公开(公告)号：US20230070168A1

公开(公告)日：2023-03-09

申请号：US17939036

申请日：2022-09-07

Applicant: TDK CORPORATION

Inventor： Yusuke NAGAI ,  Kazuhiro EBINA ,  Takahiro SATO ,  Kunihiko KAWASAKI ,  Shinichi SATO ,  Seiichi NAKAGAWA ,  Kouichi KAKUDA ,  Yuya ISHIMA ,  Mitsuru ITO

IPC: H01F27/29

Abstract: A multilayer coil component includes: an element body; a coil disposed in the element body; and a first external electrode disposed on a surface of the element body in which the first external electrode has a first electrode layer disposed on the surface of the element body and a first plating layer and a second plating layer disposed on the first electrode layer, and the first plating layer and the second plating layer are disposed so as to be scattered in a plurality of places on an edge of the first electrode layer.

公开(公告)号：US20220319766A1

公开(公告)日：2022-10-06

申请号：US17701448

申请日：2022-03-22

Applicant: TDK CORPORATION

Inventor： Akihiko OIDE ,  Makoto YOSHINO ,  Tomoki OKADA ,  Hideki SAITOU ,  Seiji OSADA ,  Kazuhiro EBINA ,  Kunio ODA ,  Takashi ABE ,  Akio SHIBATA ,  Kazuo IWAI

IPC: H01F27/29 ,  H01F17/00

Abstract: In the multi-layer coil component, the via conductor electrically connecting the coil layers adjacent to each other in the stacking direction of the element body protrudes from the coil region toward the side surface of the element body when viewed from the stacking direction of the element body. Therefore, the coil has a concave-convex portion. When a force is applied to the multi-layer coil component from the outside, the force is dispersed in the concave-convex portion of the coil, and thus defects are less likely to occur in the coil than in a coil in which the side of the side surfaces is flat.

公开(公告)号：US20220310299A1

公开(公告)日：2022-09-29

申请号：US17697212

申请日：2022-03-17

Applicant: TDK Corporation

Inventor： Akihiko OIDE ,  Makoto YOSHINO ,  Tomoki OKADA ,  Seiji OSADA ,  Yuuki OKAZAKI ,  Takeshi SASAKI ,  Mitsuru ITO ,  Kenta SASAKI ,  Kazuhiro EBINA ,  Takashi ABE ,  Hiroshi ONO

IPC: H01F17/00 ,  H01F27/28 ,  H01F27/29

Abstract: In the multi-layer inductor, the internal electrode includes the auxiliary conductor, and the auxiliary conductor is jointed to the external electrode at the end face. Therefore, when a defect occurs in a part of the through conductors, a current flows through the remaining through conductor(s) and a current also flows through the auxiliary conductor. Therefore, overheating at the joint surface between the remaining through conductor(s) and the external electrode can be prevented, and cutting and/or fusion starting from the joint surface can be prevented.

公开(公告)号：US20210383960A1

公开(公告)日：2021-12-09

申请号：US17337985

申请日：2021-06-03

Applicant: TDK CORPORATION

Inventor： Daiki KATO ,  Masashi SHIMOYASU ,  Yoji TOZAWA ,  Seiichi NAKAGAWA ,  Akihiko OIDE ,  Makoto YOSHINO ,  Kazuhiro EBINA

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04

Abstract: A multilayer conductor component includes an element body, an internal conductor, and an external electrode. The external electrode includes a sintered metal layer. The sintered metal layer is disposed on an end surface, a pair of side surfaces, a first main surface, and a second main surface of the element body. An electrode length, which is a length in the first direction from an edge of the sintered metal layer to a reference plane including the end surface, at a central portion of the first main surface in the third direction, is shorter than the electrode length at each of the ridge portions. The electrode length at a central portion of each of the pair of side surfaces in the second direction is equal to or less than the electrode length at each of the ridge portions.

公开(公告)号：US20210375527A1

公开(公告)日：2021-12-02

申请号：US17329348

申请日：2021-05-25

Applicant: TDK CORPORATION

Inventor： Masashi SHIMOYASU ,  Daiki KATO ,  Yoji TOZAWA ,  Takashi ENDO ,  Seiichi NAKAGAWA ,  Mitsuru ITO ,  Kenta SASAKI ,  Akihiko OIDE ,  Makoto YOSHINO ,  Kazuhiro EBINA

IPC: H01F27/29 ,  H01F27/28 ,  H01F41/04

Abstract: A multilayer inductor component includes an element body, an internal conductor, and an external electrode. The internal conductor is disposed in the element body. The external electrode is disposed on a surface of the element body and electrically connected to the internal conductor. The external electrode includes a sintered metal layer and a plating layer. The sintered metal layer is disposed on the surface of the element body. The plating layer covers the sintered metal layer. The sintered metal layer includes a thick portion and thin portions. The thick portion covers the surface of the element body. A plurality of glass particles is dispersed in the thick portion. The thin portions cover glass particles exposed on a surface of the thick portion among the plurality of glass particles and being in contact with the plating layer.

公开(公告)号：US20190122800A1

公开(公告)日：2019-04-25

申请号：US16158779

申请日：2018-10-12

Applicant: TDK CORPORATION

Inventor： Yuya OSHIMA ,  Shinichi KONDO ,  Junichi OTSUKA ,  Yohei TADAKI ,  Kazuo IWAI ,  Masayuki SUZUKI ,  Shigeshi OSAWA ,  Kazuhiro EBINA ,  Makoto YOSHINO ,  Mamoru KAWAUCHI

IPC: H01F17/00 ,  H01F27/29 ,  H01F27/245 ,  H01F27/28 ,  H01F5/00 ,  H01F41/04

Abstract: First internal conductors are separated from each other in a first direction. Each of the first internal conductors includes a coil portion and a pad portion having a width larger than a width of the coil portion. The pad portions adjacent to each other in the first direction are connected to each other via a through-hole conductor and overlap each other when viewed from the first direction. When viewed from the first direction, each of the coil portions includes a first portion not overlapping the pad portion adjacent in the first direction and a second portion overlapping a part of the pad portion adjacent in the first direction. A second internal conductor is disposed on the same layer as the second portion and is positioned to overlap a portion of the pad portion adjacent in the first direction not overlapping the second portion when viewed from the first direction.

公开(公告)号：US20180096789A1

公开(公告)日：2018-04-05

申请号：US15725129

申请日：2017-10-04

Applicant: TDK CORPORATION

Inventor： Yuya OSHIMA ,  Makoto YOSHINO ,  Yoji TOZAWA ,  Junichi OTSUKA ,  Kazuo IWAI ,  Yohei TADAKI ,  Shinichi KONDO ,  Kazuhiro EBINA ,  Mamoru KAWAUCHI

IPC: H01F41/04 ,  H01F27/28

CPC classification number: H01F41/043 ,  H01F17/0013 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/0066

Abstract: A method of manufacturing a laminated coil component is a method of manufacturing a laminated coil component provided with a laminate obtained by laminating a coil conductor forming a spiral coil and an insulator layer. The method of manufacturing a laminated coil component includes a step of providing a conductor pattern configured to become a coil conductor on a green sheet configured to become an insulator layer, and a step of laminating a plurality of green sheets provided with the conductor pattern. The conductor pattern includes a pair of first side surfaces opposed to each other in an orthogonal direction orthogonal to a laminating direction of the green sheet. At the step of laminating a plurality of green sheets, a depression is formed on at least one of the pair of first side surfaces.

公开(公告)号：US20170309389A1

公开(公告)日：2017-10-26

申请号：US15488876

申请日：2017-04-17

Applicant: TDK CORPORATION

Inventor： Shinichi SATO ,  Yohei TADAKI ,  Akihiko OIDE ,  Yuma ISHIKAWA ,  Hidekazu SATO ,  Kazuhiro EBINA ,  Hiroyuki TANOUE

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.