Abstract:
A light source module includes a printed circuit board including a wiring layer, an insulating coating layer disposed on the wiring layer, and a reflection adjustment pattern disposed on the insulating coating layer and having reflection characteristics which are different from reflection characteristics of the insulating coating layer, a light emitting chip mounted on the printed circuit board, and an optical lens arranged on an upper portion of the light emitting chip and fixed to the printed circuit board.
Abstract:
A method of protecting an LED chip from damage by ESD and EMI when the LED chip is housed in a light-emitting diode(s) housing package (LED package) and the LED package is mounted on a printed circuit board is provided. The method comprises a step of not including an ESD and EMI suppressing Zener diode within the combination of the printed circuit board and the LED package and of providing within the combination of the printed circuit board and the LED package a first conductive member and a spaced apart second conductive member which are electrically connected to the LED chip and which have defined between them at least one insulative ESD and/or EMI suppressing region which breaks down in its insulative properties when subjected to voltages of absolute magnitudes greater than a predetermined threshold voltage.
Abstract:
A backlight assembly includes a receiving container, a light emitting unit and a light guide plate. The receiving container includes a bottom portion, and a sidewall extended from the bottom portion. The light emitting unit is on an inner lateral surface of the sidewall. The light guide plate is in the receiving container and includes a side surface facing the light emitting unit. The light emitting unit includes a light emitting diode package which generates light, a first lead frame and a second lead frame. The first lead frame is electrically connected to a first electrode of the light emitting diode package. The second lead frame is spaced apart from the first lead frame and electrically connected to a second electrode of the light emitting diode package.
Abstract:
A display device includes a display area including a display layer, a folding area extending from the display area and at which the display device is bendable, and a signal wire which is connected to the display layer and extends across the folding area. The signal wire includes within the folding area a first signal wire layer which crosses the folding area, a second signal wire layer which is on the first signal wire layer and electrically connected to the first signal wire layer, the second signal wire layer including a plurality of patterns spaced apart from each other along the signal wire, and a metal layer which is on the second signal wire layer and electrically connected to the second signal wire layer.
Abstract:
A display device includes: a substrate comprising an open portion; a pad portion on the substrate and exposed through the open portion; a fanout line integrally formed with the pad portion; a data line electrically connected to the fanout line; a flexible film under the substrate and comprising a lead electrode inserted into the open portion of the substrate to directly contact the pad portion; and a contact portion covering a lower surface of the lead electrode and a lower surface of the pad portion to electrically connect the lead electrode and the pad portion.
Abstract:
A display device includes: a first substrate in which a display area and a non-display area disposed outside the display area are defined; a second substrate facing the first substrate; and a cell seal disposed on the non-display area, where the cell seal includes a bonding filament connecting the first substrate and the second substrate to each other.
Abstract:
A display device has a display area with a plurality of light emitting areas and a non-light emitting area between the light emitting areas and a non-display area around a periphery of the display area. The display device includes: a base substrate having a first surface and an opposite second surface; a light emitting element in each of the light emitting areas on the first surface; a light blocking pattern in the non-light emitting area and in a light blocking area of the non-display area; a printed circuit film attached to a pad area of the non-display area on the first surface; and a light blocking layer on the light blocking pattern and the printed circuit film. The pad area is nearer to an end of the base substrate than the light blocking area is, and the light blocking layer includes a black resin and overlaps the light blocking pattern.
Abstract:
A method of manufacturing a display device includes providing a display layer including a light-emitting element, providing a base resin on the display layer, providing a chassis part by using a chassis providing unit including an electromagnet, providing a resin part by transforming a shape of the base resin, and separating the chassis providing unit from the display layer.
Abstract:
A display device includes: a first substrate in which a display area and a non-display area disposed outside the display area are defined; a second substrate facing the first substrate; and a cell seal disposed on the non-display area, where the cell seal includes a bonding filament connecting the first substrate and the second substrate to each other.
Abstract:
A method of manufacturing a display device includes fixing a display panel to a stage, attaching a printed circuit board to a first side surface of the fixed display panel, and irradiating the first side surface of the display panel with light from a first lighting and irradiating a second side surface of the display panel opposite the first side surface of the display panel with light from a second lighting to check alignment of the printed circuit board.