公开(公告)号：US07460220B2

公开(公告)日：2008-12-02

申请号：US11605242

申请日：2006-11-29

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G01N21/00

CPC分类号： G01N21/95607 ,  G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A method of inspecting a specimen, including: emitting a light from a lamp of a light source; illuminating a specimen on which plural patterns are formed with the light emitted from the light source and, passed through an objective lens; forming an optical image of the specimen by collecting light reflected from the specimen by the illuminating and passed through the objective lens and a image forming lens; detecting the optical image with a TDI image sensor; and processing a signal outputted from the TDI image sensor and detecting a defect of a pattern among the plural patterns formed on the specimen, wherein the image detected by the TDI image sensor is formed with light having a wavelength selected from the wavelengths of the light emitted from the light source.

摘要翻译： 一种检查样本的方法，包括：从光源的灯发射光; 用从光源发射的光照射形成有多个图案的样本，并通过物镜; 通过照射通过收集从样本反射的光并通过物镜和成像透镜来形成样本的光学图像; 用TDI图像传感器检测光学图像; 并处理从TDI图像传感器输出的信号，并且检测在样本上形成的多个图案之间的图案的缺陷，其中由TDI图像传感器检测到的图像由具有选自发射的光的波长的波长的光形成 从光源。

公开(公告)号：US5774222A

公开(公告)日：1998-06-30

申请号：US539886

申请日：1995-10-06

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G01N21/95 ,  G01N21/956 ,  G01N21/88

CPC分类号： G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect which occurs on the pattern.

摘要翻译： 一种用于以高分辨率检查被检查物体上的图案的微细缺陷的图案检测方法及其装置以及以高产率制造半导体晶片等半导体基板的半导体基板的制造方法和系统。 通过将通过物镜的环形照明照射到安装在台架上的晶片上，检查被检查物体上的微细图案，晶片上具有微细精细图案。 照明光可以根据在物镜的光瞳上检测到的图像而被圆形或椭圆偏振并且被控制，并且通过检测来自晶片的反射光来获得图像信号。 将图像信号与参考图像信号进行比较，并且检测出显示不一致的图案的一部分作为缺陷，从而同时以高分辨率检测微细微图案或微细图案上的缺陷。 此外，通过分析缺陷的原因和在图案上发生的缺陷因素来控制生产线的工艺条件。

公开(公告)号：US06404498B1

公开(公告)日：2002-06-11

申请号：US09588201

申请日：2000-06-06

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G01B1100

CPC分类号： G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A pattern detection method and apparatus for inspecting, with high resolution, a micro fine defect of a pattern on an inspected object, and a semiconductor substrate manufacturing method and system with a high yield. A micro fine pattern on the inspected object is inspected by annular-looped illumination through an objective lens onto a wafer, the wafer having micro fine patterns thereon. The illumination may be polarized and controlled according to an image detected on the pupil of the objective lens, and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect. Simultaneously, micro fine defects on the micro-fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect.

摘要翻译： 用于以高分辨率检查被检查物体上的图案的微细缺陷的图案检测方法和装置，以及高产率的半导体基板制造方法和系统。 被检查物体上的微细图案通过物镜通过环形照明被检查到晶片上，晶片上具有微细精细图案。 照明可以根据在物镜的光瞳上检测到的图像进行偏振和控制，并且通过检测来自晶片的反射光来获得图像信号。 将图像信号与参考图像信号进行比较，并且检测出显示不一致的图案的一部分作为缺陷。 同时，以高分辨率检测微细图案上的微细缺陷。 此外，通过分析缺陷的原因和缺陷因素来控制生产线的工艺条件。

公开(公告)号：US07061600B2

公开(公告)日：2006-06-13

申请号：US10098478

申请日：2002-03-18

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G01N21/00

CPC分类号： G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A pattern detection method and apparatus for inspecting, with high resolution, a micro fine defect of a pattern on an inspected object, and a semiconductor substrate manufacturing method and system with a high yield. A micro fine pattern on the inspected object is inspected by annular-looped illumination through an objective lens onto a wafer, the wafer having micro fine patterns thereon. The illumination may be polarized and controlled according to an image detected on the pupil of the objective lens, and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect. Simultaneously, micro fine defects on the micro-fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect.

公开(公告)号：US06263099B1

公开(公告)日：2001-07-17

申请号：US09107432

申请日：1998-06-30

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G06K900

CPC分类号： G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect which occurs on the pattern.

摘要翻译： 一种用于以高分辨率检查被检查物体上的图案的微细缺陷的图案检测方法及其装置以及以高产率制造半导体晶片等半导体基板的半导体基板的制造方法和系统。 通过将通过物镜的环形照明照射到安装在台架上的晶片上，检查被检查物体上的微细图案，晶片上具有微细精细图案。 照明光可以根据在物镜的光瞳上检测到的图像而被圆形或椭圆偏振并且被控制，并且通过检测来自晶片的反射光来获得图像信号。 将图像信号与参考图像信号进行比较，并且检测出显示不一致的图案的一部分作为缺陷，从而同时以高分辨率检测微细微图案或微细图案上的缺陷。 此外，通过分析缺陷的原因和在图案上发生的缺陷因素来控制生产线的工艺条件。

公开(公告)号：US20070070336A1

公开(公告)日：2007-03-29

申请号：US11605242

申请日：2006-11-29

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G01N21/00

CPC分类号： G01N21/95607 ,  G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A method of inspecting a specimen, including: emitting a light from a lamp of a light source; illuminating a specimen on which plural patterns are formed with the light emitted from the light source and, passed through an objective lens; forming an optical image of the specimen by collecting light reflected from the specimen by the illuminating and passed through the objective lens and a image forming lens; detecting the optical image with a TDI image sensor; and processing a signal outputted from the TDI image sensor and detecting a defect of a pattern among the plural patterns formed on the specimen, wherein the image detected by the TDI image sensor is formed with light having a wavelength selected from the wavelengths of the light emitted from the light source.

摘要翻译： 一种检查样本的方法，包括：从光源的灯发射光; 用从光源发射的光照射形成有多个图案的样本，并通过物镜; 通过照射通过收集从样本反射的光并通过物镜和成像透镜来形成样本的光学图像; 用TDI图像传感器检测光学图像; 并处理从TDI图像传感器输出的信号，并且检测在样本上形成的多个图案之间的图案的缺陷，其中由TDI图像传感器检测到的图像由具有选自发射的光的波长的波长的光形成 从光源。

公开(公告)号：US07180584B2

公开(公告)日：2007-02-20

申请号：US10686584

申请日：2003-10-17

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G01N21/00

CPC分类号： G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect which occurs on the pattern.

摘要翻译： 一种用于以高分辨率检查被检查物体上的图案的微细缺陷的图案检测方法及其装置以及以高产率制造半导体晶片等半导体基板的半导体基板的制造方法和系统。 通过将通过物镜的环形照明照射到安装在台架上的晶片上，检查被检查物体上的微细图案，晶片上具有微细精细图案。 照明光可以根据在物镜的光瞳上检测到的图像而被圆形或椭圆偏振并且被控制，并且通过检测来自晶片的反射光来获得图像信号。 将图像信号与参考图像信号进行比较，并且检测出显示不一致的图案的一部分作为缺陷，从而同时以高分辨率检测微细微图案或微细图案上的缺陷。 此外，通过分析缺陷的原因和在图案上发生的缺陷因素来控制生产线的工艺条件。

公开(公告)号：US06674890B2

公开(公告)日：2004-01-06

申请号：US09733092

申请日：2000-12-11

申请人： Shunji Maeda ,  Kenji Oka ,  Hiroshi Makihira ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Yukihiro Shibata ,  Chie Shishido

发明人： Shunji Maeda ,  Kenji Oka ,  Hiroshi Makihira ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Yukihiro Shibata ,  Chie Shishido

IPC分类号： G06K900

CPC分类号： G06T7/001 ,  G01R31/308 ,  G01R31/311 ,  G03F7/7065 ,  G06T7/0004 ,  G06T2207/10061 ,  G06T2207/30121 ,  G06T2207/30148

摘要： A pattern inspection method and apparatus in which an image of a first pattern formed on a sample and an image of a second pattern formed on the sample is detected. At least one of the first pattern image and the second pattern image is converted to a gray level so as to be substantially the same with each other by linear combination including a gain and offset. A defect of the sample is detected by using the first pattern image and the second pattern image at least one of which has been converted to the gray level and a result of the detection is outputted to an external storage or processor by a communication arrangement.

摘要翻译： 检测形成在样本上的第一图案的图像和形成在样本上的第二图案的图像的图案检查方法和装置。 第一图案图像和第二图案图像中的至少一个被转换为灰度级，以便通过包括增益和偏移的线性组合彼此基本相同。 通过使用第一图案图像和其中至少一个已经被转换为灰度级的第二图案图像和通过通信装置将检测结果输出到外部存储器或处理器来检测样本的缺陷。

公开(公告)号：US6091075A

公开(公告)日：2000-07-18

申请号：US87901

申请日：1998-06-01

申请人： Yukihiro Shibata ,  Shunji Maeda ,  Hiroshi Makihara ,  Minoru Yoshida ,  Yasuhiko Nakayama ,  Kenji Oka

发明人： Yukihiro Shibata ,  Shunji Maeda ,  Hiroshi Makihara ,  Minoru Yoshida ,  Yasuhiko Nakayama ,  Kenji Oka

IPC分类号： G01N21/95 ,  G02B21/24 ,  G01N21/00 ,  G01N21/88

CPC分类号： G02B21/241 ,  G01N21/9501

摘要： An automatic focus detection method comprises the steps of: irradiating onto a single spot of a sample a plurality of beams of illuminating light transmitted and condensed through an objective lens in a symmetrically diagonal manner with respect to an optical axis of the objective lens; branching reflected light from the same spot of the illuminated sample after transmission through the objective lens, in directions of illumination symmetrical with respect to the optical axis so as to obtain a plurality of optical images; and causing a photoelectric conversion device to receive the branched optical images for conversion to an electric signal representing light intensity distribution of the images, whereby a defocus of the sample is detected based on a discrepancy between the optical axis and the center of the light intensity distribution.

摘要翻译： 一种自动对焦检测方法，包括以下步骤：以相对于物镜的光轴对称对角线的方式，将通过物镜透射和聚光的多束照明光照射在样品的单个点上; 在相对于光轴对称的照明方向透射物镜之后，将来自照射样品的同一点的反射光分支，以获得多个光学图像; 并且使光电转换装置接收用于转换为表示图像的光强度分布的电信号的分支光学图像，由此基于光轴和光强度分布的中心之间的差异来检测样品的散焦 。

公开(公告)号：US06507417B1

公开(公告)日：2003-01-14

申请号：US09105222

申请日：1998-06-26

申请人： Hiroshi Makihira ,  Shunji Maeda ,  Kenji Oka ,  Minoru Yoshida ,  Yasuhiko Nakayama

发明人： Hiroshi Makihira ,  Shunji Maeda ,  Kenji Oka ,  Minoru Yoshida ,  Yasuhiko Nakayama

IPC分类号： H04N104

CPC分类号： G06T7/0004 ,  G06T2207/30148

摘要： An image pickup device for sensing a two-dimensional (2D) image while causing a projected image of an object to be sensed being projected onto a linear image sensor to relatively move with respect to the linear image sensor in a direction (V scanning) perpendicular to the internal scan (H scan) direction of the linear image sensor. This device includes a position detector circuit that detects the position of the object to be sensed, and a pixel size modifier circuit for changing or modifying the setup configuration of a pixel size in the V scan direction of the linear image sensor on the basis of a position detection signal indicative of the position of the to-be-sensed object as detected by the position detector circuit. The pixel size modifier circuit is operable based on the object position detection signal to periodically change the interval of H-scanning start pulses of the linear image sensor.

摘要翻译： 用于感测二维（2D）图像同时使待检测对象的投影图像投影到线性图像传感器上的图像拾取装置相对于线性图像传感器在垂直方向（V扫描）上相对移动 到线性图像传感器的内部扫描（H扫描）方向。 该装置包括检测待感测物体的位置的位置检测器电路和用于基于线性图像传感器的V扫描方向改变或修改像素尺寸的设置配置的像素尺寸修正器电路 位置检测信号，其指示由位置检测器电路检测到的待感测对象的位置。 像素尺寸修正器电路可以基于物体位置检测信号进行操作，以周期性地改变线性图像传感器的H扫描开始脉冲的间隔。