公开(公告)号：US20240410050A1

公开(公告)日：2024-12-12

申请号：US18673988

申请日：2024-05-24

Applicant: Tokyo Electron Limited

Inventor： Naoki WATANABE ,  Tatsuo HATANO

IPC: C23C14/54 ,  C23C14/50

Abstract: A stage structure includes a plurality of stages respectively configured to support a substrate placed thereon, a single cooling plate common to the plurality of stages, a refrigerator configured to cool the cooling plate, and an elevating device configured to thermally connect or separate a first contact surface of the plurality of stages and a second contact surface of the cooling plate.

公开(公告)号：US20220259727A1

公开(公告)日：2022-08-18

申请号：US17650133

申请日：2022-02-07

Applicant: Tokyo Electron Limited

Inventor： Tatsuo HATANO ,  Naoki WATANABE

IPC: C23C16/458 ,  C23C16/46 ,  H01J37/32

Abstract: According to embodiments of the present disclosure, a substrate heating device, a substrate heating method, and a method of manufacturing a substrate heater are provided. A substrate heating device for heating a substrate within a processing container configured to perform processing of a substrate therein includes a substrate heater including a placement surface on which the substrate is placed. The substrate heater is configured to heat the substrate placed on the placement surface using a heater. The substrate heating device further includes a jacket provided to cover a bottom portion of the substrate heater via a cooling space and a cooling gas supplier configured to supply a cooling gas to the cooling space.

公开(公告)号：US20220223447A1

公开(公告)日：2022-07-14

申请号：US17573387

申请日：2022-01-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tatsuo HATANO ,  Naoki WATANABE

IPC: H01L21/677 ,  H02K41/03 ,  H01L21/683 ,  H01L21/67

Abstract: A substrate transfer apparatus for transferring a substrate is disclosed. The apparatus comprises: a transfer unit including a substrate holder configured to hold a substrate, and a base having therein a magnet and configured to move the substrate holder; a planar motor including a main body, a plurality of electromagnetic coils disposed in the main body, and a linear driver configured to supply a current to the electromagnetic coils, and magnetically levitate and linearly drive the base; a substrate detection sensor configured to detect the substrate when the substrate held by the substrate holder passes by; and a transfer controller configured to calculate an actual position of the substrate held by the substrate holder based on detection data of the substrate detection sensor, calculate correction values for a logical position that has been set, and correct a transfer position of the substrate based on the correction values.

公开(公告)号：US20210262080A1

公开(公告)日：2021-08-26

申请号：US17253796

申请日：2019-06-17

Applicant: Tokyo Electron Limited

Inventor： Junichi TAKEI ,  Naoki WATANABE ,  Hiroshi SONE ,  Naoyuki SUZUKI

IPC: C23C14/34 ,  H01J37/34

Abstract: The sputter device according to one embodiment of the present invention has: a treatment vessel in which a substrate is housed; a slit plate which is disposed above the substrate inside the treatment vessel so as to be located parallel to a surface of the substrate and which has formed therein an opening that penetrates in the plate-thickness direction; and a heat-receiving plate which is formed of a material having a higher heat resistance than the slit plate and which is placed on top of the slit plate beneath a target material provided at a slant with respect the slit plate.

公开(公告)号：US20190252165A1

公开(公告)日：2019-08-15

申请号：US16246285

申请日：2019-01-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masato SHINADA ,  Naoki WATANABE ,  Tetsuya MIYASHITA ,  Hiroaki CHIHAYA

IPC: H01J37/34 ,  C23C14/35

CPC classification number: H01J37/3405 ,  C23C14/35 ,  H01J37/3417 ,  H01J37/3447 ,  H01J37/3452 ,  H01J2237/332

Abstract: A film forming system comprises a chamber, a stage, a holder, a cathode magnet, a shield, a first moving mechanism, and a second moving mechanism. The chamber provides a processing space. The stage is provided in the processing space and configured to support a substrate. The holder is configured to hold a target that is provided in the processing space. The cathode magnet is provided outside the chamber with respect to the target. The shield has a slit and is configured to block particles released from the target around the slit. The first moving mechanism is configured to move the shield between the stage and the target along a scanning direction substantially parallel to a surface of the substrate mounted on the stage. The second moving mechanism is configured to move the cathode magnet along the scanning direction.

公开(公告)号：US20170372951A1

公开(公告)日：2017-12-28

申请号：US15627478

申请日：2017-06-20

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroyuki TOSHIMA ,  Tatsuo HATANO ,  Shinji FURUKAWA ,  Naoki WATANABE ,  Naoyuki SUZUKI

IPC: H01L21/768 ,  H01J37/34 ,  H01L21/687 ,  H01J37/32

CPC classification number: H01L21/76862 ,  H01J37/32715 ,  H01J37/32733 ,  H01J37/32899 ,  H01J37/3435 ,  H01L21/68764 ,  H01L21/76802 ,  H01L21/76843 ,  H01L21/76871 ,  H01L21/76879

Abstract: There is provided a method for performing a pre-treatment to form a copper wiring in a recess formed in a substrate, which includes forming a barrier layer on a surface of the substrate that defines the recess, and forming a seed layer on the barrier layer. The method further includes at least one of etching the barrier layer and etching the seed layer. In the at least one of etching the barrier layer and etching the seed layer, the substrate is inclined with respect to an irradiation direction of ions while rotating the substrate.

公开(公告)号：US20230097539A1

公开(公告)日：2023-03-30

申请号：US17956562

申请日：2022-09-29

Applicant: Tokyo Electron Limited

Inventor： Naoki WATANABE ,  Tatsuo HATANO

IPC: C23C14/58 ,  H01J37/32 ,  H01J37/34 ,  C23C14/50 ,  C23C14/14 ,  C23C14/35

Abstract: A film forming apparatus comprising: a processing container for accommodating a plurality of substrates, a substrate holder provided in the processing container and configured to hold the substrates such that the plurality of substrates are arranged along a circumferential direction; a rotating and revolving mechanism configured to rotate the plurality of substrates on the substrate holder and revolve the plurality of substrates on the substrate holder along the circumferential direction; and a sputtered particle emitting mechanism configured to emit sputtered particles to the plurality of substrates held by the substrate holder. Sputtering film formation is performed by emitting the sputtered particles from the sputtered particle emitting mechanism while rotating and revolving the plurality of substrates held by the substrate holder using the rotating and revolving mechanism.

公开(公告)号：US20220415688A1

公开(公告)日：2022-12-29

申请号：US17779873

申请日：2020-11-20

Applicant: Tokyo Electron Limited

Inventor： Tatsuo HATANO ,  Tetsuya MIYASHITA ,  Naoki WATANABE ,  Naoyuki SUZUKI

IPC: H01L21/677 ,  B25J9/12 ,  B25J11/00 ,  B25J9/02 ,  H02K7/14 ,  H02K41/02

Abstract: The present disclosure provides a substrate transfer apparatus. According to an aspect of the present disclosure, the substrate transfer apparatus includes: a planar motor provided in a transfer chamber and having coils arranged therein; a transfer unit movable on the planar motor; and a control unit configured to control an energization of the coils. The transfer unit includes two bases having magnets arranged thereon and configured to be movable on the planar motor, a substrate support member configured to support a substrate, and a link mechanism configured to connect the two bases and the substrate support member to each other.

公开(公告)号：US20220223390A1

公开(公告)日：2022-07-14

申请号：US17573368

申请日：2022-01-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masato SHINADA ,  Tetsuya MIYASHITA ,  Naoki WATANABE

IPC: H01J37/34 ,  C23C14/34

Abstract: There is provided a film formation apparatus which forms a film on a substrate by sputtering. The apparatus comprises: a substrate holder configured to hold the substrate; and a plurality of cathodes configured to hold targets that emit sputtered particles, and connected to a power supply. At least one of the plurality of cathodes holds the targets of a plurality of types.

公开(公告)号：US20220130701A1

公开(公告)日：2022-04-28

申请号：US17571171

申请日：2022-01-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tatsuo HATANO ,  Naoki WATANABE

IPC: H01L21/677 ,  H01L21/683 ,  H02K41/03

Abstract: A substrate transport apparatus which transports a substrate to a substrate transport position. The apparatus comprises: a transport unit including a substrate holder that holds the substrate, a base having magnets and configured to move the substrate holder, and a link member connecting the substrate holder to the base; and a planar motor having a main body, electromagnetic coils arranged in the main body, and a linear driver supplying power to the electromagnetic coils to magnetically levitate and linearly drive the base. The base includes a first member and a second member rotatably provided in the first member, and the magnets are provided inside the first member and the second member, the link member is rotatably connected to the second member, and the linear driver rotates the second member with respect to the first member and expands and contracts the substrate holder via the link member.