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101 条记录 (耗时 0.026 秒)

    Electric power converter
    23.
    发明授权
    Electric power converter 有权
    电力转换器

    公开(公告)号：US09419535B2

    公开(公告)日：2016-08-16

    申请号：US14122713

    申请日：2012-05-25

    申请人： Atsuo Nishihara ,  Ken Maeda ,  Kinya Nakatsu ,  Yukio Hattori

    发明人： Atsuo Nishihara ,  Ken Maeda ,  Kinya Nakatsu ,  Yukio Hattori

    IPC分类号： H02M7/797 ,  H02M7/00 ,  H05K7/14 ,  H05K7/20

    CPC分类号： H02M7/003 ,  H02M7/797 ,  H05K7/1432 ,  H05K7/20927

    摘要： An electric power converter is provided with: a power semiconductor module, which has a power semiconductor element that converts a direct current into an alternating current; a capacitor module, which has a capacitor element that smooths the direct current; and a cooling body, which cools the power semiconductor module and the capacitor module. The capacitor module has: a case, which has an approximately rectangular shape, has an opening formed in one surface, and has a space for housing the capacitor element; and a DC conductor for electrically connecting the power semiconductor element and the capacitor element to each other. The cooling body is formed to face the bottom surface on the inner wall of the case, and both the side surfaces of the case, the side surfaces facing each other. Between the capacitor element and the inner wall surfaces of the case, the direct current conductor is formed along the bottom surface and both the side surfaces of the case.

    摘要翻译： 电力转换器具有：功率半导体模块，具有将直流电转换为交流电的功率半导体元件; 电容器模块，其具有使直流平滑的电容器元件; 以及冷却功率半导体模块和电容器模块的冷却体。 电容器模块具有：具有大致矩形形状的壳体，具有形成在一个表面中的开口，并且具有用于容纳电容器元件的空间; 以及用于将功率半导体元件和电容器元件彼此电连接的DC导体。 冷却体形成为面对壳体的内壁上的底面，并且壳体的两侧表面彼此面对。 在电容器元件和壳体的内壁表面之间，直流导体沿壳体的底表面和两个侧表面形成。

    Electric Power Converter
    26.
    发明申请
    Electric Power Converter 有权
    电力转换器

    公开(公告)号：US20140078803A1

    公开(公告)日：2014-03-20

    申请号：US14122713

    申请日：2012-05-25

    申请人： Atsuo Nishihara ,  Ken Maeda ,  Kinya Nakatsu ,  Yukio Hattori

    发明人： Atsuo Nishihara ,  Ken Maeda ,  Kinya Nakatsu ,  Yukio Hattori

    IPC分类号： H02M7/00

    CPC分类号： H02M7/003 ,  H02M7/797 ,  H05K7/1432 ,  H05K7/20927

    摘要： An electric power converter is provided with: a power semiconductor module, which has a power semiconductor element that converts a direct current into an alternating current; a capacitor module, which has a capacitor element that smooths the direct current; and a cooling body, which cools the power semiconductor module and the capacitor module. The capacitor module has a case, which has an approximately rectangular shape, has an opening formed in one surface, and has a space for housing the capacitor element; and a DC conductor for electrically connecting the power semiconductor element and the capacitor element to each other. The cooling body is formed to face the bottom surface on the inner wall of the case, and both the side surfaces of the case, the side surfaces facing each other. Between the capacitor element and the inner wall surfaces of the case, the direct current conductor is formed along the bottom surface and both the side surfaces of the case.

    摘要翻译： 电力转换器具有：功率半导体模块，具有将直流电转换为交流电的功率半导体元件; 电容器模块，其具有使直流平滑的电容器元件; 以及冷却功率半导体模块和电容器模块的冷却体。 电容器模块具有大致矩形形状的壳体，具有形成在一个表面上的开口，并且具有用于容纳电容器元件的空间; 以及用于将功率半导体元件和电容器元件彼此电连接的DC导体。 冷却体形成为面对壳体的内壁上的底面，并且壳体的两侧表面彼此面对。 在电容器元件和壳体的内壁表面之间，直流导体沿壳体的底表面和两个侧表面形成。

    Power Inverter
    27.
    发明申请
    Power Inverter 有权
    电源逆变器

    公开(公告)号：US20120170217A1

    公开(公告)日：2012-07-05

    申请号：US13419884

    申请日：2012-03-14

    申请人： Fusanori Nishikimi ,  Kinya Nakatsu

    发明人： Fusanori Nishikimi ,  Kinya Nakatsu

    IPC分类号： H05K7/20

    CPC分类号： H02M7/5387 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H02M7/003 ,  H02M7/219 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

    摘要翻译： 在电力逆变器中，将冷却剂通道固定到底盘以冷却底盘; 通过在所述底盘中设置所述冷却剂通道将所述底盘分成第一区域和第二区域; 功率模块设置在固定到冷却剂通道的第一区域中; 电容器模块设置在第二区域中; 并且电容器模块的直流端子直接连接到电源模块的直流端子。

    Power Semiconductor Module for Inverter Circuit System
    30.
    发明申请
    Power Semiconductor Module for Inverter Circuit System 有权
    用于逆变器电路系统的功率半导体模块

    公开(公告)号：US20110069455A1

    公开(公告)日：2011-03-24

    申请号：US12886904

    申请日：2010-09-21

    申请人： Takeshi TOKUYAMA ,  Kinya Nakatsu ,  Ryuichi Saito

    发明人： Takeshi TOKUYAMA ,  Kinya Nakatsu ,  Ryuichi Saito

    IPC分类号： H05K7/20

    CPC分类号： H01L25/115 ,  H01L23/473 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M7/003 ,  H02M7/81 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A double-face-cooled semiconductor module with an upper arm and a lower arm of an inverter circuit includes first and second heat dissipation members, each having a heat dissipation surface on one side and a conducting member formed on another side through an insulation member. On the conducting member on the first dissipation plate is provided with a fixing portion that fixes a collector surface of the semiconductor chip and a gate conductor connected to a gate terminal of the semiconductor module. The gate electrode terminal and the gate conductor are wire bonded. The conducting member on the second heat dissipation member is connected to an emitter surface of the semiconductor chip connected to the first heat dissipation member. The productivity and reliability are improved by most of formation operations for the upper and lower arms series circuit on one of the heat dissipation member.

    摘要翻译： 具有逆变器电路的上臂和下臂的双面冷却半导体模块包括第一和第二散热构件，每个散热构件具有一侧的散热面和通过绝缘构件形成在另一侧的导电构件。 在第一散热板上的导电部件上设置有固定部分，该固定部分固定半导体芯片的集电极表面和连接到半导体模块的栅极端子的栅极导体。 栅电极端子和栅极导体线接合。 第二散热构件上的导电构件连接到连接到第一散热构件的半导体芯片的发射极表面。 通过在散热构件之一上的上下臂系列电路的大多数形成操作来提高生产率和可靠性。