公开(公告)号：US20220029323A1

公开(公告)日：2022-01-27

申请号：US17496558

申请日：2021-10-07

Applicant: SAMTEC INC.

Inventor： Liam PARKES ,  Eric ZBINDEN ,  Keith Guetig ,  Jignesh H. Shah ,  Jean Karlo Williams Barnett ,  Chadrick Paul Faith ,  R. Brad Bettman

IPC: H01R12/70 ,  G02B6/42 ,  H01R12/77 ,  H01R12/83 ,  H01R13/639

Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.

公开(公告)号：US11735844B2

公开(公告)日：2023-08-22

申请号：US17496558

申请日：2021-10-07

Applicant: SAMTEC INC.

Inventor： Liam Parkes ,  Eric Zbinden ,  Keith Guetig ,  Jignesh H. Shah ,  Jean Karlo Williams Barnett ,  Chadrick Paul Faith ,  R. Brad Bettman

IPC: H01R12/70 ,  G02B6/42 ,  H01R12/77 ,  H01R12/83 ,  H01R13/639 ,  H01R13/629

CPC classification number: H01R12/7029 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4277 ,  H01R12/7058 ,  H01R12/774 ,  H01R12/83 ,  H01R13/629 ,  H01R13/639

Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.

公开(公告)号：US11495899B2

公开(公告)日：2022-11-08

申请号：US16764142

申请日：2018-11-14

Applicant: SAMTEC, INC.

Inventor： Eric Zbinden ,  Jignesh H. Shah

IPC: H01R12/71 ,  H01R12/72 ,  H01R13/187

Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

公开(公告)号：US11196195B2

公开(公告)日：2021-12-07

申请号：US16604023

申请日：2018-04-10

Applicant: SAMTEC, INC.

Inventor： R. Brad Bettman ,  Liam Parkes ,  Eric Zbinden ,  Keith Guetig ,  Jignesh H. Shah ,  Jean Karlo Williams Barnett ,  Chadrick Paul Faith ,  Edwin Loy

IPC: H01R12/70 ,  G02B6/42 ,  H01R12/73

Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.

公开(公告)号：US10884198B2

公开(公告)日：2021-01-05

申请号：US15078162

申请日：2016-03-23

Applicant: Samtec, Inc.

Inventor： Jignesh H. Shah ,  William J. Kozlovsky ,  David A. Langsam ,  Raymond J. Lee ,  R. Brad Bettman ,  Eric Jean Zbinden

IPC: G02B6/42

Abstract: An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a textured surface that scatters or absorbs some of the light received from the first surface to attenuate the light exiting the optical block through the second surface.

公开(公告)号：USD822611S1

公开(公告)日：2018-07-10

申请号：US29604016

申请日：2017-05-15

Applicant: Samtec, Inc.

Designer： R. Brad Bettman ,  Jean Karlo Williams Barnett ,  Jignesh H. Shah