261106B2

    公开(公告)日:2025-03-25

    申请号:US17535093

    申请日:2021-11-24

    Abstract: A semiconductor package comprises a first redistribution substrate including first interconnection layers sequentially stacked on each other, a semiconductor chip mounted on the first redistribution substrate, a mold layer disposed on the first redistribution substrate and surrounding the semiconductor chip, a second redistribution substrate disposed on the mold layer and including second interconnection layers sequentially stacked on each other, a connection terminal disposed beside the semiconductor chip to connect the first and second redistribution substrates to each other, and outer terminals disposed on a bottom surface of the first redistribution substrate. Each of the first and second interconnection layers may include an insulating layer and a wire pattern in the insulating layer. The first redistribution substrate may have substantially the same thickness as the second redistribution substrate, and the first interconnection layers may be thinner than the second interconnection layers.

    SEMICONDUCTOR PACKAGE INCLUDING A DUMMY PATTERN

    公开(公告)号:US20230019311A1

    公开(公告)日:2023-01-19

    申请号:US17731416

    申请日:2022-04-28

    Abstract: A semiconductor package including: a first substrate and a semiconductor device on the first substrate, wherein the first substrate includes: a first dielectric layer including a first hole; a second dielectric layer on the first dielectric layer and including a second hole that overlaps the first hole, the second hole being wider than the first hole; an under bump disposed in the first hole and the second hole, the under bump covering a portion of the second dielectric layer; and a connection member bonded to the under bump.

    Semiconductor package
    4.
    发明授权

    公开(公告)号:US12191236B2

    公开(公告)日:2025-01-07

    申请号:US17533606

    申请日:2021-11-23

    Abstract: Disclosed is a semiconductor package comprising a first redistribution substrate; a solder ball on a bottom surface of the first redistribution substrate; a second redistribution substrate; a semiconductor chip between a top surface of the first redistribution substrate and a bottom surface of the second redistribution substrate; a conductive structure electrically connecting the first redistribution substrate and the second redistribution substrate, the conductive structure laterally spaced apart from the semiconductor chip and including a first conductive structure and a second conductive structure in direct contact with a top surface of the first conductive structure; and a conductive seed pattern between the first redistribution substrate and the first conductive structure. A material of first conductive structure and a material of the second conductive structure may be different from a material of the solder ball.

    Semiconductor package and method of fabricating the same

    公开(公告)号:US12261104B2

    公开(公告)日:2025-03-25

    申请号:US17670635

    申请日:2022-02-14

    Abstract: A semiconductor package including a redistribution substrate extending in a first direction and a second direction perpendicular to the first direction, a semiconductor chip mounted on a top surface of the redistribution substrate, and an outer terminal on a bottom surface of the redistribution substrate. The redistribution substrate may include an under-bump pattern, a redistribution insulating layer covering a top surface and a side surface of the under-bump pattern, a protection pattern interposed between the top surface of the under-bump pattern and the redistribution insulating layer, and interposed between the side surface of the under-bump pattern and the redistribution insulating layer, and a redistribution pattern on the under-bump pattern. The outer terminal may be disposed on a bottom surface of the under-bump pattern.

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20250029906A1

    公开(公告)日:2025-01-23

    申请号:US18646834

    申请日:2024-04-26

    Abstract: Provided are a semiconductor package including a pad with high reliability and a method of manufacturing the semiconductor package. The semiconductor package includes a first redistribution substrate, a semiconductor chip on the first redistribution substrate, a through post extending around the semiconductor chip and on the first redistribution substrate, and a second redistribution substrate on the semiconductor chip and the through post. A first pad region and a second pad region are defined on an upper surface of the second redistribution substrate, the first pad region positioned at a central portion of the second redistribution substrate, and the second pad region extending around the first pad region, a first-type pad in a planar shape is in a first opening, a second-type pad having an outer protruding portion is in a second opening.

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