摘要:
A micromachined actuator including a body or platform mounted to a suspension system anchored to a substrate. In one embodiment, the suspension system is comprised of a set of one or more spring flexures connecting the actuator body to the substrate with strain relief provided via connecting torsional elements. In another embodiment, the suspension system includes a first set of one or more spring flexures each with one end anchored to a largely rigid intermediate frame and the other end attached to the body. A second set of one or more flexures is attached between the intermediate frame and the substrate. A third actuator embodiment maximizes force electrode area to minimize voltage required for electrostatic actuation. A fourth embodiment provides electrical interconnect to an actuator or an actuator array using polysilicon with silicon nitride isolation. Actuators may be fabricated by combining the key features of all four embodiments or actuators may be fabricated using any combination of two or three of the embodiments.
摘要:
A class of electromechanical switch cell is disclosed that has improved switching speed and tolerance to array non-planarity, among other advantages. In one embodiment, the switch cell can include a movable foil that is anchored to the structure, but is not under tension in the unbiased state. In another embodiment, a flexible foil may be mechanically biased so that a portion of the foil is positioned proximate to a reference substrate.
摘要:
A variable capacitor having a groove portion formed in an insulating substrate, two upper portions of the substrate located on either side of the groove portion forming two lateral edges, a conductive layer covering the inside of the groove portion, a flexible conductive membrane, placed above the groove portion by bearing on the edges, a dielectric layer covering the conductive layer or the membrane to insulate the conductive layer and the membrane, and terminals of application of a voltage between the conductive layer and the membrane, and such that the depth of the groove portion continuously increases from one of the edges to the bottom of the groove portion, and that the conductive layer covers the inside of the groove portion at least to reach one of the two edges, that it may cover.
摘要:
A switch that is capable of responding at a high rate at a lower DC potential while providing high isolation. In this switch, a microstructure group, having microstructures, is used. By slightly moving the microstructures a small amount the group, as a whole, achieves a large amount of movement. Also, by this configuration, it is possible to decrease a DC potential to apply to control electrodes of the microstructures. As a result, a high isolation switch capable of operating at a high rate at a lower DC potential is realized.
摘要:
A variable capacitor having a groove portion formed in an insulating substrate, two upper portions of the substrate located on either side of the groove portion forming two lateral edges, a conductive layer covering the inside of the groove portion, a flexible conductive membrane, placed above the groove portion by bearing on the edges, a dielectric layer covering the conductive layer or the membrane to insulate the conductive layer and the membrane, and terminals of application of a voltage between the conductive layer and the membrane, and such that the depth of the groove portion continuously increases from one of the edges to the bottom of the groove portion, and that the conductive layer covers the inside of the groove portion at least to reach one of the two edges, that it may cover.
摘要:
Liquid metal microrelays may be made where a contact is formed by constraining a quantity of liquid metal at the end of a contact support suspended over a substrate. Movement of the contact support typically drags the liquid metal along the surface of the substrate and allows the liquid metal to bridge contacts located on the substrate. Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities due to impedance changes.
摘要:
In a method for forming a micromechanical device, a force associated with operation of the device is varied between locations spaced across a conductive element of the device. The method may be used to form a switch adapted such that a force associated with actuation of the switch varies between locations spaced across a contact element of the switch. The varied force may include a required closing force for the switch, an applied force during actuation of the switch, a restoring force tending to open the switch, and/or a sticking force tending to keep the switch closed. A variable-valued circuit element having a conductive element and conductive pad may also be formed, adapted such that a fraction of the conductive element which is moved to the proximity of the conductive pad is variable depending on a total magnitude of a force applied.
摘要:
A microswitch is realized that can be driven by low voltage, and at the same time, that has increased impedance between switch terminals when the switch is OFF. The relation between upper electrode (4), lower electrode (6), contact electrode (7), and signal lines (8) is arranged such that the minimum distance between contact electrode 7 and signal lines 8 is greater than the minimum distance between upper electrode 4 and lower electrode 6 when the microswitch is in the OFF state.
摘要:
An electrical contact element includes a support component of an effectively electrically insulating material, especially silicon, the support component including a supporting body and an armature integral with and hingedly connected to the supporting body, the armature carrying at least one electrical contact. The electrical contact element is accommodated in a housing which is hermetically sealed and either filled with an inert gas or evacuated. The housing includes at least one fixed contact, and the supporting body is shaped as a frame which has a recess in which the armature is received when electrical contact is established between the electrical contact carried by the armature and the fixed electrical contacts carried by the housing. The electrical contact element is made by material-removing techniques from a single substantially plate-shaped member and then the electrical contact is vapor-deposited thereon.
摘要:
An efficient deposition process is provided for fabricating reliable RF MEMS capacitive switches with multilayer ultrananocrystalline (UNCD) films for more rapid recovery, charging and discharging that is effective for more than a billion cycles of operation. Significantly, the deposition process is compatible for integration with CMOS electronics and thereby can provide monolithically integrated RF MEMS capacitive switches for use with CMOS electronic devices, such as for insertion into phase array antennas for radars and other RF communication systems.