公开(公告)号：US20220189931A1

公开(公告)日：2022-06-16

申请号：US17483103

申请日：2021-09-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junsik HWANG ,  Seogwoo HONG ,  Kyungwook HWANG

IPC: H01L25/075 ,  H01L33/20 ,  H01L33/00 ,  H01L33/62 ,  H01L33/50

Abstract: A display transferring structure includes a transfer substrate including a plurality of recesses, each of the plurality of recesses including a first trap having a space in which a predetermined object can be moved and a second trap connected to the first trap and having a shape and size in which the object can be seated; and a micro-semiconductor chip positioned in the second trap. The micro-semiconductor chip may be self-aligned in a correct position by the display transferring structure.

公开(公告)号：US20220139887A1

公开(公告)日：2022-05-05

申请号：US17399683

申请日：2021-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Kyungwook HWANG ,  Joonyong PARK ,  Seogwoo HONG ,  Junsik HWANG

IPC: H01L25/075 ,  H01L33/62

Abstract: A method of manufacturing a micro-light-emitting diode (LED) array includes: providing a first substrate including a plurality of circular grooves formed on a first surface thereof; supplying a plurality of micro-LEDs onto the first surface of the first substrate; and aligning the plurality of micro-LEDs with the plurality of circular grooves, wherein at least two electrodes are formed on a second surface of each of the plurality of micro-LEDs to be apart from each other, and the at least two electrodes include a first electrode formed to be relatively close to a center of the second surface and at least one second electrode formed at an edge of the second surface.

公开(公告)号：US20220115359A1

公开(公告)日：2022-04-14

申请号：US17232964

申请日：2021-04-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Kyungwook HWANG ,  Joonyong PARK ,  Seogwoo HONG ,  Junsik HWANG

IPC: H01L25/075 ,  H01L25/16

Abstract: Provided is a micro-LED display, a micro-LED transferring substrate, and a method of transferring micro-LEDs using the micro-LED transferring substrate. The micro-LED includes a backplane substrate; and a plurality of sub-pixels provided on the backplane substrate, wherein at least one sub-pixel from among the plurality of sub-pixels includes a first micro-LED; and a second micro-LED different from the first micro-LED.

公开(公告)号：US20220077346A1

公开(公告)日：2022-03-10

申请号：US17194942

申请日：2021-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik HWANG ,  Seogwoo HONG

IPC: H01L33/04 ,  H01L33/32 ,  H01L33/62 ,  H01L25/075

Abstract: Provided is a micro light emitting device and a display apparatus having the micro light emitting device. The micro light emitting device includes a first-type semiconductor layer provided on a substrate, a superlattice layer provided on the first-type semiconductor layer, a current blocking layer provided on a side portion of the superlattice layer, an active layer provided on the superlattice layer and the current blocking layer, and a second-type semiconductor layer provided on the active layer.

公开(公告)号：US20210256237A1

公开(公告)日：2021-08-19

申请号：US17133175

申请日：2020-12-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Jinmyoung KIM ,  Seogwoo HONG

IPC: G06K9/00 ,  G06F3/044 ,  G06F3/047 ,  G06F3/041

Abstract: A sensor for recognizing a fingerprint and sensing a touch is provided. The sensor includes a touch sensing area in which a first touch electrode and a second touch electrode are arranged to provide touch sensing nodes at which touch sensing is performed; and a fingerprint-touch sensing area comprising a fingerprint recognition area in which a first fingerprint electrode and a second fingerprint electrode are arranged and electrically separated from the first touch electrode and the second touch electrode, the first fingerprint electrode and the second fingerprint electrode being configured to provide fingerprint sensing nodes at which a fingerprint is recognized in a fingerprint recognition mode, wherein in the fingerprint recognition area, a portion of the first fingerprint electrode and the second fingerprint electrode is used for fingerprint recognition and, as the touch sensing nodes, the touch sensing.

公开(公告)号：US20180137333A1

公开(公告)日：2018-05-17

申请号：US15586632

申请日：2017-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinmyoung KIM ,  Seogwoo HONG ,  Seokwhan CHUNG ,  Byungkyu LEE

IPC: G06K9/00

CPC classification number: G06K9/00053 ,  G06F3/044 ,  G06K9/0002

Abstract: A fingerprint sensor and a method of manufacturing the same are provided. The fingerprint sensor includes an active region including driving electrodes and sensing electrodes crossing the driving electrodes, tracer regions connected respectively to the driving electrodes and the sensing electrodes, and shield layers disposed respectively on the tracer regions.

公开(公告)号：US20250157883A1

公开(公告)日：2025-05-15

申请号：US18647903

申请日：2024-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Dongkyun KIM ,  Daehyuk SON ,  Hotaik LEE ,  Seogwoo HONG

IPC: H01L23/473 ,  H01L25/065

Abstract: A semiconductor device includes a semiconductor chip having a semiconductor integrated circuit. A cooling channel is formed in the semiconductor chip. At least a portion of the cooling channel is formed in the semiconductor chip. First wick structures may be arranged on a bottom of the cooling channel that is parallel to an upper surface of the semiconductor chip in a transverse direction. The first wick structures may move a liquid coolant by capillary action in the transverse direction along the bottom of the cooling channel. Second wick structures may be arranged along an inner surface of the vapor chamber and may move the liquid coolant by capillary action in the transverse direction along the inner surface of the vapor chamber.

公开(公告)号：US20250069919A1

公开(公告)日：2025-02-27

申请号：US18941170

申请日：2024-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong PARK ,  Dongho KIM ,  Hyunjoon KIM ,  Seogwoo HONG ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H01L21/67 ,  H01L21/673 ,  H01L33/00

Abstract: Provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (LEDs) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.

公开(公告)号：US20240079395A1

公开(公告)日：2024-03-07

申请号：US18114039

申请日：2023-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong Park ,  Dongho KIM ,  Hyunjoon KIM ,  Seogwoo HONG ,  Hyungwook HWANG ,  Junsik HWANG

IPC: H01L25/13 ,  H01L21/673

CPC classification number: H01L25/13 ,  H01L21/67333

Abstract: A method of mass-transferring a plurality of micro semiconductor chips, including mass-transferring a plurality of first micro semiconductor chips onto a first substrate such that they are disposed in a plurality of first grooves of the first substrate; determining whether an empty first groove is present; and positioning a second micro semiconductor chip in the empty first groove, wherein the positioning may include transferring a plurality of second micro semiconductor chips onto a second substrate separate from the first substrate; and adsorbing the second micro semiconductor chip from the second substrate, and positioning the adsorbed second micro semiconductor chip in the empty first groove, using an electrostatic force or an electromagnetic force.

公开(公告)号：US20240006199A1

公开(公告)日：2024-01-04

申请号：US18086992

申请日：2022-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Kyungwook HWANG ,  Dongkyun KIM ,  Dongho KIM ,  Joonyong PARK ,  Minchul YU ,  Seogwoo HONG ,  Junsik HWANG

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/68

CPC classification number: H01L21/67132 ,  H01L21/68 ,  H01L21/67333

Abstract: A chip wet transfer apparatus includes a first chip supply module configured to supply a large amount of micro-semiconductor chips to a transfer substrate, a first chip alignment module configured to align the large amount of micro-semiconductor chips in a plurality of grooves, a second chip supply module configured to supply a small amount of micro-semiconductor chips, and a second chip alignment module configured to align the small amount of micro-semiconductor chips.