公开(公告)号：US20150357222A1

公开(公告)日：2015-12-10

申请号：US14721452

申请日：2015-05-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tetsuya MIYASHITA ,  Masamichi HARA ,  Naoyuki SUZUKI ,  Kaoru YAMAMOTO ,  Kouji MAEDA

IPC: H01L21/683 ,  H05K7/20

CPC classification number: H01L21/6833 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6875

Abstract: A cooling processing apparatus includes: a processing vessel; an electrostatic chuck installed in the processing vessel, the electrostatic chuck having a mounting surface on which an object to be processed is mounted; a cooling mechanism configured to cool the electrostatic chuck; and a lamp heating device configured to remove moisture attached to the mounting surface. Further, a method for operating the cooling processing apparatus includes: decompressing the space in the processing vessel by using the exhaust device; removing the moisture attached to the mounting surface of the electrostatic chuck by using the lamp heating device; and cooling the electrostatic chuck by using the cooling mechanism after the removal of the moisture performed by the lamp heating device is terminated.

Abstract translation: 冷却处理装置包括：处理容器; 安装在所述处理容器中的静电卡盘，所述静电卡盘具有安装在其上的待加工物体的安装面; 冷却机构，其构造成冷却所述静电卡盘; 以及灯加热装置，其构造成去除附着到所述安装表面的水分。 此外，用于操作冷却处理装置的方法包括：通过使用排气装置对处理容器中的空间进行减压; 通过使用灯加热装置去除附着在静电卡盘的安装表面上的湿气; 并且在终止了由灯加热装置执行的除去湿气之后通过使用冷却机构来冷却静电卡盘。

公开(公告)号：US20200381272A1

公开(公告)日：2020-12-03

申请号：US16624492

申请日：2018-06-25

Applicant: Tokyo Electron Limited

Inventor： Shinji ORIMOTO ,  Manabu NAKAGAWASAI ,  Kouji MAEDA ,  Hiroshi MIKI ,  Naoyuki SUZUKI

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A placing table structure according to an embodiment includes: a fixedly disposed refrigerated heat transfer element; a rotatable outer cylinder disposed around the refrigerated heat transfer element; and a stage connected to the outer cylinder and disposed above an upper surface of the refrigerated heat transfer element with inclusion of a gap between the refrigerated heat transfer element and the stage.

公开(公告)号：US20170345609A1

公开(公告)日：2017-11-30

申请号：US15595290

申请日：2017-05-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tomohiro SAITO ,  Tadashi MITSUNAGA ,  Kouji MAEDA ,  Tetsuya MIYASHITA

IPC: H01J11/52 ,  H01J21/18 ,  H01J41/16 ,  H01J11/46 ,  H01J41/12 ,  H01J21/02 ,  H01J11/20

CPC classification number: H01J11/52 ,  H01J9/385 ,  H01J11/20 ,  H01J11/46 ,  H01J21/02 ,  H01J21/18 ,  H01J37/3178 ,  H01J37/32724 ,  H01J37/32816 ,  H01J37/32834 ,  H01J41/12 ,  H01J41/16

Abstract: A vacuum exhaust method is for decreasing a pressure in a processing chamber in which a mounting table configured to mount thereon a substrate is provided by using a gas exhaust unit. The vacuum exhaust method includes mounting a non-evaporated getter (NEG) on the mounting table, and adsorbing an active gas in the processing chamber on the NEG mounted on the mounting table. In the adsorbing the active gas, the NEG is maintained at a predetermined temperature.

公开(公告)号：US20150371812A1

公开(公告)日：2015-12-24

申请号：US14735216

申请日：2015-06-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kouji MAEDA ,  Naoyuki SUZUKI ,  Tetsuya MIYASHITA ,  Masamichi HARA

IPC: H01J37/18 ,  H01J37/32

CPC classification number: H01J37/185 ,  H01J37/32513 ,  H01J37/32733 ,  H01J37/32899 ,  H01L21/67126 ,  H01L21/67184 ,  H01L21/67748

Abstract: There is provided a substrate processing system which includes: at least two transfer chambers disposed adjacent each other, each of which including a transfer mechanism configured to transfer a substrate; at least one process chamber connected to each of the at least two transfer chambers, and configured to perform a process on the substrate loaded into the at least one process chamber; a gate valve configured to move into and out of a connection path interconnecting the at least two transfer chambers and configured to separate the at least two transfer chambers from each other; and a substrate holding mechanism attached to the gate valve and configured to hold the substrate.

Abstract translation: 提供了一种基板处理系统，其包括：彼此相邻布置的至少两个传送室，每个传送室包括被配置为传送基板的传送机构; 至少一个处理室，连接到所述至少两个传送室中的每一个，并且被配置成在装载到所述至少一个处理室中的所述衬底上执行处理; 闸阀构造成移动进入和离开连接所述至少两个传送室的连接路径并且被配置为将所述至少两个传送室彼此分离; 以及基板保持机构，其附接到所述闸阀并构造成保持所述基板。