公开(公告)号：US20210157372A1

公开(公告)日：2021-05-27

申请号：US16909337

申请日：2020-06-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hanhong Lee ,  Jaehong Park ,  Yusuf Cinar ,  Seongyun Baek

IPC: G06F1/18 ,  F21V17/10 ,  F21V33/00

Abstract: The present disclosure relates to a portable solid-state drive (SSD) module. The portable SSD module includes a case, an SSD, a light-emitting device (LED) module and a main bracket. The case may have a window. The SSD may be arranged in the case. The LED module may be arranged in the case to indicate an operation of the SSD through the window. The main bracket may be arranged in the case to support the LED module. Therefore, the LED module may be readily and firmly combined with the case.

公开(公告)号：US10955882B2

公开(公告)日：2021-03-23

申请号：US16057049

申请日：2018-08-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Jung Hoon Kim ,  Ki Taek Lee

IPC: G06F1/20 ,  G06F1/18 ,  H05K7/20

Abstract: A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.

公开(公告)号：US12131054B2

公开(公告)日：2024-10-29

申请号：US17877297

申请日：2022-07-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Eun Lee ,  Yusuf Cinar ,  Hyun Joon Yoo ,  Byung Il Lee

IPC: G06F3/06 ,  G06F1/18

CPC classification number: G06F3/0653 ,  G06F1/181 ,  G06F3/0619 ,  G06F3/0652 ,  G06F3/0656 ,  G06F3/0679

Abstract: A storage device includes a memory module including a memory device, a module board including a memory controller configured to control the memory device, and a memory connector disposed on one side of the module board. The storage device also includes a first enclosure disposed on a first surface of the memory module, a second enclosure disposed on a second surface opposite to the first surface of the memory module, and a first sensor disposed on the first enclosure and configured to detect a state and provide a signal for the state to the memory controller. The first enclosure includes a first long side extending in a first direction and a first short side extending in a second direction perpendicular to the first direction. A ratio of the first long side to the first short side ranges from 1.2 to 3.5.

公开(公告)号：USD1031737S1

公开(公告)日：2024-06-18

申请号：US29837335

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Han Hong Lee ,  Seon Gyun Baek

Abstract: FIG. 1 is a front perspective view of an extension kit for storage device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a rear perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the extension kit for storage device that form no part of the claimed design.

公开(公告)号：US11990701B2

公开(公告)日：2024-05-21

申请号：US17743197

申请日：2022-05-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seon Gyun Baek ,  Jae Hong Park ,  Yusuf Cinar ,  Han Hong Lee

IPC: H01R13/50 ,  H01R13/40 ,  H01R13/405 ,  H01R13/6581 ,  H01R13/6585 ,  H01R12/51 ,  H01R13/502 ,  H01R13/504 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6586 ,  H01R13/6587 ,  H01R24/60

CPC classification number: H01R13/50 ,  H01R13/40 ,  H01R13/405 ,  H01R13/6581 ,  H01R13/6585 ,  H01R12/51 ,  H01R13/502 ,  H01R13/504 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6586 ,  H01R13/6587 ,  H01R24/60 ,  H01R2201/06

Abstract: Provided are a receptacle connector configured to avoid damage to conductors of the receptacle connector. The receptacle connector includes a plurality of connection terminals, a mold structure which comprises a front part exposing each of the connection terminals and a support part disposed on a rear end of the front part and surrounding each of the connection terminals, and a shield which is disposed on the support part and comprises a conductive material, wherein the support part comprises a flat part which includes a surface along which the shield extends and a protruding part which protrudes from the surface of the flat part and is disposed in front of a front end of the shield. The protruding part is configured to avoid damage to conductors of the receptacle when a plug is mated to the receptacle.

公开(公告)号：US11979996B2

公开(公告)日：2024-05-07

申请号：US17217759

申请日：2021-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

IPC: H05K5/02 ,  H01L25/18 ,  H05K1/18

CPC classification number: H05K5/0217 ,  H05K5/026 ,  H01L25/18 ,  H05K1/181 ,  H05K2201/10159

Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.

公开(公告)号：USD996424S1

公开(公告)日：2023-08-22

申请号：US29805543

申请日：2021-08-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof; and,
FIG. 3 is a top plan view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.

公开(公告)号：USD989767S1

公开(公告)日：2023-06-20

申请号：US29837318

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Han Hong Lee ,  Seon Gyun Baek

Abstract: FIG. 1 is a front perspective view of an extension kit for storage device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a rear perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the extension kit for storage device that form no part of the claimed design.

公开(公告)号：USD986901S1

公开(公告)日：2023-05-23

申请号：US29805779

申请日：2021-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof, and,
FIG. 8 is a bottom perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.

公开(公告)号：USD986899S1

公开(公告)日：2023-05-23

申请号：US29805768

申请日：2021-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.