公开(公告)号：US20190031095A1

公开(公告)日：2019-01-31

申请号：US16149540

申请日：2018-10-02

Applicant: The Boeing Company

Inventor： Jeff Duce ,  James Schalla ,  Ashley House ,  Jason Turner

IPC: B60Q3/74 ,  B60Q3/47 ,  B60Q3/43 ,  F21S43/00 ,  B64D47/02 ,  H01L33/48 ,  H01L33/62 ,  B60Q3/51 ,  H05K1/18 ,  H05K1/02 ,  H05K3/12 ,  H05K3/14 ,  H05K3/28

Abstract: Lighting panels and methods of manufacturing lighting panels are described. An example lighting panel includes a substrate that has a planar surface, electrically conductive traces printed onto the planar surface of the substrate, and light sources mounted onto the electrically conductive traces at mounting positions such that the electrically conductive traces form an electrical interconnection between selected ones of the electrically conductive traces and associated ones of the light sources. The lighting panel also includes a polymer sheet provided over the light sources, and a composite base upon which a stack-up of the substrate with the printed electrically conductive traces, the light sources, and the polymer sheet is applied. The light sources are embedded into the composite base and are also flush with a top surface of the stack-up, and the substrate is also embedded into the composite base underneath the light sources at the mounting positions.

公开(公告)号：US20180036922A1

公开(公告)日：2018-02-08

申请号：US15228152

申请日：2016-08-04

Applicant: THE BOEING COMPANY

Inventor： Joseph D. Walters ,  Michael J. Cloud ,  Jason Turner ,  Mitchell Z. Kotlik ,  Andrew A. Pillar ,  Michael B. Black

IPC: B29C43/36 ,  B29C43/18 ,  B29C43/56 ,  B29C70/78

CPC classification number: B29C43/36 ,  B29C43/183 ,  B29C43/184 ,  B29C43/56 ,  B29C2043/3602 ,  B29C2043/3605 ,  B29C2043/563 ,  B29K2105/256 ,  B29L2009/00 ,  B29L2031/3076

Abstract: An apparatus includes a matched die mold including a male die mold and a female die mold wherein the male die mold includes a first contoured surface and the female die mold includes a second contoured surface. The apparatus further includes a frame which defines an opening wherein the frame is positioned between the male die mold and the female die mold such that the frame is adapted to position a film layer across the opening and the opening is positioned in alignment with at least one of the first contoured surface and the second contoured surface.

公开(公告)号：US09736888B2

公开(公告)日：2017-08-15

申请号：US14656220

申请日：2015-03-12

Applicant: The Boeing Company

Inventor： Jeffrey L. Duce ,  Joseph A. Marshall, IV ,  Ashley House ,  Jason Turner

IPC: H05B1/02 ,  F24H9/18 ,  F24D13/02 ,  H05B3/20 ,  H01C17/02 ,  H01C17/075 ,  H05B3/18 ,  H05B3/06 ,  H05B3/34

CPC classification number: H05B1/0236 ,  F24D13/022 ,  F24D2200/08 ,  F24D2220/2081 ,  F24H9/1872 ,  H01C17/02 ,  H01C17/075 ,  H05B1/0238 ,  H05B3/06 ,  H05B3/18 ,  H05B3/20 ,  H05B3/34 ,  H05B2203/013 ,  H05B2203/017 ,  H05B2203/02 ,  H05B2203/026 ,  H05B2203/029 ,  H05B2206/023 ,  Y02B30/26

Abstract: Described herein is a composite panel that includes a first layer made from an electrically non-conductive material. The composite panel also includes a resistance heater printed onto the first layer. Further, the composite panel includes a second layer adjacent the resistance heater, the resistance heater being positioned between the first layer and the second layer. The second layer is made from an electrically non-conductive material.