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公开(公告)号:US08908409B2
公开(公告)日:2014-12-09
申请号:US14285410
申请日:2014-05-22
发明人: Huai-Ying Huang , Yu-Kuan Lin , Sheng Chiang Hung , Feng-Ming Chang , Jui-Lin Chen , Ping-Wei Wang
IPC分类号: G11C15/00 , G11C11/412
CPC分类号: G11C11/412 , G11C11/419
摘要: SRAM cells and SRAM cell arrays are described. In one embodiment, an SRAM cell includes a first inverter and a second inverter cross-coupled with the first inverter to form a first data storage node and a complimentary second data storage node for latching a value. The SRAM cell further includes a first pass-gate transistor and a switch transistor. A first source/drain of the first pass-gate transistor is coupled to the first data storage node, and a second source/drain of the first pass-gate transistor is coupled to a first bit line. The first source/drain of the switch transistor is coupled to the gate of the first pass-gate transistor.
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公开(公告)号:US20140254248A1
公开(公告)日:2014-09-11
申请号:US14285410
申请日:2014-05-22
发明人: Huai-Ying Huang , Yu-Kuan Lin , Sheng Chiang Hung , Feng-Ming Chang , Jui-Lin Chen , Ping-Wei Wang
IPC分类号: G11C11/412
CPC分类号: G11C11/412 , G11C11/419
摘要: SRAM cells and SRAM cell arrays are described. In one embodiment, an SRAM cell includes a first inverter and a second inverter cross-coupled with the first inverter to form a first data storage node and a complimentary second data storage node for latching a value. The SRAM cell further includes a first pass-gate transistor and a switch transistor. A first source/drain of the first pass-gate transistor is coupled to the first data storage node, and a second source/drain of the first pass-gate transistor is coupled to a first bit line. The first source/drain of the switch transistor is coupled to the gate of the first pass-gate transistor.
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公开(公告)号:US11792977B2
公开(公告)日:2023-10-17
申请号:US17320049
申请日:2021-05-13
发明人: Hsin-Wen Su , Shih-Hao Lin , Yu-Kuan Lin , Lien-Jung Hung , Ping-Wei Wang
IPC分类号: H10B20/20
CPC分类号: H10B20/20
摘要: A semiconductor device includes a program word line and a read word line over an active region. Each of the program word line and the read word line extends along a line direction. Moreover, the program word line engages a first transistor channel and the read word line engages a second transistor channel. The semiconductor device also includes a first metal line over and electrically connected to the program word line and a second metal line over and electrically connected to the read word line. The semiconductor device further includes a bit line over and electrically connected to the first active region. Additionally, the program word line has a first width along a channel direction perpendicular to the line direction; the read word line has a second width along the channel direction; and the first width is less than the second width.
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公开(公告)号:US20230062162A1
公开(公告)日:2023-03-02
申请号:US17461322
申请日:2021-08-30
发明人: Jui-Lin Chen , Yu-Kuan Lin , Ping-Wei Wang
IPC分类号: H01L27/11 , H01L23/528 , H01L27/088
摘要: A device includes a substrate, a contact, a first gate, a second gate, a dielectric feature between the gates, a via, and a conductive line. The gates are each adjacent the contact and aligned lengthwise with each other along a first direction. A first sidewall of the dielectric feature defines an end-wall of the first gate. A second sidewall of the dielectric feature defines an end-wall of the second gate. The conductive line extends along a second direction. A projection of the conductive line onto a top surface of the dielectric feature passes between the first and second sidewalls. The via interfaces with the contact along a second plane. The via has a first dimension on the second plane along the second direction; the contact has a second dimension on the second plane along the second direction. The first dimension is greater than the second dimension.
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公开(公告)号:US20220336480A1
公开(公告)日:2022-10-20
申请号:US17854809
申请日:2022-06-30
发明人: Hsin-Wen Su , Lien Jung Hung , Ping-Wei Wang , Yu-Kuan Lin , Shih-Hao Lin
IPC分类号: H01L27/112 , G11C17/14 , H01L21/8234 , H01L29/66 , H01L23/525
摘要: In some embodiments, the present disclosure relates to a one-time program (OTP) memory cell. The OTP memory cell includes a read transistor and a program transistor neighboring the read transistor. The read transistor includes a read dielectric layer and a read gate electrode overlying the read dielectric layer. The program transistor includes a program dielectric layer and a program gate electrode overlying the program dielectric layer. The program transistor has a smaller breakdown voltage than the read transistor.
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公开(公告)号:US11411100B2
公开(公告)日:2022-08-09
申请号:US17037274
申请日:2020-09-29
发明人: Ping-Wei Wang , Chih-Chuan Yang , Yu-Kuan Lin , Choh Fei Yeap
IPC分类号: H01L29/66 , H01L29/417 , H01L29/786 , H01L29/40 , H01L23/00 , H01L27/11 , H01L29/78 , H01L23/528 , H01L29/423 , H01L29/775
摘要: A semiconductor structure and a method of forming the same are provided. In an embodiment, a semiconductor structure includes a source feature and a drain feature, a channel structure disposed between the source feature and the drain feature, a semiconductor layer disposed over the channel structure and the drain feature, a dielectric layer disposed over the semiconductor layer, a backside source contact over the source feature and extending through the semiconductor layer and the dielectric layer, and a backside power rail disposed over the dielectric layer and in contact with the backside source contact.
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公开(公告)号:US20220102535A1
公开(公告)日:2022-03-31
申请号:US17037274
申请日:2020-09-29
发明人: Pei-Wei Wang , Chih-Chuan Yang , Yu-Kuan Lin , Choh Fei Yeap
IPC分类号: H01L29/66 , H01L29/40 , H01L23/00 , H01L27/11 , H01L29/78 , H01L29/417 , H01L23/528
摘要: A semiconductor structure and a method of forming the same are provided. In an embodiment, a semiconductor structure includes a source feature and a drain feature, a channel structure disposed between the source feature and the drain feature, a semiconductor layer disposed over the channel structure and the drain feature, a dielectric layer disposed over the semiconductor layer, a backside source contact over the source feature and extending through the semiconductor layer and the dielectric layer, and a backside power rail disposed over the dielectric layer and in contact with the backside source contact.
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