公开(公告)号：US20150371812A1

公开(公告)日：2015-12-24

申请号：US14735216

申请日：2015-06-10

申请人： TOKYO ELECTRON LIMITED

发明人： Kouji MAEDA ,  Naoyuki SUZUKI ,  Tetsuya MIYASHITA ,  Masamichi HARA

IPC分类号： H01J37/18 ,  H01J37/32

CPC分类号： H01J37/185 ,  H01J37/32513 ,  H01J37/32733 ,  H01J37/32899 ,  H01L21/67126 ,  H01L21/67184 ,  H01L21/67748

摘要： There is provided a substrate processing system which includes: at least two transfer chambers disposed adjacent each other, each of which including a transfer mechanism configured to transfer a substrate; at least one process chamber connected to each of the at least two transfer chambers, and configured to perform a process on the substrate loaded into the at least one process chamber; a gate valve configured to move into and out of a connection path interconnecting the at least two transfer chambers and configured to separate the at least two transfer chambers from each other; and a substrate holding mechanism attached to the gate valve and configured to hold the substrate.

摘要翻译： 提供了一种基板处理系统，其包括：彼此相邻布置的至少两个传送室，每个传送室包括被配置为传送基板的传送机构; 至少一个处理室，连接到所述至少两个传送室中的每一个，并且被配置成在装载到所述至少一个处理室中的所述衬底上执行处理; 闸阀构造成移动进入和离开连接所述至少两个传送室的连接路径并且被配置为将所述至少两个传送室彼此分离; 以及基板保持机构，其附接到所述闸阀并构造成保持所述基板。

公开(公告)号：US20150357222A1

公开(公告)日：2015-12-10

申请号：US14721452

申请日：2015-05-26

申请人： TOKYO ELECTRON LIMITED

发明人： Tetsuya MIYASHITA ,  Masamichi HARA ,  Naoyuki SUZUKI ,  Kaoru YAMAMOTO ,  Kouji MAEDA

IPC分类号： H01L21/683 ,  H05K7/20

CPC分类号： H01L21/6833 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6875

摘要： A cooling processing apparatus includes: a processing vessel; an electrostatic chuck installed in the processing vessel, the electrostatic chuck having a mounting surface on which an object to be processed is mounted; a cooling mechanism configured to cool the electrostatic chuck; and a lamp heating device configured to remove moisture attached to the mounting surface. Further, a method for operating the cooling processing apparatus includes: decompressing the space in the processing vessel by using the exhaust device; removing the moisture attached to the mounting surface of the electrostatic chuck by using the lamp heating device; and cooling the electrostatic chuck by using the cooling mechanism after the removal of the moisture performed by the lamp heating device is terminated.

摘要翻译： 冷却处理装置包括：处理容器; 安装在所述处理容器中的静电卡盘，所述静电卡盘具有安装在其上的待加工物体的安装面; 冷却机构，其构造成冷却所述静电卡盘; 以及灯加热装置，其构造成去除附着到所述安装表面的水分。 此外，用于操作冷却处理装置的方法包括：通过使用排气装置对处理容器中的空间进行减压; 通过使用灯加热装置去除附着在静电卡盘的安装表面上的湿气; 并且在终止了由灯加热装置执行的除去湿气之后通过使用冷却机构来冷却静电卡盘。

公开(公告)号：US20140124069A1

公开(公告)日：2014-05-08

申请号：US14070121

申请日：2013-11-01

申请人： TOKYO ELECTRON LIMITED

发明人： Masamichi HARA ,  Tetsuya MIYASHITA

IPC分类号： F16K51/02

CPC分类号： F16K51/02 ,  H01L21/67201 ,  Y10T137/86083

摘要： Provided is a load lock device which includes: a container with an opening formed therein and configured to be selectively maintained at an atmospheric environment and a vacuum atmosphere; a holding unit arranged within the container and configured to hold objects to be processed; an elevation mechanism configured to vertically move the holding unit; and a pressure regulating mechanism configured to vacuum-evacuate the container through the opening of the container. The elevation mechanism includes at least two vertically-extended elevation shaft members connected to the holding unit; and a drive unit configured to vertically move the elevation shaft members. The elevation shaft members are arranged opposite each other with the opening interposed therebetween.

摘要翻译： 本发明提供一种装载锁定装置，其特征在于，包括：具有形成在其内的开口的容器，其构造成选择性地保持在大气环境和真空气氛中; 保持单元，其布置在所述容器内并且构造成保持要处理的物体; 升降机构，其构造成使所述保持单元垂直移动; 以及压力调节机构，其构造成通过容器的开口对容器进行真空抽真空。 升降机构包括连接到保持单元的至少两个垂直延伸的仰角轴构件; 以及构造成垂直移动仰角轴构件的驱动单元。 升降轴构件彼此相对地布置，并且其间插入开口。

公开(公告)号：US20210388493A1

公开(公告)日：2021-12-16

申请号：US17338128

申请日：2021-06-03

申请人： TOKYO ELECTRON LIMITED

发明人： Yuta SORITA ,  Tetsuya SAITO ,  Shigeyuki OKURA ,  Yuichi FURUYA ,  Masamichi HARA

IPC分类号： C23C16/44 ,  C23C16/46 ,  C23C16/54 ,  C23C16/16 ,  C23C16/455

摘要： A film forming apparatus for forming a film on a substrate includes a chamber, a substrate support, a gas supply unit, a gas injection member, and a filter. The substrate support is disposed in the chamber to support a substrate placed thereon and maintain the substrate at a film forming temperature. The gas supply unit is configured to supply a gas containing a film forming source gas. The gas injection member is disposed to face the substrate support and has a gas injection area for injecting the gas containing the film forming source gas supplied from the gas supply unit. Further, the filter is disposed to cover at least the gas injection area on a surface of the gas injection member opposite to a surface facing the substrate support, the filter being configured to trap particles in the gas containing the film forming source gas while the gas passes therethrough.

公开(公告)号：US20150136027A1

公开(公告)日：2015-05-21

申请号：US14491940

申请日：2014-09-19

申请人： TOKYO ELECTRON LIMITED

发明人： Masamichi HARA ,  Kaoru YAMAMOTO ,  Yasushi MIZUSAWA

IPC分类号： C23C16/44 ,  C23C16/458 ,  C23C16/46 ,  C23C16/455

CPC分类号： C23C16/4412 ,  B01D8/00 ,  B01D2258/0216 ,  C23C16/16 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46 ,  C23C16/463 ,  F15D1/0005 ,  H01J37/32834 ,  H01J37/32844 ,  Y02C20/30 ,  Y02P70/605

摘要： A trap mechanism for trapping exhaust gas from a process chamber. The trap assembly includes a housing containing a plurality of trap units. The plurality of trap units are arranged successively along a flow direction of said exhaust gas. Each trap unit includes a set of trap panels parallel to each other and spaced apart from each other. The two opposite surfaces with a larger area of each trap panel are oriented substantially parallel to a flow direction of the exhaust gas flow. The two opposite surfaces with a smaller area of each trap panels are oriented orthogonal to the exhaust gas flow.

摘要翻译： 用于捕获来自处理室的废气的捕集机构。 捕集器组件包括容纳多个捕集器单元的壳体。 多个捕集单元沿着排气的流动方向依次配置。 每个陷阱单元包括彼此平行并彼此间隔开的一组陷阱板。 具有每个陷阱板的较大面积的两个相对表面基本上平行于废气流的流动方向定向。 每个陷阱板的面积较小的两个相对表面定向成垂直于废气流。

公开(公告)号：US20200312636A1

公开(公告)日：2020-10-01

申请号：US16821708

申请日：2020-03-17

申请人： TOKYO ELECTRON LIMITED

发明人： Takahiro KAWAWA ,  Hideomi HOSAKA ,  Kouichi NAKAJIMA ,  Masamichi HARA

IPC分类号： H01J37/32 ,  H01L21/683 ,  C23C16/458 ,  G01R29/24

摘要： In a substrate processing apparatus for processing a substrate, a processing chamber accommodating the substrate is provided. A mounting table is disposed in the processing chamber and configured to attract and hold the substrate using an electrostatic attractive force. A charge amount measurement unit is disposed in the processing chamber and configured to measure charge amount of a substrate attraction surface of the mounting table. A charge neutralization mechanism is configured to neutralize the substrate attraction surface of the mounting table. A retreating mechanism is configured to make the charge amount measurement unit retreat from a measurement position facing the substrate attraction surface of the mounting table.

公开(公告)号：US20140287163A1

公开(公告)日：2014-09-25

申请号：US14297726

申请日：2014-06-06

申请人： TOKYO ELECTRON LIMITED

发明人： Tadahiro ISHIZAKA ,  Atsushi GOMI ,  Takara FUKUSHIMA ,  Osamu YOKOYAMA ,  Takashi SAKUMA ,  Chiaki YASUMURO ,  Hiroyuki TOSHIMA ,  Tatsuo HATANO ,  Yasushi MIZUSAWA ,  Masamichi HARA ,  Kenzi SUZUKI

IPC分类号： H01L21/02

CPC分类号： H01L21/02104 ,  C23C14/025 ,  C23C14/046 ,  C23C14/345 ,  C23C14/541 ,  C23C14/5806 ,  C23C16/16 ,  H01J37/32899 ,  H01J37/34

摘要： A method of forming a Cu wiring in a trench or hole formed in a substrate is provided. The method includes forming a barrier film on the surface of the trench or hole, forming a Ru film on the barrier film, and embedding Cu in the trench or hole by forming a Cu film on the Ru film using PVD while annealing the substrate such that migration of copper into the trench or hole occurs.

摘要翻译： 提供了一种在衬底中形成的沟槽或孔中形成Cu布线的方法。 该方法包括在沟槽或孔的表面上形成阻挡膜，在阻挡膜上形成Ru膜，并且通过在使衬底退火的同时在PVD膜上形成Cu膜而将Cu嵌入沟槽或孔中，使得 发生铜进入沟槽或孔的迁移。