公开(公告)号：US20210098333A1

公开(公告)日：2021-04-01

申请号：US16737832

申请日：2020-01-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Chang Ku ,  Wensen Hung ,  Hung-Chi Li

IPC: H01L23/40 ,  H01L23/473 ,  H01L23/00

Abstract: A package structure including a reconstructed wafer, a heat dissipation substrate, a semiconductor device, and a fixing mechanism is provided. The heat dissipation substrate is disposed on a side of the reconstructed wafer and includes an inlet, a base plate located between the inlet and the reconstructed wafer, and a connection member located and coupled between the inlet and the base plate. The connection member has an inclined fluid channel that descends from the inlet to the base plate. The semiconductor device is disposed on another side of the reconstructed wafer, wherein the heat dissipation substrate and the semiconductor device are respectively located on opposite sides of the reconstructed wafer. The fixing mechanism fixes the reconstructed wafer, the heat dissipation substrate, and the semiconductor device together.

公开(公告)号：US09417263B2

公开(公告)日：2016-08-16

申请号：US14454746

申请日：2014-08-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Hsin Kuo ,  Wensen Hung ,  Po-Shi Yao

IPC: G01R1/067 ,  G01R1/073 ,  H05K3/00 ,  G01R3/00 ,  G01R1/04

CPC classification number: G01R1/07314 ,  G01R1/0491 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  H01L2924/14 ,  H05K3/00 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49865 ,  Y10T29/49867

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract translation: 用于晶圆级测试的半导体IC封装器件的测试探针卡。 该卡包括一个包括测试电路和测试头的电路板。 探头包括探针阵列，其具有附接到包括多个导电通孔的基底的多个金属测试探针。 在一个实施例中，探针具有相对刚性的结构，并且具有可以使用倒装芯片组件焊料回流工艺电连接到通孔的一端。 在一个实施例中，探针可以使用反向导线放电加工由导电材料的整体块形成。