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    SOLID-STATE DRIVE CASE AND SOLID-STATE DRIVE DEVICE USING THE SAME
    1.
    发明申请
    SOLID-STATE DRIVE CASE AND SOLID-STATE DRIVE DEVICE USING THE SAME 审中-公开

    公开(公告)号：US20190278343A1

    公开(公告)日：2019-09-12

    申请号：US16057049

    申请日：2018-08-07

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yusuf CINAR ,  Jae Hong Park ,  Han Hong Lee ,  Jung Hoon Kim ,  Ki Taek Lee

    IPC: G06F1/20 ,  G06F1/18

    Abstract: A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.

    Semiconductor light emitting device package and method for manufacturing the same
    2.
    发明授权
    Semiconductor light emitting device package and method for manufacturing the same 有权

    公开(公告)号：US10170663B2

    公开(公告)日：2019-01-01

    申请号：US15659265

    申请日：2017-07-25

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Il Woo Park ,  Jung Hoon Kim

    IPC: H01L21/00 ,  H01L33/00 ,  H01L33/50 ,  H01L33/20

    Abstract: A method for manufacturing a semiconductor light emitting device package includes forming a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially stacked on a growth substrate, forming a reflective layer on a first surface of the light emitting structure corresponding to a surface of the second conductivity-type semiconductor layer, forming bumps on the first surface, the bumps being electrically connected to the first or second conductivity-type semiconductor layer and protruding from the reflective layer, bonding a support substrate to the bumps on the first surface, removing the growth substrate, bonding a light transmissive substrate coated with a wavelength conversion layer to a second surface of the light emitting structure from which the growth substrate is removed, and removing the support substrate. The reflective layer covers at least portions of side surfaces of the light emitting structure and the bumps.

    Memory storage device and electronic device including nonvolatile memory
    3.
    发明授权
    Memory storage device and electronic device including nonvolatile memory 有权

    公开(公告)号：US11592982B2

    公开(公告)日：2023-02-28

    申请号：US17202817

    申请日：2021-03-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jung Hoon Kim ,  Seong Hun Kim ,  Hong Kug Kim ,  Won Jung

    IPC: G06F12/02 ,  G06F3/06 ,  G06N3/08

    Abstract: An electronic device comprising a nonvolatile memory, a memory controller configured to control the nonvolatile memory, and a host connected to the memory controller. In response to a first write signal received from the host, the memory controller is configured to provide the first write signal to the nonvolatile memory, the nonvolatile memory is configured to perform a write operation based on the provided first write signal, generate first metadata based on a result of performing the write operation, and provide the generated first metadata to the host. The host is configured to determine whether to perform garbage collection for the nonvolatile memory using a neural network model trained based on the provided first metadata or the first write signal, provide a garbage collection request signal to the memory controller in response to determining to perform garbage collection.

    Solid-state drive case and solid-state drive device using the same
    4.
    发明授权
    Solid-state drive case and solid-state drive device using the same 有权

    公开(公告)号：US10955882B2

    公开(公告)日：2021-03-23

    申请号：US16057049

    申请日：2018-08-07

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yusuf Cinar ,  Jae Hong Park ,  Han Hong Lee ,  Jung Hoon Kim ,  Ki Taek Lee

    IPC: G06F1/20 ,  G06F1/18 ,  H05K7/20

    Abstract: A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.

    Lighting system for light emitting diode having gas detection function
    5.
    发明授权
    Lighting system for light emitting diode having gas detection function 有权
    具有气体检测功能的发光二极管照明系统

    公开(公告)号：US09047754B2

    公开(公告)日：2015-06-02

    申请号：US13900528

    申请日：2013-05-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jung Hoon Kim

    IPC: G08B21/18 ,  F21V33/00 ,  G08B21/14 ,  F21Y101/02

    CPC classification number: G08B21/18 ,  F21V33/0076 ,  F21Y2115/10 ,  G08B21/14

    Abstract: A light emitting diode (LED) lighting system having a gas detection function may be used not only for lighting but also for detection of volatile organic compounds (VOCs) causing the sick house syndrome at home and other odorless and colorless non-combustible gas harmful to a human body. The LED lighting system may be used as an optical sensor showing with the fast response time and high sensitivity with respect to an environment harmful to a human body. In addition, since the presence of gas can be easily detected through a change of color in comparison to sound alarms for fire and gas contamination, emergency situations can be effectively handled.

    Abstract translation: 具有气体检测功能的发光二极管（LED）照明系统不仅可以用于照明，还可以用于检测导致家庭中的病房综合征的挥发性有机化合物（VOC）和其它无臭和无色的不可燃气体 一个人体 LED照明系统可以用作相对于对人体有害的环境的快速响应时间和高灵敏度的光学传感器。 此外，由于与用于火灾和气体污染的声音警报相比，通过改变颜色可以容易地检测到气体的存在，因此可以有效地处理紧急情况。

    Induction heating cooking apparatus and method of displaying cooking information thereof
    6.
    发明授权
    Induction heating cooking apparatus and method of displaying cooking information thereof 有权

    公开(公告)号：US11638332B2

    公开(公告)日：2023-04-25

    申请号：US16462330

    申请日：2017-11-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kil Young Lee ,  Jung Hoon Kim ,  Se Hoon Park ,  Ji Woong Choi

    IPC: H05B6/12 ,  H05B6/02 ,  H05B6/06 ,  G03B21/28 ,  G03B29/00

    Abstract: An induction heating cooking apparatus and a method of displaying cooking information of the induction heating cooking apparatus are provided, and more particularly, an induction heating cooking apparatus and a method of displaying cooking information of the induction heating cooking apparatus that provide cooking information to a user through a reflector positioned inside the induction heating cooking apparatus are disclosed. Some of the disclosed embodiments provide the induction heating cooking apparatus and the method of displaying cooking information of the induction heating cooking apparatus that provide the cooking information to the user using a projector and the reflector positioned inside the induction heating cooking apparatus.

    Light-emitting element mounting substrate and light-emitting package using the same
    7.
    发明授权
    Light-emitting element mounting substrate and light-emitting package using the same 有权

    公开(公告)号：US10347796B2

    公开(公告)日：2019-07-09

    申请号：US15438267

    申请日：2017-02-21

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jung Hoon Kim ,  Jacob-Changlin Tarn ,  Il Woo Park

    IPC: H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  H01L33/60

    Abstract: A light-emitting element mounting substrate is provided. The light-emitting element mounting substrate includes an insulating base plate comprising a first surface, a second surface facing the first surface, and a plurality of pad regions disposed on the first surface in an m-by-n matrix form, each of m and n being a natural number; a first conductive pad that is disposed in one of the plurality of pad regions and is in contact with the insulating base plate; a second conductive pad that is disposed in another one of the plurality of pad regions apart from the first conductive pad and is in contact with the insulating base plate; a first through hole disposed at a position corresponding to the first conductive pad to penetrate the insulating base plate; a second through hole that is disposed at a position corresponding to the second conductive pad to penetrate the insulating base plate and is spaced apart from the first through hole; a first through conduit filling the first through hole and being in contact with the first conductive pad; and a second through conduit filling the second through hole and being in contact with the second conductive pad.

    Semiconductor light emitting device package and method for manufacturing the same
    8.
    发明授权
    Semiconductor light emitting device package and method for manufacturing the same 有权

    公开(公告)号：US09735313B2

    公开(公告)日：2017-08-15

    申请号：US14972532

    申请日：2015-12-17

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Il Woo Park ,  Jung Hoon Kim

    IPC: H01L21/00 ,  H01L33/00 ,  H01L33/50 ,  H01L33/20

    CPC classification number: H01L33/0079 ,  H01L33/20 ,  H01L33/50 ,  H01L2224/11 ,  H01L2924/10155

    Abstract: A method for manufacturing a semiconductor light emitting device package includes forming a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially stacked on a growth substrate, forming a reflective layer on a first surface of the light emitting structure corresponding to a surface of the second conductivity-type semiconductor layer, forming bumps on the first surface, the bumps being electrically connected to the first or second conductivity-type semiconductor layer and protruding from the reflective layer, bonding a support substrate to the bumps on the first surface, removing the growth substrate, bonding a light transmissive substrate coated with a wavelength conversion layer to a second surface of the light emitting structure from which the growth substrate is removed, and removing the support substrate. The reflective layer covers at least portions of side surfaces of the light emitting structure and the bumps.

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