Multilayer ceramic electronic component

    公开(公告)号:US10650966B2

    公开(公告)日:2020-05-12

    申请号:US16270975

    申请日:2019-02-08

    Inventor: Toshihiro Iguchi

    Abstract: A multilayer ceramic electronic component such as a multilayer ceramic capacitor capable of maintaining insulation properties even when a current is passed through the capacitor after an occurrence of a short-circuit due to, for example, a high voltage or a high current is provided. A multilayer ceramic electronic component including an element body 4 formed by laminating dielectric layers 10 and internal electrode layers 12 alternately. The internal electrode layers contains copper and/or silver as a main component. The dielectric voidage is lower than the internal electrode voidage.

    Ceramic electronic device having a copper-containing baked electrode layer

    公开(公告)号:US12283430B2

    公开(公告)日:2025-04-22

    申请号:US17894293

    申请日:2022-08-24

    Abstract: A ceramic electronic device includes an element body including a ceramic layer and an internal electrode layer, and an external electrode formed on an end surface of the element body and electrically connected to at least one end of the internal electrode layer. The external electrode includes a baked electrode layer. The baked electrode layer includes a main component comprising copper and/or a copper alloy. The baked electrode layer includes a void. An inner wall surface defining the void is at least partly covered by a film comprising nickel and/or a nickel alloy.

    ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT STRUCTURE

    公开(公告)号:US20240321518A1

    公开(公告)日:2024-09-26

    申请号:US18609537

    申请日:2024-03-19

    CPC classification number: H01G4/232 H01G2/065 H01G4/008 H01G4/012 H01G4/30

    Abstract: An electronic component includes an element body portion and a terminal electrode portion formed. The terminal electrode portion includes a base electrode layer that is in direct contact with the end surface and a surface electrode layer that covers the base electrode layer and constitutes an outermost surface of the terminal electrode portion. A relation between a thickness T2 of the surface electrode layer and a thickness T4 of the surface electrode layer satisfies 1.3≤T4/T2≤15.0, while the T2 is along a second reference line parallel to the lower surface and passes through a height of three quarters of the entire element body portion from the lower surface, and the T4 is along a fourth reference line parallel to the lower surface and passes through a height of one quarter of the entire element body portion from the lower surface.

Patent Agency Ranking