METHOD FOR PRODUCING MULTILAYER COIL COMPONENT AND MULTILAYER COIL COMPONENT

    公开(公告)号:US20210065975A1

    公开(公告)日:2021-03-04

    申请号:US17004334

    申请日:2020-08-27

    Abstract: A method for producing a multilayer coil component includes forming, on a main face of a substrate, a first coil conductor extending along the main face having conductivity, forming a second coil conductor and a third coil conductor apart from each other in a direction in which the first coil conductor extends and each extending from the first coil conductor in a first direction orthogonal to the main face, and forming a fourth coil conductor electrically connected to an end of the second coil conductor opposite to the first coil conductor and extending along the main face. The forming the first coil conductor includes forming, on the main face, a first insulator layer provided with a first penetration portion having a shape corresponding to the first coil conductor and exposing a part of the main face, and forming, by plating, the first coil conductor in the first penetration portion.

    ELECTRONIC COMPONENT
    22.
    发明申请

    公开(公告)号:US20210012947A1

    公开(公告)日:2021-01-14

    申请号:US16922533

    申请日:2020-07-07

    Abstract: An electronic component according to an aspect of the present disclosure includes an element body and a terminal electrode. The element body includes an outer surface provided with a depression. The terminal electrode is disposed on the element body. The terminal electrode includes a first electrode portion and a second electrode portion. The first electrode portion is disposed in the depression. The second electrode portion protrudes from the depression. The second electrode portion is thicker than the first electrode portion.

    METHOD FOR MANUFACTURING MULTILAYER COIL COMPONENT

    公开(公告)号:US20220293332A1

    公开(公告)日:2022-09-15

    申请号:US17687940

    申请日:2022-03-07

    Abstract: A method for manufacturing a multilayer coil component 1 includes: a step of forming a conductor by a photolithography method using photosensitive conductive paste; a step of forming an insulating film covering the conductor by a photolithography method using photosensitive insulating paste; a step of forming a resin layer holding the conductor covered with the insulating film by a positive-type photoresist; a step of forming a plurality of the conductors and the insulating film and then removing the resin layer by irradiating the resin layer with ultraviolet rays and developing the resin layer; and a step of filling the conductor covered with the insulating film with a magnetic material after removing the resin layer.

    LAMINATED ELECTRONIC COMPONENT
    28.
    发明申请

    公开(公告)号:US20200350107A1

    公开(公告)日:2020-11-05

    申请号:US16932890

    申请日:2020-07-20

    Abstract: A laminated electronic component includes an element body and a pair of conductors. The element body is formed by laminating a plurality of element-body layers in a first direction. The pair of conductors is formed by laminating a plurality of conductor layers in the first direction. The pair of conductors is provided to the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction. At a cross section orthogonal to the first direction, the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors.

    LAMINATED ELECTRONIC COMPONENT
    29.
    发明申请

    公开(公告)号:US20200234865A1

    公开(公告)日:2020-07-23

    申请号:US16840732

    申请日:2020-04-06

    Abstract: A laminated electronic component includes an element body and a pair of conductors. The element body is formed by laminating a plurality of element-body layers in a first direction. The pair of conductors is formed by laminating a plurality of conductor layers in the first direction. The pair of conductors is provided to the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction. At a cross section orthogonal to the first direction, the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors.

    ELECTRONIC COMPONENT
    30.
    发明申请

    公开(公告)号:US20180286566A1

    公开(公告)日:2018-10-04

    申请号:US15940170

    申请日:2018-03-29

    Abstract: An electronic component includes an element body, a conductor, and a plated electrode layer. The element body includes a first outer surface provided with a first recess. The conductor includes a first conductor portion. The first conductor portion is disposed in the first recess and includes a first face opposed to a bottom face of the first recess and a second face opposed to the first face. The plated electrode layer includes a first plating portion covering the second face. The second face includes a first slope inclined with respect to the first outer surface in such a way as to be recessed toward the bottom face side of the first recess from the first outer surface.

Patent Agency Ranking