Stable SRAM cell
    21.
    发明授权

    公开(公告)号:US08908409B2

    公开(公告)日:2014-12-09

    申请号:US14285410

    申请日:2014-05-22

    IPC分类号: G11C15/00 G11C11/412

    CPC分类号: G11C11/412 G11C11/419

    摘要: SRAM cells and SRAM cell arrays are described. In one embodiment, an SRAM cell includes a first inverter and a second inverter cross-coupled with the first inverter to form a first data storage node and a complimentary second data storage node for latching a value. The SRAM cell further includes a first pass-gate transistor and a switch transistor. A first source/drain of the first pass-gate transistor is coupled to the first data storage node, and a second source/drain of the first pass-gate transistor is coupled to a first bit line. The first source/drain of the switch transistor is coupled to the gate of the first pass-gate transistor.

    Stable SRAM Cell
    22.
    发明申请

    公开(公告)号:US20140254248A1

    公开(公告)日:2014-09-11

    申请号:US14285410

    申请日:2014-05-22

    IPC分类号: G11C11/412

    CPC分类号: G11C11/412 G11C11/419

    摘要: SRAM cells and SRAM cell arrays are described. In one embodiment, an SRAM cell includes a first inverter and a second inverter cross-coupled with the first inverter to form a first data storage node and a complimentary second data storage node for latching a value. The SRAM cell further includes a first pass-gate transistor and a switch transistor. A first source/drain of the first pass-gate transistor is coupled to the first data storage node, and a second source/drain of the first pass-gate transistor is coupled to a first bit line. The first source/drain of the switch transistor is coupled to the gate of the first pass-gate transistor.

    Semiconductor memory structure
    23.
    发明授权

    公开(公告)号:US11792977B2

    公开(公告)日:2023-10-17

    申请号:US17320049

    申请日:2021-05-13

    IPC分类号: H10B20/20

    CPC分类号: H10B20/20

    摘要: A semiconductor device includes a program word line and a read word line over an active region. Each of the program word line and the read word line extends along a line direction. Moreover, the program word line engages a first transistor channel and the read word line engages a second transistor channel. The semiconductor device also includes a first metal line over and electrically connected to the program word line and a second metal line over and electrically connected to the read word line. The semiconductor device further includes a bit line over and electrically connected to the first active region. Additionally, the program word line has a first width along a channel direction perpendicular to the line direction; the read word line has a second width along the channel direction; and the first width is less than the second width.

    INTEGRATED CIRCUIT DEVICE WITH REDUCED VIA RESISTANCE

    公开(公告)号:US20230062162A1

    公开(公告)日:2023-03-02

    申请号:US17461322

    申请日:2021-08-30

    摘要: A device includes a substrate, a contact, a first gate, a second gate, a dielectric feature between the gates, a via, and a conductive line. The gates are each adjacent the contact and aligned lengthwise with each other along a first direction. A first sidewall of the dielectric feature defines an end-wall of the first gate. A second sidewall of the dielectric feature defines an end-wall of the second gate. The conductive line extends along a second direction. A projection of the conductive line onto a top surface of the dielectric feature passes between the first and second sidewalls. The via interfaces with the contact along a second plane. The via has a first dimension on the second plane along the second direction; the contact has a second dimension on the second plane along the second direction. The first dimension is greater than the second dimension.