Manufacturing method of semiconductor substrative and method and
apparatus for inspecting defects of patterns on an object to be
inspected
    21.
    发明授权
    Manufacturing method of semiconductor substrative and method and apparatus for inspecting defects of patterns on an object to be inspected 失效
    半导体衬底的制造方法以及用于检查待检查物体上的图案缺陷的方法和装置

    公开(公告)号:US5774222A

    公开(公告)日:1998-06-30

    申请号:US539886

    申请日:1995-10-06

    摘要: A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect which occurs on the pattern.

    摘要翻译: 一种用于以高分辨率检查被检查物体上的图案的微细缺陷的图案检测方法及其装置以及以高产率制造半导体晶片等半导体基板的半导体基板的制造方法和系统。 通过将通过物镜的环形照明照射到安装在台架上的晶片上,检查被检查物体上的微细图案,晶片上具有微细精细图案。 照明光可以根据在物镜的光瞳上检测到的图像而被圆形或椭圆偏振并且被控制,并且通过检测来自晶片的反射光来获得图像信号。 将图像信号与参考图像信号进行比较,并且检测出显示不一致的图案的一部分作为缺陷,从而同时以高分辨率检测微细微图案或微细图案上的缺陷。 此外,通过分析缺陷的原因和在图案上发生的缺陷因素来控制生产线的工艺条件。

    Method and apparatus for observing and inspecting defects
    22.
    发明授权
    Method and apparatus for observing and inspecting defects 有权
    观察和检查缺陷的方法和装置

    公开(公告)号:US07092095B2

    公开(公告)日:2006-08-15

    申请号:US10761493

    申请日:2004-01-20

    IPC分类号: G01J4/00

    摘要: A defect inspecting apparatus can detect finer defects with high resolution optical images of those defects. The apparatus includes a sample mounting device for mounting a sample; lighting and detecting apparatus for illuminating a patterned sample mounted on a mount and detecting the optical image of the reflected light obtained therefrom. A display displays the optical image detected by this lighting and detecting apparatus. An optical parameter setting device sets and displays optical parameters for the lighting and detecting apparatus on the display. An optical parameter adjusting apparatus adjusts optical parameters set for the lighting and detecting apparatus according to the optical parameters set by the optical parameter setting apparatus. A storage device stores comparative image data. A defect detecting device detects defects from patterns formed on the sample by comparing the optical image detected by the optical image detecting apparatus with the comparative image data stored in the storage.

    摘要翻译: 缺陷检查装置可以利用这些缺陷的高分辨率光学图像检测更细的缺陷。 该装置包括用于安装样品的样品安装装置; 照明和检测装置,用于照亮安装在安装件上的图案样品,并检测由其获得的反射光的光学图像。 显示器显示由该照明和检测装置检测的光学图像。 光学参数设定装置在显示器上设置并显示照明和检测装置的光学参数。 光学参数调整装置根据由光学参数设定装置设定的光学参数来调整对照明和检测装置设定的光学参数。 存储装置存储比较图像数据。 缺陷检测装置通过将由光学图像检测装置检测的光学图像与存储在存储器中的比较图像数据进行比较来检测在样本上形成的图案的缺陷。

    Manufacturing method of semiconductor substrate and method and apparatus for inspecting defects of patterns of an object to be inspected
    23.
    发明申请
    Manufacturing method of semiconductor substrate and method and apparatus for inspecting defects of patterns of an object to be inspected 失效
    半导体基板的制造方法以及检查被检查体的图案的缺陷的方法和装置

    公开(公告)号:US20070070336A1

    公开(公告)日:2007-03-29

    申请号:US11605242

    申请日:2006-11-29

    IPC分类号: G01N21/00

    摘要: A method of inspecting a specimen, including: emitting a light from a lamp of a light source; illuminating a specimen on which plural patterns are formed with the light emitted from the light source and, passed through an objective lens; forming an optical image of the specimen by collecting light reflected from the specimen by the illuminating and passed through the objective lens and a image forming lens; detecting the optical image with a TDI image sensor; and processing a signal outputted from the TDI image sensor and detecting a defect of a pattern among the plural patterns formed on the specimen, wherein the image detected by the TDI image sensor is formed with light having a wavelength selected from the wavelengths of the light emitted from the light source.

    摘要翻译: 一种检查样本的方法,包括:从光源的灯发射光; 用从光源发射的光照射形成有多个图案的样本,并通过物镜; 通过照射通过收集从样本反射的光并通过物镜和成像透镜来形成样本的光学图像; 用TDI图像传感器检测光学图像; 并处理从TDI图像传感器输出的信号,并且检测在样本上形成的多个图案之间的图案的缺陷,其中由TDI图像传感器检测到的图像由具有选自发射的光的波长的波长的光形成 从光源。

    Manufacturing method of semiconductor substrate and method and apparatus for inspecting defects of patterns of an object to be inspected
    24.
    发明授权
    Manufacturing method of semiconductor substrate and method and apparatus for inspecting defects of patterns of an object to be inspected 失效
    半导体基板的制造方法以及检查被检查体的图案的缺陷的方法和装置

    公开(公告)号:US07180584B2

    公开(公告)日:2007-02-20

    申请号:US10686584

    申请日:2003-10-17

    IPC分类号: G01N21/00

    摘要: A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect which occurs on the pattern.

    摘要翻译: 一种用于以高分辨率检查被检查物体上的图案的微细缺陷的图案检测方法及其装置以及以高产率制造半导体晶片等半导体基板的半导体基板的制造方法和系统。 通过将通过物镜的环形照明照射到安装在台架上的晶片上,检查被检查物体上的微细图案,晶片上具有微细精细图案。 照明光可以根据在物镜的光瞳上检测到的图像而被圆形或椭圆偏振并且被控制,并且通过检测来自晶片的反射光来获得图像信号。 将图像信号与参考图像信号进行比较,并且检测出显示不一致的图案的一部分作为缺陷,从而同时以高分辨率检测微细微图案或微细图案上的缺陷。 此外,通过分析缺陷的原因和在图案上发生的缺陷因素来控制生产线的工艺条件。

    Manufacturing method of semiconductor substrate and method and apparatus for inspecting defects of patterns of an object to be inspected
    26.
    发明授权
    Manufacturing method of semiconductor substrate and method and apparatus for inspecting defects of patterns of an object to be inspected 失效
    半导体基板的制造方法以及检查被检查体的图案的缺陷的方法和装置

    公开(公告)号:US06263099B1

    公开(公告)日:2001-07-17

    申请号:US09107432

    申请日:1998-06-30

    IPC分类号: G06K900

    摘要: A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect which occurs on the pattern.

    摘要翻译: 一种用于以高分辨率检查被检查物体上的图案的微细缺陷的图案检测方法及其装置以及以高产率制造半导体晶片等半导体基板的半导体基板的制造方法和系统。 通过将通过物镜的环形照明照射到安装在台架上的晶片上,检查被检查物体上的微细图案,晶片上具有微细精细图案。 照明光可以根据在物镜的光瞳上检测到的图像而被圆形或椭圆偏振并且被控制,并且通过检测来自晶片的反射光来获得图像信号。 将图像信号与参考图像信号进行比较,并且检测出显示不一致的图案的一部分作为缺陷,从而同时以高分辨率检测微细微图案或微细图案上的缺陷。 此外,通过分析缺陷的原因和在图案上发生的缺陷因素来控制生产线的工艺条件。

    Method and apparatus for detecting defects of a sample using a dark field signal and a bright field signal
    27.
    发明授权
    Method and apparatus for detecting defects of a sample using a dark field signal and a bright field signal 失效
    使用暗场信号和亮场信号来检测样本的缺陷的方法和装置

    公开(公告)号:US07463350B2

    公开(公告)日:2008-12-09

    申请号:US10981721

    申请日:2004-11-05

    IPC分类号: G01N21/00

    CPC分类号: G01N21/95684

    摘要: Disclosed is a method and apparatus for inspecting defects of patterns of a sample at high speed and with high sensitivity while damage of the sample arising from high-power pulsed light is reduced. Light emitted from a pulsed laser light source is transmitted through a pseudo continuous-wave forming optical system having an optical system capable of reducing energy per pulse and yet maintaining the entire amount of light of the pulsed light, a beam formation optical system, and a coherence reduction optical system, and a beam deflected by a deformation illumination optical system is made to reflect on a PBS to be irradiated on a wafer. The apparatus is configured so that the diffracted light from the wafer is focused by an objective lens, transmitted through light modulation units, focused to form a plurality of images on a plurality of image sensors in a visual-field divided parallel detection unit 12, and then defects are detected by a signal processing unit.

    摘要翻译: 公开了一种用于在高功率脉冲光下产生的样品损坏的情况下高速且高灵敏度地检查样品的图案的缺陷的方法和装置。 从脉冲激光光源发出的光通过伪连续波形成光学系统传输,该光学系统具有能够减少每脉冲能量并且仍保持脉冲光的光量,光束形成光学系统和 相干降低光学系统和由变形照明光学系统偏转的光束在PBS上反射以照射在晶片上。 该装置被配置为使得来自晶片的衍射光被物镜聚焦,透镜通过光调制单元被聚焦以在视野分割并行检测单元12中的多个图像传感器上形成多个图像,以及 那么由信号处理单元检测到缺陷。

    Method and apparatus for inspecting pattern defects
    28.
    发明授权
    Method and apparatus for inspecting pattern defects 失效
    检查图案缺陷的方法和装置

    公开(公告)号:US07359044B2

    公开(公告)日:2008-04-15

    申请号:US11180536

    申请日:2005-07-14

    IPC分类号: G01N21/00

    CPC分类号: G01N21/95 G01N2021/9513

    摘要: A method of inspecting pattern defects can detect target defects in various processes stably by reducing erroneous detection of grains and morphology and decreasing the influence of an intensity nonuniformity in interference light. For this purpose, lights emitted from two sources of illumination capable of outputting a plurality of wavelengths are reflected by a beam splitter and irradiated onto a wafer. Diffracted light from the wafer is converged by an objective lens, is made to pass through light modulation units and imaged on an image sensor in a light detection unit. Then, defects are detected in a signal processing unit. Further, the optical modulation unit is made to have a structure that uses a plurality of optical components selectively and which can be optimized according to target defects.

    摘要翻译: 检查图案缺陷的方法可以通过减少误差检测晶粒和形态并减少干涉光中的强度不均匀性的影响来稳定地检测各种工艺中的目标缺陷。 为此,从能够输出多个波长的两个照明源发射的光被分束器反射并照射到晶片上。 来自晶片的衍射光被物镜会聚,使其通过光调制单元并且成像在光检测单元中的图像传感器上。 然后,在信号处理单元中检测到缺陷。 此外,光调制单元具有选择性地使用多个光学部件并且可以根据目标缺陷进行优化的结构。