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    METHOD OF MANUFACTURING MICRO-LED DISPLAY
    21.
    发明申请
    METHOD OF MANUFACTURING MICRO-LED DISPLAY 有权

    公开(公告)号：US20250048783A1

    公开(公告)日：2025-02-06

    申请号：US18920608

    申请日：2024-10-18

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Joonyong PARK ,  Seogwoo Hong ,  kyungwook Hwang ,  Hyunjoon Kim ,  Junsik Hwang

    IPC: H01L33/00 ,  H01L27/15 ,  H01L33/62

    Abstract: Provided is a method of manufacturing a display, the method including a first operation of transferring a plurality of micro light emitting diodes (LEDs) to a plurality of wells of an interposer through a fluidic self assembly (FSA) process, a second operation of aligning a driving substrate on the interposer, a third operation of injecting a penetrating solvent between the interposer and the driving substrate, such that the penetrating solvent penetrates between the plurality of micro LEDs and the plurality of wells, and a fourth operation of transferring the plurality of micro LEDs to the driving substrate by radiating light to the interposer to vaporize the penetrating solvent.

    Micro light emitting device array and method of manufacturing the same
    24.
    发明授权
    Micro light emitting device array and method of manufacturing the same 有权

    公开(公告)号：US11610872B2

    公开(公告)日：2023-03-21

    申请号：US17315596

    申请日：2021-05-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyungwook Hwang ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

    IPC: H01L25/13 ,  H01L23/00

    Abstract: Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.

    HYBRID ELEMENT SUBSTRATE AND METHOD OF FABRICATING THE SAME
    25.
    发明申请
    HYBRID ELEMENT SUBSTRATE AND METHOD OF FABRICATING THE SAME 有权

    公开(公告)号：US20230064207A1

    公开(公告)日：2023-03-02

    申请号：US17982347

    申请日：2022-11-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyungwook HWANG ,  Junsik Hwang ,  Dongho Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

    IPC: H01L25/16

    Abstract: Provided is a method of fabricating a hybrid element substrate, the method including forming a plurality of first elements on a first substrate which is a silicon substrate or a silicon-on-insulator (SOI) substrate; forming a plurality of second elements on a second substrate which has a material different from a material of the first substrate; separating a plurality of second elements from the second substrate; primarily transferring the plurality of second elements onto a transfer substrate comprising a plurality of grooves by a fluidic self-assembly method such that the plurality of second elements are arranged in the plurality of grooves of the transfer substrate, respectively; and secondarily transferring, onto the first substrate, the plurality of second elements transferred onto the transfer substrate such that the plurality of second elements are next to the first elements on the first substrate and spaced apart from each other, or overlap upper portions of the first elements, respectively.

    Method of aligning micro light emitting element and display transferring structure
    26.
    发明授权
    Method of aligning micro light emitting element and display transferring structure 有权

    公开(公告)号：US11469132B2

    公开(公告)日：2022-10-11

    申请号：US17154773

    申请日：2021-01-21

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hyunjoon Kim ,  Kyungwook Hwang

    IPC: H01L21/683 ,  H01L25/075 ,  H01L33/20 ,  H01L33/62

    Abstract: A method of aligning micro light emitting elements includes supplying the plurality of micro light emitting elements on a substrate including a plurality of grooves having different shapes, the plurality of micro light emitting elements being configured to be inserted exclusively and respectively into the plurality of grooves; respectively inserting the plurality of micro light emitting elements into the plurality of grooves; and aligning the plurality of micro light emitting elements, wherein at least one groove of the plurality of grooves has a shape that is different from a shape of a respective micro light emitting element inserted into the at least one groove.

    Method and apparatus for managing scheduling of services during boot-up
    27.
    发明授权
    Method and apparatus for managing scheduling of services during boot-up 有权

    公开(公告)号：US11455172B2

    公开(公告)日：2022-09-27

    申请号：US16635794

    申请日：2018-08-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Atikant Singh ,  Anuradha Kanukotla ,  Hyunjoon Kim ,  Kyungseok Lee ,  Ramalingam Ramamoorthy

    IPC: G06F9/4401 ,  G06F9/48

    Abstract: Accordingly the embodiments herein provide a method for managing scheduling of services during a boot-up process in an electronic device including a multi-core processor. The method includes determining a plurality of services initiated during the boot-up process of the electronic device. Further, the method includes registering system parameters associated with the electronic device for each one of the determined services. Further, the method includes determining whether the service is critical or non-critical for the boot-up process. Further, the method includes tagging a label data to each one of the determined services, wherein the label data represents whether the service is critical or non-critical. Further, the method includes clustering each of the services into one of an accelerating cluster and a decelerating cluster based on the registered system parameters associated with the electronic device and the tagged label data.

    DISPENSER FOR MICRO LED SUSPENSION AND METHOD OF TRANSFERRING MICRO LED
    28.
    发明申请
    DISPENSER FOR MICRO LED SUSPENSION AND METHOD OF TRANSFERRING MICRO LED 有权

    公开(公告)号：US20220246448A1

    公开(公告)日：2022-08-04

    申请号：US17469390

    申请日：2021-09-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Joonyong Park ,  Dongho Kim ,  Hyunjoon Kim ,  Seogwoo Hong ,  Kyungwook Hwang ,  Junsik Hwang

    IPC: H01L21/67 ,  H01L21/673 ,  H01L33/00

    Abstract: Provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (LEDs) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.

    METHOD OF MANUFACTURING MICRO-LED DISPLAY
    29.
    发明申请
    METHOD OF MANUFACTURING MICRO-LED DISPLAY 有权

    公开(公告)号：US20220190192A1

    公开(公告)日：2022-06-16

    申请号：US17477875

    申请日：2021-09-17

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Joonyong PARK ,  Seogwoo Hong ,  Kyungwook Hwang ,  Hyunjoon Kim ,  Junsik Hwang

    IPC: H01L33/00 ,  H01L33/62 ,  H01L27/15

    Abstract: Provided is a method of manufacturing a display, the method including a first operation of transferring a plurality of micro light emitting diodes (LEDs) to a plurality of wells of an interposer through a fluidic self assembly (FSA) process, a second operation of aligning a driving substrate on the interposer, a third operation of injecting a penetrating solvent between the interposer and the driving substrate, such that the penetrating solvent penetrates between the plurality of micro LEDs and the plurality of wells, and a fourth operation of transferring the plurality of micro LEDs to the driving substrate by radiating light to the interposer to vaporize the penetrating solvent.

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