公开(公告)号：US12176245B2

公开(公告)日：2024-12-24

申请号：US17453504

申请日：2021-11-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjun Park ,  Byungkyu Kim ,  Eunji Kim ,  Seungwoo Paek ,  Sungdong Cho

IPC: H01L23/522 ,  H01L21/768 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18

Abstract: A semiconductor chip structure includes a first semiconductor chip that includes a first chip region and a first scribe lane region and a second semiconductor chip that includes a second chip region and a second scribe lane region respectively bonded to the first chip region and the first scribe lane region. The first semiconductor chip includes a first bonding wiring layer that includes a first bonding insulating layer and a first bonding electrode in the first bonding insulating layer. The second semiconductor chip includes a second bonding wiring layer that includes a second bonding insulating layer and a second bonding electrode in the second bonding insulating layer and a polishing stop pattern. The first bonding insulating layer and the first bonding electrode of the first bonding wiring layer are respectively hybrid bonded to the second bonding insulating layer and the second bonding electrode of the second bonding wiring layer.

公开(公告)号：US11498104B2

公开(公告)日：2022-11-15

申请号：US16986174

申请日：2020-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungtae Park ,  Myounghun Kim ,  Sangjun Park ,  Won Ju ,  Jungsoo Lim ,  Kookjeong Seo

IPC: B21C23/08 ,  B21C23/00

Abstract: An extrusion apparatus and a method for manufacturing an aluminum capillary tube using the same are provided. The extrusion apparatus includes a container, a housing mold provided on one side of the container and including a plurality of dies formed with a plurality of holes, and a ram pressing an aluminum billet accommodated in the container in a direction from another side to the one side of the container so that the aluminum billet accommodated in the container is extruded into a plurality of aluminum capillary tubes having cross-sectional shapes corresponding to the plurality of holes, and the number of the plurality of holes is determined based on an inner diameter of the container and a diameter of each of the plurality of holes.

公开(公告)号：US11365887B2

公开(公告)日：2022-06-21

申请号：US16679514

申请日：2019-11-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juyeong Kim ,  Euiyoung Chang ,  Sangjun Park

IPC: F24C3/12 ,  G05G5/03

Abstract: The cooking appliance according to the disclosure includes a main body having at least one heat source, a valve that includes a valve shaft, and adjusts an amount of fuel supplied to the at least one heat source according to an opening degree or a closing degree of the valve, and a knob apparatus that is coupled with the valve shaft and is installed on the main body. The knob apparatus includes a knob holder mounted on the main body, a knob that is rotatively supported by the knob holder, and an interference member that varies a rotating force by which the knob is rotatable while being supported by the knob holder and while the knob is at a predetermined location.

公开(公告)号：US11133240B2

公开(公告)日：2021-09-28

申请号：US16794782

申请日：2020-02-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hakseung Lee ,  Jinnam Kim ,  Kwangjin Moon ,  Eunji Kim ,  Taeseong Kim ,  Sangjun Park

IPC: H01L23/48 ,  H01L25/18 ,  H01L21/768 ,  H01L25/065 ,  H01L23/00

Abstract: A semiconductor device includes a semiconductor substrate including at least one semiconductor structure, an interlayer insulating layer disposed on the semiconductor substrate, at least one first via structure penetrating the semiconductor substrate and the interlayer insulating layer, including a first region having a first width at an upper surface of the interlayer insulating layer and a second region extending from the first region and having a second width at a lower surface of the semiconductor substrate, wherein a side surface of the first region and a side surface of the second region have different profiles at a boundary between the first region and the second region, and at least one second via structure penetrating the semiconductor substrate and the interlayer insulating layer and having a third width greater than the first width at an upper surface of the interlayer insulating layer.

公开(公告)号：US20180032368A1

公开(公告)日：2018-02-01

申请号：US15642257

申请日：2017-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hojung Choi ,  Sangjun Park ,  Hyeonsu Lee ,  Jongwoo Kim ,  Gilyoung Noh ,  Bohyung Lee ,  Junguk Lee ,  Jongkyu Lee ,  Jaekyong Choi ,  Inhwan Hwang ,  Mooyoung Kim

IPC: G06F9/48 ,  G06F9/54

CPC classification number: G06F9/48 ,  G06F9/485 ,  G06F9/543 ,  H04W52/0264 ,  Y02D70/00 ,  Y02D70/10 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/164 ,  Y02D70/166 ,  Y02D70/168 ,  Y02D70/20 ,  Y02D70/26

Abstract: A method and an apparatus for reducing power consumption of an electronic device are provided. The method includes executing an app in response to a first user input and switching the app to a background in response to a second user input. The method also includes confirming whether the app that has been switched to the background satisfies at least one condition and automatically limiting an operation of the app when the app that has been switched to the background satisfies the at least one condition. A result of the automatically limiting operation the operation of the app is displayed.