公开(公告)号：US20160099200A1

公开(公告)日：2016-04-07

申请号：US14750920

申请日：2015-06-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Laura Ceriati ,  Paolo Crema ,  Agatino Minotti

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L24/32 ,  C22C21/02 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49579 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/13091 ,  H01L2924/17724 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Described herein is a semiconductor device provided with: a die of semiconductor material; a lead frame, defining a support plate, which is designed to carry the die, and leads, which are designed to be electrically coupled to the die; and a package, of encapsulating material, which is designed to encapsulate the die and partially coming out of which are the leads. The lead frame has as constituent material an aluminum alloy comprising a percentage of silicon ranging between 1% and 1.5%.

Abstract translation: 这里描述的是一种半导体器件，其具有：半导体材料的管芯; 引线框架，限定被设计成承载芯片的支撑板和被设计成电耦合到管芯的引线; 以及封装材料的封装，其被设计成封装模具并部分地从其中引出。 引线框架具有作为构成材料的铝合金，其包含1％至1.5％之间的硅的百分比。