Systems and methods of treating a substrate

    公开(公告)号:US10304664B2

    公开(公告)日:2019-05-28

    申请号:US15788166

    申请日:2017-10-19

    Applicant: Semes Co., Ltd

    Abstract: Substrate treating systems are disclosed. The system may include a chamber with a processing space, a supporting unit provided in the processing space to support a substrate, a gas supplying unit provided in the processing space to supply gas into the processing space, a plasma source unit generating plasma from the gas, and a liner unit disposed to enclose the supporting unit. The supporting unit may include a supporting plate supporting a substrate. The liner unit may include an inner liner enclosing the supporting plate and an actuator vertically moving the inner liner.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE
    22.
    发明申请

    公开(公告)号:US20190131146A1

    公开(公告)日:2019-05-02

    申请号:US16166614

    申请日:2018-10-22

    Abstract: Disclosed is An apparatus for treating a substrate includes a chamber having a treatment space provided therein to treat the substrate and having an entrance for introducing or withdrawing the substrate, a liner disposed in the treatment space, disposed adjacent to an inner sidewall of the chamber, and having an opening formed at a position of facing the entrance to introduce or withdraw the substrate, a supporting unit to support the substrate in the treatment space, a gas supplying unit to supply process gas to the treatment space, a plasma source to produce plasma from the process gas, and a door assembly to open or close the entrance. The door assembly includes a door which includes a door unit provided outside the chamber to be movable between an opening position to open the entrance and a closing position to close the entrance, and an insertion unit extending from the door unit toward the treatment space and inserted into the opening of the liner at the closing position, and a door driving unit to drive the door.

    Supporting unit and substrate treatment apparatus

    公开(公告)号:US10236194B2

    公开(公告)日:2019-03-19

    申请号:US14264410

    申请日:2014-04-29

    Abstract: Provided is a supporting unit supporting a substrate. The supporting unit includes a body including a plurality of heating regions and disposed with the substrate on a top surface thereof and a heating unit heating the body. Herein, the heating unit includes heating lines provided in the plurality of heating regions, respectively, to control temperatures of the plurality of heating regions independently from one another, terminals provided to the body and receiving power from the outside, and connecting lines connecting the heating lines to the terminals mutually corresponding to one another. Also, the terminals are disposed in one of the plurality of heating regions in a top view.

    Substrate processing apparatus and substrate processing method

    公开(公告)号:US10796891B2

    公开(公告)日:2020-10-06

    申请号:US16161180

    申请日:2018-10-16

    Abstract: Disclosed is a substrate processing apparatus including a chamber having a processing space inside, a support unit that supports a substrate in the processing space, a gas supply unit that supplies gas into the processing space, a plasma source that generates plasma from the gas supplied into the processing space, and a detection unit that is provided in a sidewall of the chamber and that measures an impedance change to detect a degree of adsorption of particles on an inner wall of the chamber or a surface of a part that is exposed to the processing space.

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