公开(公告)号：US10285620B2

公开(公告)日：2019-05-14

申请号：US15266410

申请日：2016-09-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myounghoon Jung ,  Kak Namkoong ,  Youngjun Koh ,  Jungmok Bae ,  Yeolho Lee ,  Hyeongseok Jang

IPC: A61B5/053 ,  A61B5/0205 ,  A61B5/024 ,  A61B5/026 ,  A61B5/08 ,  A61B5/00

Abstract: A method of measuring a bio signal using a bio signal measuring apparatus includes: positioning electrodes included as part of the bio signal measuring apparatus to contact a surface of an examinee; switching an impedance measurer included as part of the bio signal measuring apparatus and including a voltmeter and a current source; measuring a first impedance value of the examinee while operating the impedance measurer according to a first mode; switching the impedance measurer to a second mode; measuring a second impedance value of the examinee while operating the impedance measurer according to a second mode; and obtaining bio impedance of the examinee based on the first and second impedance values and an internal impedance of the current source.

公开(公告)号：US09942501B2

公开(公告)日：2018-04-10

申请号：US15031538

申请日：2014-10-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myounghoon Jung ,  Jungwoo Kim ,  Youngjun Yun ,  Seungeon Ahn

IPC: H04N5/335 ,  H04N5/3745 ,  H04N5/378 ,  H01L27/146

CPC classification number: H04N5/3745 ,  H01L27/14612 ,  H01L27/14643 ,  H04N5/378

Abstract: Provided are an image sensor compensating for property degradation of a metal-oxide-semiconductor (MOS) resulting from a threshold voltage shift that may occur when photodiodes and a MOS circuit of configuring an amplifier are integrated on the same substrate, and a method for driving the image sensor.

公开(公告)号：US09450122B2

公开(公告)日：2016-09-20

申请号：US14711420

申请日：2015-05-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihoon Ahn ,  Yongwoo Jeon ,  Jungwoo Kim ,  Haeseok Park ,  Seungeon Ahn ,  Seunghyup Lee ,  Myounghoon Jung ,  Hyuksoon Choi

IPC: H01L31/102 ,  H01L31/0336 ,  H01L31/0352 ,  H01L31/18 ,  H01L31/105

CPC classification number: H01L31/0336 ,  H01L27/14601 ,  H01L27/14643 ,  H01L31/0352 ,  H01L31/035281 ,  H01L31/03529 ,  H01L31/105 ,  H01L31/18 ,  H01L31/184 ,  H01L31/1852 ,  Y02E10/544 ,  Y02P70/521

Abstract: Example embodiments relate to a lateral type photodiode including a substrate, an insulation mask layer formed on the substrate, and a first type semiconductor layer, an active layer, and a second type semiconductor layer that contact a surface of the insulation mask layer and that are sequentially disposed in a direction substantially parallel to the surface of the insulation mask layer. The insulation mask layer includes a through hole, and the first type semiconductor layer, the active layer, and the second type semiconductor layer are sequentially formed from the through hole by using a lateral overgrowth method.

Abstract translation: 示例性实施例涉及包括衬底，形成在衬底上的绝缘掩模层和与绝缘掩模层的表面接触的第一类型半导体层，有源层和第二类型半导体层的横向型光电二极管， 依次设置在与绝缘掩模层的表面基本平行的方向上。 绝缘掩模层包括通孔，并且通过使用横向过度生长法从通孔顺序地形成第一类型半导体层，有源层和第二类型半导体层。