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公开(公告)号:US20210065975A1
公开(公告)日:2021-03-04
申请号:US17004334
申请日:2020-08-27
Applicant: TDK CORPORATION
Inventor: Yuya ISHIMA , Shinichi KONDO , Kosuke ITO , Shingo HATTORI , Takashi SUZUKI , Hidenobu UMEDA
Abstract: A method for producing a multilayer coil component includes forming, on a main face of a substrate, a first coil conductor extending along the main face having conductivity, forming a second coil conductor and a third coil conductor apart from each other in a direction in which the first coil conductor extends and each extending from the first coil conductor in a first direction orthogonal to the main face, and forming a fourth coil conductor electrically connected to an end of the second coil conductor opposite to the first coil conductor and extending along the main face. The forming the first coil conductor includes forming, on the main face, a first insulator layer provided with a first penetration portion having a shape corresponding to the first coil conductor and exposing a part of the main face, and forming, by plating, the first coil conductor in the first penetration portion.
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公开(公告)号:US20210012947A1
公开(公告)日:2021-01-14
申请号:US16922533
申请日:2020-07-07
Applicant: TDK CORPORATION
Inventor: Yuya ISHIMA , Shinichi KONDO , Kosuke ITO , Shingo HATTORI , Kazuya TOBITA , Noriaki HAMACHI , Atsushi MORIYA
Abstract: An electronic component according to an aspect of the present disclosure includes an element body and a terminal electrode. The element body includes an outer surface provided with a depression. The terminal electrode is disposed on the element body. The terminal electrode includes a first electrode portion and a second electrode portion. The first electrode portion is disposed in the depression. The second electrode portion protrudes from the depression. The second electrode portion is thicker than the first electrode portion.
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公开(公告)号:US20170365385A1
公开(公告)日:2017-12-21
申请号:US15618493
申请日:2017-06-09
Applicant: TDK CORPORATION
Inventor: Takashi SUZUKI , Hidekazu SATO , Yuusuke NAGAI , Kouichi KAKUDA , Kunihiko KAWASAKI , Shinichi KONDO , Yuya ISHIMA , Shinichi SATO , Masaki TAKAHASHI , Takashi ENDO
IPC: H01F1/147 , H01F27/255 , H01F27/28
CPC classification number: H01F1/14766 , H01F17/0013 , H01F17/04 , H01F27/255 , H01F27/2804 , H01F2017/048 , H01F2027/2809
Abstract: A soft magnetic metal powder includes a plurality of soft magnetic metal grains composed of an Fe—Si based alloy. A content of P in the Fe—Si based alloy is 110 to 650 ppm provided that a total content of Fe and Si is 100 mass %. A soft magnetic metal fired body includes soft magnetic metal fired grains composed of an Fe—Si based alloy. A content of P in the Fe—Si based alloy is 110 to 650 ppm provided that a total content of Fe and Si is 100 mass %.
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公开(公告)号:US20230072794A1
公开(公告)日:2023-03-09
申请号:US17939027
申请日:2022-09-07
Applicant: TDK CORPORATION
Inventor: Yusuke NAGAI , Kazuhiro EBINA , Takahiro SATO , Kunihiko KAWASAKI , Shinichi SATO , Shinichi KONDO , Kouichi KAKUDA , Yuya ISHIMA , Kosuke ITO
Abstract: A multilayer coil component includes: an element body formed by stacking a magnetic body layer containing a plurality of metal magnetic particles of a soft magnetic material; a first coil disposed in the element body and configured to include a plurality of first coil conductors; a second coil disposed in the element body and configured to include a plurality of second coil conductors; a first external electrode to which one end portion of each of the first coil and the second coil is connected; and a second external electrode to which the other end portion of each of the first coil and the second coil is connected.
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公开(公告)号:US20230070168A1
公开(公告)日:2023-03-09
申请号:US17939036
申请日:2022-09-07
Applicant: TDK CORPORATION
Inventor: Yusuke NAGAI , Kazuhiro EBINA , Takahiro SATO , Kunihiko KAWASAKI , Shinichi SATO , Seiichi NAKAGAWA , Kouichi KAKUDA , Yuya ISHIMA , Mitsuru ITO
IPC: H01F27/29
Abstract: A multilayer coil component includes: an element body; a coil disposed in the element body; and a first external electrode disposed on a surface of the element body in which the first external electrode has a first electrode layer disposed on the surface of the element body and a first plating layer and a second plating layer disposed on the first electrode layer, and the first plating layer and the second plating layer are disposed so as to be scattered in a plurality of places on an edge of the first electrode layer.
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公开(公告)号:US20220336140A1
公开(公告)日:2022-10-20
申请号:US17717673
申请日:2022-04-11
Applicant: TDK CORPORATION
Inventor: Yu SAKURAI , Takashi SUZUKI , Hideyuki ITOH , Kouichi KAKUDA , Ryuichi WADA , Nami ENOMOTO , Yusuke NAGAI , Kunihiko KAWASAKI , Shinichi KONDO , Yuya ISHIMA
Abstract: A coil-type electronic component comprises an element including a magnetic element body and a coil conductor. A portion of the magnetic element body in between layers of the coil conductor adjacent to each other in an axis direction of the coil conductor includes first soft magnetic metal particles. A portion of the magnetic element body on an outer side along the axis includes second soft magnetic metal particles. The first soft magnetic metal particles have a saturation magnetization (Ms) higher than that of the second soft magnetic metal particles.
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公开(公告)号:US20220293332A1
公开(公告)日:2022-09-15
申请号:US17687940
申请日:2022-03-07
Applicant: TDK CORPORATION
Inventor: Yuya ISHIMA , Kosuke ITO , Shinichi KONDO , Shingo HATTORI , Hidenobu UMEDA
Abstract: A method for manufacturing a multilayer coil component 1 includes: a step of forming a conductor by a photolithography method using photosensitive conductive paste; a step of forming an insulating film covering the conductor by a photolithography method using photosensitive insulating paste; a step of forming a resin layer holding the conductor covered with the insulating film by a positive-type photoresist; a step of forming a plurality of the conductors and the insulating film and then removing the resin layer by irradiating the resin layer with ultraviolet rays and developing the resin layer; and a step of filling the conductor covered with the insulating film with a magnetic material after removing the resin layer.
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公开(公告)号:US20200350107A1
公开(公告)日:2020-11-05
申请号:US16932890
申请日:2020-07-20
Applicant: TDK CORPORATION
Inventor: Shunji AOKI , Yuya ISHIMA , Hajime KATO , Yuto SHIGA , Kazuya TOBITA , Youichi KAZUTA , Satoru OKAMOTO
Abstract: A laminated electronic component includes an element body and a pair of conductors. The element body is formed by laminating a plurality of element-body layers in a first direction. The pair of conductors is formed by laminating a plurality of conductor layers in the first direction. The pair of conductors is provided to the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction. At a cross section orthogonal to the first direction, the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors.
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公开(公告)号:US20200234865A1
公开(公告)日:2020-07-23
申请号:US16840732
申请日:2020-04-06
Applicant: TDK CORPORATION
Inventor: Shunji AOKI , Yuya ISHIMA , Hajime KATO , Yuto SHIGA , Kazuya TOBITA , Youichi KAZUTA , Satoru OKAMOTO
Abstract: A laminated electronic component includes an element body and a pair of conductors. The element body is formed by laminating a plurality of element-body layers in a first direction. The pair of conductors is formed by laminating a plurality of conductor layers in the first direction. The pair of conductors is provided to the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction. At a cross section orthogonal to the first direction, the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors.
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公开(公告)号:US20180286566A1
公开(公告)日:2018-10-04
申请号:US15940170
申请日:2018-03-29
Applicant: TDK CORPORATION
Inventor: Shunji AOKI , Yuya ISHIMA , Makoto TAKAHASHI , Shougo OKAMOTO , Takafumi TAKAHASHI , Hajime KATO , Yuto SHIGA
Abstract: An electronic component includes an element body, a conductor, and a plated electrode layer. The element body includes a first outer surface provided with a first recess. The conductor includes a first conductor portion. The first conductor portion is disposed in the first recess and includes a first face opposed to a bottom face of the first recess and a second face opposed to the first face. The plated electrode layer includes a first plating portion covering the second face. The second face includes a first slope inclined with respect to the first outer surface in such a way as to be recessed toward the bottom face side of the first recess from the first outer surface.
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