Abstract:
A method of manufacturing a semiconductor device that has a high-breakdown-voltage transistor, a low-voltage driving transistor and a MONOS type memory transistor includes a step of forming a stack film that includes at least an oxide silicon layer and a nitride silicon layer over a high-breakdown-voltage transistor forming region where the high-breakdown-voltage transistor is formed, a low-voltage driving transistor forming region where the low-voltage driving transistor is formed and a MONOS type memory transistor forming region where the MONOS type memory transistor is formed in a semiconductor layer, a step of removing the stack film formed in a first gate insulating layer forming region of the high-breakdown-voltage transistor and a step of forming a first gate insulating layer in the high-breakdown-voltage transistor forming region by thermal oxidation. The method also includes a step of removing the stack film formed in the low-voltage driving transistor forming region, a step of forming a second gate insulating layer in the low-voltage driving transistor forming region, a step of forming gate electrodes in the high-breakdown-voltage transistor forming region, the low-voltage driving transistor forming region and the MONOS type memory transistor forming region and a step of forming source/drain regions in the high-breakdown-voltage transistor forming region, the low-voltage driving transistor forming region and the MONOS type memory transistor forming region.
Abstract:
To provide a nonvolatile semiconductor memory device in which a disturb voltage onto a non-selected memory cell in writing operation is lessened, a nonvolatile semiconductor memory device, includes: a memory cell array equipped with a plurality of memory cells, a plurality of word lines, a plurality of bit lines, and a plurality of source lines; a word line control circuit to control the plurality of word lines; and a line control circuit to control the plurality of bit lines and the plurality of source lines. Each of the plurality of memory cells is equipped with a gate electrode, a first impurity region, a second impurity region, and an electron trap region, which is positioned between the gate electrode and a substrate, and is formed at least at the first impurity region side of both the first impurity region and second impurity region. At the time when a writing operation is performed for a selected memory cell, the word line control circuit provides a selected word line connected to the selected memory cell with a selection voltage, provides a non-selected word line with a first mis-erasing prevention voltage, and provides a source line that is not connected to the selected memory cell with a second mis-erasing prevention voltage.
Abstract:
A control system for a multiple cylinder engine includes a vapor fuel introduction system for introducing a vapor fuel vaporized in a fuel tank. A feedback device is used for setting an air fuel ratio feedback compensation value for each of the cylinders or each group of cylinders of the engine and for executing an air fuel ratio feedback control. A fuel supply device is used for supplying engine fuel for each cylinder so as to equalize the air fuel ratio feedback compensation values of each of the cylinders or each group of the cylinders regardless of a change of an operating condition of a vapor fuel introduction control. A desirable A/F feedback control can be accomplished regardless of the execution of the vapor fuel purge in the multiple cylinder engine.
Abstract:
A fluorine-containing polymer has a repeating unit of the general formula (2) and is produced by homopolymerization or copolymerization with another polymerizable double bond-containing monomer. In general formula (2), W represents a linking group; R1 each independently represents a perfluoroalkyl group; Q represents a unit structure formed by cleavage of a double bond of a polymerizable double bond-containing group; and M+ represents a hydrogen cation, a metal ion or a quaternary ammonium ion.
Abstract translation:含氟聚合物具有通式(2)的重复单元,并且通过与另一种可聚合双键的单体均聚或共聚制备。 在通式(2)中,W表示连接基团; R1各自独立地表示全氟烷基; Q表示通过裂解含可聚合双键的双键的双键形成的单元结构; M +表示氢阳离子,金属离子或季铵离子。
Abstract:
A solid-state imaging device is provided. The solid-state imaging device includes a plurality of arrayed pixels, an optical inner filter layer, and an inner-layer lens. Each of the plurality of arrayed pixels includes a photoelectric conversion portion and a pixel transistor. The optical inner filter layer is configured to block infrared light and faces a light-receiving surface of the photoelectric conversion portion of a desired pixel among the arrayed pixels. The inner-layer lens is formed below the optical inner filter layer.
Abstract:
There is provided a fluorine-containing polymer having a repeating unit of the general formula (2) and produced by homopolymerization or copolymerization with an other polymerizable double bond-containing monomer. In the formula, W represents a linking group; R1 each independently represents a perfluoroalkyl group; Q represents a unit structure formed by cleavage of a double bond of a polymerizable double bond-containing group; and M+ represents a hydrogen cation, a metal ion or a quaternary ammonium ion.There is also provided an antistatic agent using the above fluorine-containing polymer such that the antistatic agent can impart antistatic performance to an article stably over a long time and show excellent transparency.
Abstract translation:提供具有通式(2)的重复单元并通过与其它可聚合双键的单体均聚或共聚制备的含氟聚合物。 在该式中,W表示连接基团; R1各自独立地表示全氟烷基; Q表示通过裂解含可聚合双键的双键的双键形成的单元结构; M +表示氢阳离子,金属离子或季铵离子。 还提供了使用上述含氟聚合物的抗静电剂,使得抗静电剂能够长时间稳定地赋予制品抗静电性能并且显示出优异的透明性。
Abstract:
A semiconductor device includes a semiconductor element that is set up on a semiconductor layer, a light shielding wall that is set up around the semiconductor element, a hole that is set up on the light shielding wall, and a wiring layer that is electrically connected to the semiconductor element and is drawn out through the hole to the outside of the light shielding wall. The wiring layer has a pattern including a first part that is located within the hole and a second part that is located on the outside of the hole and has a larger width compared to the width of the first part, the width of the second part being the same with or larger than the width of the hole.
Abstract:
A semiconductor device includes: a semiconductor layer; a first area and a second area which are demarcated by a separation insulating layer provided on the semiconductor layer; a nonvolatile memory provided on the first area; a plurality of MOS transistors provided on the second area; a first interlayer insulating layer embedded between the plurality of MOS transistors on the second area; and a second interlayer insulating layer provided above the first area and the second area. The second interlayer insulating layer is provided as if covering the nonvolatile memory on the first area and, on the second area, provided, being above the first interlayer insulating layer, as if covering the MOS transistor.