公开(公告)号：US20130112389A1

公开(公告)日：2013-05-09

申请号：US13704657

申请日：2011-04-25

申请人： Michiaki Yajima ,  Rei Yamamoto ,  Tooru Yoshikawa ,  Tomonori Seki

发明人： Michiaki Yajima ,  Rei Yamamoto ,  Tooru Yoshikawa ,  Tomonori Seki

IPC分类号： F28F21/08 ,  F28F21/02

CPC分类号： F28F21/08 ,  B32B15/06 ,  B32B15/08 ,  B32B27/18 ,  B32B2264/108 ,  C08K3/04 ,  C08K5/523 ,  C08K7/24 ,  F28F21/02 ,  H01L23/373 ,  H01L2924/0002 ,  Y10T156/1052 ,  H01L2924/00

摘要： The thermal conductive sheet of the present invention includes a base sheet and, on one surface of the base sheet, a metal foil (C) that has a thickness of from 1 to 30% of a thickness of the base sheet. The base sheet includes a binder component (A) that exhibits elasticity at room temperature and a graphite powder (B) that has anisotropy, and the graphite powder (B) is oriented in a thickness direction.

摘要翻译： 本发明的导热片包括基片，并且在基片的一个表面上具有厚度为基片厚度的1至30％的金属箔（C）。 基片包括在室温下显示弹性的粘合剂成分（A）和具有各向异性的石墨粉末（B），石墨粉末（B）在厚度方向上取向。

公开(公告)号：US20100033288A1

公开(公告)日：2010-02-11

申请号：US12458426

申请日：2009-07-10

申请人： Takeshi Yokoyama ,  Takafumi Yamada ,  Tomonori Seki ,  Masaharu Edo

发明人： Takeshi Yokoyama ,  Takafumi Yamada ,  Tomonori Seki ,  Masaharu Edo

IPC分类号： H01F5/00 ,  H01F41/00

CPC分类号： H01F17/0013 ,  H01F17/04 ,  H01F27/255 ,  H01F41/0246 ,  H01F41/046 ,  H01F2017/048 ,  H01L23/495 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  Y10T29/4902 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2924/01049

摘要： Two coil conductors of the same spiral shape are cut out from a lead frame. The two coil conductors are disposed back to back so that the front of a first coil conductor is superimposed over the rear of a second coil conductor. Central end portions of the first and second coil conductors are connected to each other through a connection layer. Outer end portions of the spirals of the first and second coil conductors are connected to corresponding ones of first and second terminals of the thin inductor, respectively. A sintered green sheet as a magnetic substance is disposed in gaps between the first and second coil conductors. In this manner, the invention can provide a thin inductor small in size, strong in mechanical strength and inexpensive, a method of producing the thin inductor, and an ultra small size power conversion apparatus using the thin inductor.

摘要翻译： 从引线框架切出具有相同螺旋形状的两个线圈导体。 两个线圈导体背靠背设置，使得第一线圈导体的前部叠加在第二线圈导体的后部上。 第一和第二线圈导体的中央端部通过连接层彼此连接。 第一和第二线圈导体的螺旋的外端部分别连接到薄电感器的相应的第一和第二端子。 作为磁性物质的烧结生片设置在第一和第二线圈导体之间的间隙中。 以这种方式，本发明可以提供一种尺寸小，机械强度低，价格便宜的薄型电感器，薄电感器的制造方法，以及使用该薄型电感器的超小型电力转换装置。

公开(公告)号：US07463126B2

公开(公告)日：2008-12-09

申请号：US11375518

申请日：2006-03-14

申请人： Takahiro Masuda ,  Tomonori Seki

发明人： Takahiro Masuda ,  Tomonori Seki

IPC分类号： H01H51/22

CPC分类号： H01H59/0009 ,  H01H1/0036 ,  H01H2001/0084 ,  H01H2001/0089 ,  H01H2059/0081

摘要： A micro electromechanical relay opens and closes an electrical circuit by contact/separation between a fixed contact disposed on a base and a movable contact disposed on an actuator by driving of a movable electrode by electrostatic attraction by application of voltage between a fixed electrode disposed on the base and a movable electrode of the actuator. The actuator comprises a supporting portion disposed on the base, a beam portion extending in a cantilevered manner from the supporting portion, and a movable electrode and a movable contact elastically supported by the beam portion. The beam portion elastically supports, in order from the supporting portion end, the movable electrode and the movable contact. A slit is formed from the side of the supporting portion in the portion of the actuator connecting the beam portion and the movable electrode.

摘要翻译： 微机电继电器通过设置在基座上的固定触点与设置在致动器上的可动触头之间的接触/分离来打开和闭合电路，该静触点通过静电吸引来驱动可动电极， 基座和致动器的可动电极。 致动器包括设置在基座上的支撑部分，从支撑部分以悬臂方式延伸的梁部分，以及可动电极和由​​梁部分弹性支撑的可动触头。 梁部分从支撑部分端起依次弹性地支撑可移动电极和活动触点。 在连接梁部分和可动电极的致动器的部分中，从支撑部分的侧面形成狭缝。

公开(公告)号：US07038301B2

公开(公告)日：2006-05-02

申请号：US10727060

申请日：2003-12-03

申请人： Tomonori Seki ,  Yutaka Uno ,  Takahiro Masuda

发明人： Tomonori Seki ,  Yutaka Uno ,  Takahiro Masuda

IPC分类号： H01L21/40

CPC分类号： H01P1/127 ,  H01H59/0009 ,  H01H2001/0084 ,  H01H2059/0063

摘要： A plurality of fixed contacts and signal lines are provided on a fixed substrate. A movable contact which is closed or opened with the fixed contacts is provided on a movable substrate opposed to the fixed substrate. A film thickness of the fixed contacts is made to be smaller than that of the signal lines so that the movable contact is set in a concave portion constituted by the fixed contacts when the fixed contacts, and the movable contact are closed and the signal lines are linearly connected.

摘要翻译： 多个固定触点和信号线设置在固定基板上。 在与固定基板相对的可移动基板上设置有用固定触点封闭或打开的可动触头。 使固定触点的膜厚小于信号线的膜厚，使得当固定触点和可动触点闭合并且信号线为...时，可动触点设置在由固定触点构成的凹部中 线性连接。

公开(公告)号：US06753487B2

公开(公告)日：2004-06-22

申请号：US10030493

申请日：2002-05-20

申请人： Mitsuru Fujii ,  Minoru Sakata ,  Tomonori Seki ,  Shobu Sato

发明人： Mitsuru Fujii ,  Minoru Sakata ,  Tomonori Seki ,  Shobu Sato

IPC分类号： H01H5700

CPC分类号： H01H59/0009 ,  H01H1/20

摘要： Fixed contacts (23A, 24A) are provided on the upper surface of a silicon substrate (21). Signal lines (23, 24) electrically continuous with the fixed contacts (23A, 24A) are provided so as to pass through a silicon substrate (21) from the obverse surface to the reverse surface thereof. Bumps (32, 33) electrically continuous with the signal lines (23, 24) are provided on the reverse surface of the silicon substrate (21). A fixed electrode (22) is provided on both sides of the fixed contacts (23A, 24A). Wiring conductors (30, 31) electrically continuous with the fixed electrode (22) are provided so as to pass through the silicon substrate (21) from the obverse surface to the reverse surface thereof. Bumps (34, 35) electrically continuous with the wiring conductors (30, 31) are provided on the reverse surface of the silicon substrate (21). Through holes (26, 27) of the silicon substrate (21) through which the signal lines (23, 24) are passed and through holes (28, 29) of the silicon substrate (21) through which the wiring conductors (30, 31) are passed are hermetically sealed by a movable substrate (40) or a cap (50).

摘要翻译： 固定触点（23A，24A）设置在硅衬底（21）的上表面上。 提供与固定触点（23A，24A）电连续的信号线（23,24），以从其正面穿过硅基板（21）到其背面。 在硅衬底（21）的背面设有与信号线（23,24）电连续的凸起（32,33）。 固定电极（22）设置在固定触点（23A，24A）的两侧。 提供与固定电极（22）电连续的接线导体（30,31），以从其正面穿过硅衬底（21）到其反面。 在硅基板（21）的背面上设有与布线导体（30,31）电连续的凸起（34,35）。 信号线（23,24）通过的硅衬底（21）的通孔（26,27）和硅衬底（21）的通孔（28,29），布线导体（30,31） ）通过可动基板（40）或盖（50）气密密封。