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公开(公告)号：US09735222B2
公开(公告)日：2017-08-15
申请号：US15098444
申请日：2016-04-14
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yusuke Nishido , Tatsuya Sakuishi
CPC classification number: H01L27/3276 , H01L51/0097 , H01L51/56 , H01L2227/323 , H01L2251/5338 , H05K1/11 , H05K3/0044 , H05K3/0047 , H05K3/0052 , H05K3/288 , H05K3/361 , H05K2201/09127 , H05K2203/0228 , Y02E10/549 , Y02P70/521
Abstract: A circuit board in which damage to an electrode is reduced or a light-emitting device in which damage to an electrode is reduced is manufactured. A method for manufacturing the circuit board or the light-emitting device includes the following steps: preparing a processing member including a circuit and a terminal electrode over a first substrate, a separation layer over the terminal electrode, a bonding layer over the separation layer, and a second substrate over the bonding layer; forming a groove in the processing member using a blade capable of cutting processing by being rotated; and removing part of the separation layer, part of the bonding layer, and part of the second substrate to expose part of the terminal electrode.
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公开(公告)号：US20160099434A1
公开(公告)日：2016-04-07
申请号：US14966630
申请日：2015-12-11
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Daiki Nakamura , Yusuke Nishido
IPC: H01L51/52
CPC classification number: H01L51/5246 , B32B17/06 , C03C27/06 , H01L27/322 , H01L27/3246 , H01L51/504 , H01L51/5056 , H01L51/5072 , H01L51/5088 , H01L51/5092 , H01L51/52 , H01L51/5206 , H01L51/5221 , H01L51/5281 , H01L51/5284 , H01L2251/533 , H01L2251/5361 , Y10T428/23
Abstract: A sealed structure with high sealing capability, in which a pair of substrates is attached to each other with a glass layer is provided. The sealed structure has a first and second substrates, a first surface of the first substrate facing a first surface of the second substrate, and the glass layer which is in contact with the first and second substrates, defines a space between the first and second substrates, and is provided along the periphery of the first surface of the first substrate. The first substrate has a corner portion. The area of the first surface of the first substrate is smaller than or equal to that of the first surface of the second substrate. In at least one of respective welded regions between the glass layer and the first or second substrate, the width of the corner portion is larger than that of the side portion.
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公开(公告)号：US11587904B2
公开(公告)日：2023-02-21
申请号：US16952303
申请日：2020-11-19
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Daiki Nakamura , Yusuke Nishido , Satoshi Seo , Toshiki Sasaki , Ryohei Yamaoka , Akihiro Kaita
IPC: H01L25/065 , H01L27/32
Abstract: A display panel includes a plurality of light-emitting elements. Light emitted from a first light-emitting element has a CIE 1931 chromaticity coordinate x of greater than 0.680 and less than or equal to 0.720 and a CIE 1931 chromaticity coordinate y of greater than or equal to 0.260 and less than or equal to 0.320. Light emitted from a second light-emitting element has a CIE 1931 chromaticity coordinate x of greater than or equal to 0.130 and less than or equal to 0.250 and a CIE 1931 chromaticity coordinate y of greater than 0.710 and less than or equal to 0.810. Light emitted from a third light-emitting element has a CIE 1931 chromaticity coordinate x of greater than or equal to 0.120 and less than or equal to 0.170 and a CIE 1931 chromaticity coordinate y of greater than or equal to 0.020 and less than 0.060.
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公开(公告)号：US20160155993A1
公开(公告)日：2016-06-02
申请号：US15014715
申请日：2016-02-03
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yusuke Nishido , Shunpei Yamazaki
CPC classification number: H01L51/56 , H01L27/322 , H01L27/3244 , H01L51/5068 , H01L51/5246 , H01L51/5259 , H01L2251/566 , H05B33/04
Abstract: A light-emitting device in which deterioration of an organic EL element due to impurities such as moisture or oxygen is suppressed is provided. The light-emitting device includes a first substrate and a second substrate facing each other, a light-emitting element provided over the first substrate, a first sealant provided so as to surround the light-emitting element, and a second sealant provided so as to surround the first sealant. One of the first sealant and the second sealant is a glass layer and the other is a resin layer. A dry agent is provided in a first space surrounded by the first sealant, the second sealant, the first substrate, and the second substrate, or in the resin layer. The light-emitting element is included in a second space surrounded by the first sealant, the first substrate, and the second substrate.
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Patent Agency Ranking
公开(公告)号：US09343706B2
公开(公告)日：2016-05-17
申请号：US13999502
申请日：2014-03-05
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Minato Ito , Kohei Yokoyama , Yusuke Nishido
CPC classification number: H01L51/529 , H01L27/322 , H01L27/3276 , H01L51/524 , H01L51/5246 , H01L2924/0002 , H01L2924/00
Abstract: Provided is a device in which heat conduction from a sealant to a functional element is suppressed and whose bezel is slim. The sealing structure includes a first substrate, a second substrate whose surface over which a sealed component is provided faces the first substrate, and a frame-like sealant which seals a space between the first substrate and the second substrate with the first substrate and the second substrate. The second substrate includes a groove portion between the sealant and the sealed component. The groove portion is in a vacuum or includes a substance whose heat conductivity is lower than that of the second substrate.
Abstract translation: 提供了一种从密封剂到功能元件的热传导被抑制并且其表圈苗条的装置。 所述密封结构包括第一基板，其表面上设有密封部件的第二基板面对所述第一基板;以及框状密封剂，其利用所述第一基板密封所述第一基板和所述第二基板之间的空间，并且所述第二基板 基质。 第二基板包括在密封剂和密封部件之间的槽部。 槽部处于真空状态，或者包含导热率低于第二基板的物质。
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26.发明授权Sealed structure, light-emitting device, electronic device, and lighting device 有权密封结构，发光装置，电子装置和照明装置公开(公告)号：US09214643B2
公开(公告)日：2015-12-15
申请号：US13686335
申请日：2012-11-27
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Daiki Nakamura , Yusuke Nishido
IPC: H01L27/146 , H01L51/52 , B32B17/06 , C03C27/06 , H01L27/32
CPC classification number: H01L51/5246 , B32B17/06 , C03C27/06 , H01L27/322 , H01L27/3246 , H01L51/504 , H01L51/5056 , H01L51/5072 , H01L51/5088 , H01L51/5092 , H01L51/52 , H01L51/5206 , H01L51/5221 , H01L51/5281 , H01L51/5284 , H01L2251/533 , H01L2251/5361 , Y10T428/23
Abstract: A sealed structure with high sealing capability, in which a pair of substrates is attached to each other with a glass layer is provided. The sealed structure has a first and second substrates, a first surface of the first substrate facing a first surface of the second substrate, and the glass layer which is in contact with the first and second substrates, defines a space between the first and second substrates, and is provided along the periphery of the first surface of the first substrate. The first substrate has a corner portion. The area of the first surface of the first substrate is smaller than or equal to that of the first surface of the second substrate. In at least one of respective welded regions between the glass layer and the first or second substrate, the width of the corner portion is larger than that of the side portion.
Abstract translation: 提供了一种具有高密封能力的密封结构，其中一对基板通过玻璃层彼此附接。 密封结构具有第一和第二基板，第一基板的第一表面面向第二基板的第一表面，与第一和第二基板接触的玻璃层限定第一和第二基板之间的空间 并且沿着第一基板的第一表面的周边设置。 第一基板具有角部。 第一基板的第一表面的面积小于或等于第二基板的第一表面的面积。 在玻璃层和第一或第二基板之间的至少一个焊接区域中，角部的宽度大于侧部的宽度。
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公开(公告)号：US09105869B2
公开(公告)日：2015-08-11
申请号：US14546157
申请日：2014-11-18
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor： Yusuke Nishido
CPC classification number: H01L51/524 , H01L27/3251 , H01L51/0097 , H01L51/5243 , H01L51/5246 , H01L2251/5315 , H01L2251/5338 , H05B33/04 , Y02E10/549 , Y02P70/521
Abstract: A light-emitting device which is thin and lightweight and has high flexibility, impact resistance, and reliability is provided. Further, a light-emitting device which is thin and lightweight and has high flexibility, impact resistance, and hermeticity is provided. In the light-emitting device in which a light-emitting region including a transistor and a light-emitting element is sealed between a first flexible substrate and a second flexible substrate, an opening is provided in the second flexible substrate around a region overlapping with the light-emitting region, the opening is filled with frit glass containing low-melting glass and bonding the first flexible substrate and the second flexible substrate, and the fit glass is provided so as to be in contact with an insulating layer provided over the first flexible substrate. The second flexible substrate may include an opening in a region overlapping with the light-emitting region.
Abstract translation: 提供了一种轻薄且具有高柔性，耐冲击性和可靠性的发光装置。 此外，提供了一种轻薄且具有高柔性，耐冲击性和密封性的发光装置。 在包括晶体管和发光元件的发光区域密封在第一柔性基板和第二柔性基板之间的发光装置中，在与第二柔性基板重叠的区域的第二柔性基板中设置开口 发光区域，开口填充有含有低熔点玻璃的熔结玻璃并且接合第一柔性基板和第二柔性基板，并且配合玻璃被设置成与设置在第一柔性基板上的绝缘层接触 基质。 第二柔性基板可以包括在与发光区域重叠的区域中的开口。
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公开(公告)号：US20140027743A1
公开(公告)日：2014-01-30
申请号：US13951031
申请日：2013-07-25
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yusuke Nishido
CPC classification number: H01L51/5253 , B32B3/30 , B32B7/12 , B32B7/14 , B32B9/002 , B32B9/005 , B32B15/043 , B32B15/18 , B32B15/20 , B32B2255/06 , B32B2255/26 , B32B2307/206 , B32B2457/00 , H01L27/3276 , H01L51/5246 , Y10T428/239
Abstract: A sealing structure with high air-tightness and an organic electroluminescence device with high air-tightness are provided regardless of a pattern of a first metal layer overlapping with glass frit. A second metal layer is provided in a region where a common power supply line overlaps with the glass frit. Since laser light is absorbed or reflected by the second metal layer, the glass frit can be uniformly heated. Therefore, an object to be sealed can be sealed with a low-melting-point glass in which a crack is not easily generated.
Abstract translation: 提供具有高气密性的密封结构和具有高气密性的有机电致发光器件，而不管第一金属层与玻璃料重叠的图案如何。 第二金属层设置在公共电源线与玻璃料重叠的区域中。 由于激光被第二金属层吸收或反射，所以可以均匀地加热玻璃料。 因此，可以用不容易产生裂纹的低熔点玻璃密封待密封的物体。
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29.发明申请公开(公告)号：US20130134570A1
公开(公告)日：2013-05-30
申请号：US13686252
申请日：2012-11-27
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Yusuke Nishido
CPC classification number: H01L33/0095 , H01L33/56 , H01L51/0096 , H01L51/52 , H01L51/5243 , H01L51/5246 , H01L51/56 , H01L2251/301 , H01L2924/0002 , H01L2924/00
Abstract: A sealed body in which sealing is uniformly performed is provided. A light-emitting module in which sealing is uniformly performed is provided. A method of manufacturing the sealed body in which sealing is uniformly performed is provided. The sealed body comprises a first substrate alternately provided with a high-reflectivity region with respect to the energy ray and a low-reflectivity region with respect to the energy ray so as to overlap with a sealant surrounding a sealed object, and a second substrate capable of transmitting the energy ray. The sealed object is sealed between the first substrate and the second substrate by heating the sealant with irradiation with the energy ray through the second substrate.
Abstract translation: 提供其中均匀地进行密封的密封体。 提供均匀地进行密封的发光模块。 提供一种制造其中均匀地进行密封的密封体的制造方法。 密封体包括相对于能量线交替设置有高反射率区域的第一基板和相对于能量射线的低反射率区域，以与密封物体周围的密封剂重叠，以及能够 传输能量射线。 通过用能量射线照射通过第二基板加热密封剂，将密封物体密封在第一基板和第二基板之间。
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