公开(公告)号：US10955882B2

公开(公告)日：2021-03-23

申请号：US16057049

申请日：2018-08-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Jung Hoon Kim ,  Ki Taek Lee

IPC: G06F1/20 ,  G06F1/18 ,  H05K7/20

Abstract: A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.

公开(公告)号：US10890796B2

公开(公告)日：2021-01-12

申请号：US16441653

申请日：2019-06-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ki Taek Lee ,  Hae Jung Yang ,  Hee Youb Kang ,  Young Rok Oh ,  Hee Chul Lee

IPC: G02F1/1334 ,  H05K7/20 ,  G02F1/1347

Abstract: An electronic device includes a circuit board including at least one electronic component, a housing accommodating the circuit board, an emissivity control layer disposed in an upper portion of the circuit board and transmitting radiant heat generated by the electronic component, and a temperature controller controlling an amount of the radiant heat transmitted to the housing by adjusting the emissivity of the emissivity control layer. The temperature controller may adjust the emissivity of the emissivity control layer to a first range value, when the electronic device is in an idle state, not performing a foreground operation, and may adjust the emissivity of the emissivity control layer to a second range value, lower than the first range value, when the electronic device is in a busy state, performing the foreground operation.

公开(公告)号：US20190278343A1

公开(公告)日：2019-09-12

申请号：US16057049

申请日：2018-08-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yusuf CINAR ,  Jae Hong Park ,  Han Hong Lee ,  Jung Hoon Kim ,  Ki Taek Lee

IPC: G06F1/20 ,  G06F1/18

Abstract: A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.