公开(公告)号：US20220208534A1

公开(公告)日：2022-06-30

申请号：US17556025

申请日：2021-12-20

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masato SHINADA ,  Tetsuya MIYASHITA ,  Einstein Noel ABARRA

IPC: H01J37/34 ,  H01J37/32 ,  C23C14/54 ,  C23C14/50 ,  C23C14/34

Abstract: There is provided a sputtering apparatus comprising: a target from which sputtered particles are emitted; a substrate support configured to support a substrate; a substrate moving mechanism configured to move the substrate in one direction; and a shielding member disposed between the target and the substrate support and having an opening through which the sputtered particles pass. The shielding member includes a first shielding member and a second shielding member disposed in a vertical direction.

公开(公告)号：US20220037181A1

公开(公告)日：2022-02-03

申请号：US17381813

申请日：2021-07-21

Applicant: Tokyo Electron Limited

Inventor： Tatsuo HATANO ,  Naoki WATANABE ,  Tetsuya MIYASHITA

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/683

Abstract: A vacuum transfer device configured to transfer a substrate in a vacuum includes: a flat motor including a body, a plurality of electromagnetic coils arrayed in the body, and a current controller that controls a current supplied to the electromagnetic coil; a transfer unit including a substrate holder configured to hold a substrate, and a base having a plurality of magnets arrayed therein and magnetically levitating from a surface of the body by a magnetic field generated by the electromagnetic coil, and move in a magnetically levitating state thereby moving the substrate holder; and a temperature controller configured to adjust temperature of at least a portion of the body. The temperature of the transfer unit is adjusted by stopping the magnetic levitation of the base by controlling the current supplied to the electromagnetic coil, and bringing the base into contact with a temperature-adjusted portion of the body.

公开(公告)号：US20170330787A1

公开(公告)日：2017-11-16

申请号：US15594699

申请日：2017-05-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tadashi MITSUNAGA ,  Tetsuya MIYASHITA ,  Tatsuo HATANO ,  Naoki WATANABE

IPC: H01L21/687 ,  H01L21/67 ,  C23C16/458

CPC classification number: H01L21/68714 ,  C23C14/35 ,  C23C14/505 ,  C23C14/541 ,  C23C16/4584 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67248

Abstract: There is provided a mounting table system which includes: a mounting table rotatably installed so as to mount a substrate thereon; a plurality of heating parts installed in the mounting table, and configured to heat the mounting table; a single power source configured to supply an electric power to the plurality of heating parts; and a power switching part configured to switch from a first heating part among the plurality of heating parts to which the electric power is supplied from the single power source, to a second heating part among the plurality of heating parts, depending on a rotational angle of the mounting table.

公开(公告)号：US20150357222A1

公开(公告)日：2015-12-10

申请号：US14721452

申请日：2015-05-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tetsuya MIYASHITA ,  Masamichi HARA ,  Naoyuki SUZUKI ,  Kaoru YAMAMOTO ,  Kouji MAEDA

IPC: H01L21/683 ,  H05K7/20

CPC classification number: H01L21/6833 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6875

Abstract: A cooling processing apparatus includes: a processing vessel; an electrostatic chuck installed in the processing vessel, the electrostatic chuck having a mounting surface on which an object to be processed is mounted; a cooling mechanism configured to cool the electrostatic chuck; and a lamp heating device configured to remove moisture attached to the mounting surface. Further, a method for operating the cooling processing apparatus includes: decompressing the space in the processing vessel by using the exhaust device; removing the moisture attached to the mounting surface of the electrostatic chuck by using the lamp heating device; and cooling the electrostatic chuck by using the cooling mechanism after the removal of the moisture performed by the lamp heating device is terminated.

Abstract translation: 冷却处理装置包括：处理容器; 安装在所述处理容器中的静电卡盘，所述静电卡盘具有安装在其上的待加工物体的安装面; 冷却机构，其构造成冷却所述静电卡盘; 以及灯加热装置，其构造成去除附着到所述安装表面的水分。 此外，用于操作冷却处理装置的方法包括：通过使用排气装置对处理容器中的空间进行减压; 通过使用灯加热装置去除附着在静电卡盘的安装表面上的湿气; 并且在终止了由灯加热装置执行的除去湿气之后通过使用冷却机构来冷却静电卡盘。