公开(公告)号：US12219721B2

公开(公告)日：2025-02-04

申请号：US18529889

申请日：2023-12-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

IPC: H05K5/02 ,  H01R12/70 ,  H01R12/72 ,  H01R12/73 ,  H01R13/621 ,  H05K5/00 ,  H05K7/20 ,  H01L25/18 ,  H05K1/11 ,  H05K1/18

Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.

公开(公告)号：USD988318S1

公开(公告)日：2023-06-06

申请号：US29805535

申请日：2021-08-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is another perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.

公开(公告)号：US11877410B2

公开(公告)日：2024-01-16

申请号：US17217759

申请日：2021-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

IPC: H05K5/02 ,  H01R12/70 ,  H01R12/72 ,  H01R12/73 ,  H01R13/621 ,  H05K5/00 ,  H05K7/20 ,  H01L25/18 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K5/0217 ,  H01R12/7023 ,  H01R12/721 ,  H01R12/73 ,  H01R13/621 ,  H05K5/0008 ,  H05K5/026 ,  H05K7/20409 ,  H01L25/18 ,  H05K1/117 ,  H05K1/181 ,  H05K7/20445 ,  H05K2201/09063 ,  H05K2201/10159

Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.

公开(公告)号：USD997939S1

公开(公告)日：2023-09-05

申请号：US29805536

申请日：2021-08-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a left-side view thereof; and,
FIG. 4 is a top plan view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.

公开(公告)号：US20170293585A1

公开(公告)日：2017-10-12

申请号：US15334874

申请日：2016-10-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Han Hong Lee ,  Jae Hong Park ,  Jung Hyun Woo ,  Sung Woo Joo ,  Chang Hoon Han

IPC: G06F13/40 ,  G06F13/42 ,  G11C5/02 ,  G06F13/36

CPC classification number: G06F13/4068 ,  G06F13/36 ,  G06F13/4027 ,  G06F13/4282 ,  G06F2213/0032 ,  G06F2213/0042 ,  G11C5/025 ,  G11C5/04 ,  H01R12/716 ,  H04L69/08

Abstract: A bridge hoard includes a printed circuit board (PCB) and a protocol converter mounted on the PCB to perform a conversion operation converting between a first communication protocol and a second communication protocol different from the first communication protocol. The bridge board further includes a first connector configured to communicate according to the first communication protocol and a second connector configured to communicate according to the second communication protocol. The bridge board additionally includes a hole formed in the PCB. The PCB is shaped as a concave polygon. The concave polygon includes a first region and a second region. The first region includes a first edge and a second edge, which extends in parallel to the first edge, along a first direction. The second region includes a third edge and a fourth edge, which extends in parallel to the third edge, along a second direction perpendicular to the first direction.

公开(公告)号：US11889643B2

公开(公告)日：2024-01-30

申请号：US17329900

申请日：2021-05-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Han Hong Lee ,  Jae Hong Park ,  Seon Gyun Baek ,  Yusuf Cinar

IPC: H05K5/02 ,  H05K5/00

CPC classification number: H05K5/0221 ,  H05K5/0008 ,  H05K5/023

Abstract: An extension kit includes a case, a locking lever, and a first elastic member. The case has an interior space which extends in a first direction. The locking lever includes a lever portion which is rotatable about a first rotation axis extending in a second direction intersecting the first direction, a plate portion which extends from the lever portion and which is exposed at the case, an arm portion which extends in the second direction from the plate portion, and a first locking portion which protrudes from the arm portion. The first elastic member is provided in the interior space of the case and elastically connects the case and the locking lever in the interior space of the case.

公开(公告)号：USD987640S1

公开(公告)日：2023-05-30

申请号：US29837307

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Han Hong Lee ,  Seon Gyun Baek

Abstract: FIG. 1 is a front perspective view of an extension kit for storage device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a rear perspective view thereof.
The evenly dashed broken lines in the figures depict features of the extension kit for storage device that form no part of the claimed design.

公开(公告)号：US10955882B2

公开(公告)日：2021-03-23

申请号：US16057049

申请日：2018-08-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Jung Hoon Kim ,  Ki Taek Lee

IPC: G06F1/20 ,  G06F1/18 ,  H05K7/20

Abstract: A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.

公开(公告)号：US10120824B2

公开(公告)日：2018-11-06

申请号：US15334874

申请日：2016-10-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Han Hong Lee ,  Jae Hong Park ,  Jung Hyun Woo ,  Sung Woo Joo ,  Chang Hoon Han

IPC: G06F13/40 ,  G06F13/42 ,  G11C5/02 ,  G06F13/36 ,  H01R12/71 ,  H04L29/06 ,  G11C5/04

Abstract: A bridge hoard includes a printed circuit board (PCB) and a protocol converter mounted on the PCB to perform a conversion operation converting between a first communication protocol and a second communication protocol different from the first communication protocol. The bridge board further includes a first connector configured to communicate according to the first communication protocol and a second connector configured to communicate according to the second communication protocol. The bridge board additionally includes a hole formed in the PCB. The PCB is shaped as a concave polygon. The concave polygon includes a first region and a second region. The first region includes a first edge and a second edge, which extends in parallel to the first edge, along a first direction. The second region includes a third edge and a fourth edge, which extends in parallel to the third edge, along a second direction perpendicular to the first direction.

公开(公告)号：USD998612S1

公开(公告)日：2023-09-12

申请号：US29805549

申请日：2021-08-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Designer： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Seon Gyun Baek ,  Won-Gi Hong

Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof; and,
FIG. 3 is a top plan view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.