公开(公告)号：US20220210911A1

公开(公告)日：2022-06-30

申请号：US17218792

申请日：2021-03-31

Applicant: Texas Instruments Incorporated

Inventor： Tianyi Luo ,  Osvaldo Jorge Lopez ,  Jonathan Almeria Noquil ,  Satyendra Singh Chauhan ,  Bernardo Gallegos

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/538 ,  H01L21/50

Abstract: In a described example, an apparatus includes: a package substrate having a planar die mount surface; recesses extending into the planar die mount surface; and a semiconductor device die flip chip mounted to the package substrate on the planar die mount surface, the semiconductor device die having post connects having proximate ends on bond pads on an active surface of the semiconductor device die, and extending to distal ends away from the semiconductor device die having solder bumps, wherein the solder bumps form solder joints to the package substrate within the recesses.

公开(公告)号：US10672692B2

公开(公告)日：2020-06-02

申请号：US15820266

申请日：2017-11-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jaimal Mallory Williamson ,  Bernardo Gallegos ,  Jose Carlos Arroyo

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

Abstract: A lead frame that is partially covered with an adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame and using a photo-imageable polyimide or epoxy material to form the adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame blank and using a photo-imageable polyimide or epoxy material to form the adhesion layer.

公开(公告)号：US20180096859A1

公开(公告)日：2018-04-05

申请号：US15282534

申请日：2016-09-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jaimal Mallory Williamson ,  Bernardo Gallegos ,  Jose Carlos Arroyo

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/498

CPC classification number: H01L21/4832 ,  H01L21/4821 ,  H01L21/4825 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4951 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49586 ,  H01L23/49861 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A lead frame that is partially covered with an adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame and using a photo-imageable polyimide or epoxy material to form the adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame blank and using a photo-imageable polyimide or epoxy material to form the adhesion layer.

公开(公告)号：US20160035655A1

公开(公告)日：2016-02-04

申请号：US14879622

申请日：2015-10-09

Applicant: Texas Instruments Incorporated

Inventor： Gregory E. Howard ,  Bernardo Gallegos ,  Rajiv Dunne ,  Darvin R. Edwards ,  Siva P. Gurrum ,  Manu J. Prakuzhy ,  Donald C. Abbott

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49589 ,  H01L21/4821 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/1776 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A packaged semiconductor device including a leadframe and a plurality of angularly shaped capacitors. The leadframe includes structures with surfaces and sidewalls. The angularly shaped capacitors are attached to surface portions of the leadframe structures. The angularly shaped capacitors have sidewalls coplanar with structure sidewalls. The angularly shaped capacitors includes a conductive material attached to the structure surface. The conductive material having pores covered by oxide and filled with conductive polymer. The angularly shaped capacitors topped by electrodes are made of a second metal.

Abstract translation: 一种封装半导体器件，包括引线框和多个角形电容器。 引线框架包括具有表面和侧壁的结构。 角形电容器附接到引线框结构的表面部分。 角形电容器具有与结构侧壁共面的侧壁。 角形电容器包括附着到结构表面的导电材料。 导电材料具有被氧化物覆盖并填充有导电聚合物的孔。 由电极顶起的角形电容器由第二金属制成。