公开(公告)号：US10516033B2

公开(公告)日：2019-12-24

申请号：US15960096

申请日：2018-04-23

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chih-Hao Yu ,  Sheng-chen Wang ,  Sai-Hooi Yeong

IPC: H01L29/66 ,  H01L27/088 ,  H01L21/762 ,  H01L21/8234

Abstract: A semiconductor device includes first and second FETs including first and second channel regions, respectively. The first and second FETs include first and second gate structures, respectively. The first and second gate structures include first and second gate dielectric layers formed over the first and second channel regions and first and second gate electrode layers formed over the first and second gate dielectric layers. The first and second gate structures are aligned along a first direction. The first gate structure and the second gate structure are separated by a separation plug made of an insulating material. A width of the separation plug in a second direction perpendicular to the first direction is smaller than a width of the first gate structure in the second direction, when viewed in plan view.

公开(公告)号：US20240272352A1

公开(公告)日：2024-08-15

申请号：US18324576

申请日：2023-05-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chen-Hua Yu ,  Tsung-Fu Tsai ,  Chih-Hao Yu ,  Jui Lin Chao ,  Szu-Wei Lu

IPC: G02B6/12 ,  G02B6/136

CPC classification number: G02B6/12004 ,  G02B6/136 ,  G02B2006/12121

Abstract: A method includes connecting a first photonic package to a substrate, wherein the first photonic package includes a first waveguide and a first support over the first waveguide; connecting a second photonic package to the substrate adjacent the first photonic package, wherein the second photonic package includes a second waveguide, wherein the first photonic package and the second photonic package are laterally separated by a gap that has a width in the range of 15 μm to 190 μm; depositing a first quantity of an optical adhesive into the gap; and curing the first quantity of the optical adhesive, wherein after curing the first quantity of the optical adhesive, the first waveguide is optically coupled to the second waveguide through the first quantity of the optical adhesive.

公开(公告)号：US11289584B2

公开(公告)日：2022-03-29

申请号：US16937164

申请日：2020-07-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Bone-Fong Wu ,  Chih-Hao Yu ,  Chia-Pin Lin

IPC: H01L29/66 ,  H01L29/06 ,  H01L29/423 ,  H01L29/78 ,  H01L21/02

Abstract: A semiconductor device according to the present disclosure includes a channel member including a first connection portion, a second connection portion and a channel portion disposed between the first connection portion and the second connection portion, a first inner spacer feature disposed over and in contact with the first connection portion, a second inner spacer feature disposed under and in contact with the first connection portion, and a gate structure wrapping around the channel portion of the channel member. The channel member further includes a first ridge on a top surface of the channel member and disposed at an interface between the channel portion and the first connection portion. The first ridge partially extends between the first inner spacer feature and the gate structure.